The invention provides a three-dimensional stacked packaging substrate device and a manufacturing method, and relates to the technical field of
semiconductor packaging, and the three-dimensional stacked packaging substrate device comprises a substrate which is a multi-layer stacked substrate; a drop point area corresponding to the vertical
interconnection terminal is provided with a
backflow channel, and the
backflow channel comprises a grounding via hole array or a grounding
metal ring surrounding the drop point area and is used for providing a continuous reference loop for a high-speed
signal transmitted through the vertical
interconnection terminal. Providing a core plate, carrying out multi-layer lamination, and manufacturing a
backflow channel in a corresponding vertical
interconnection terminal drop point area; manufacturing blind holes or
micro holes in the substrate to realize interlayer interconnection; the substrate is divided into a high-speed digital area, an analog /
radio frequency area and a power supply area according to functions for partition wiring, and the
ground plane of each partition is kept continuous; a decoupling device is arranged at the near end of the vertical interconnection drop point or the
chip power supply inlet. The
system has the beneficial effects that low reflection,
low jitter and low
bit error rate of high-speed
signal transmission are realized, and the
electromagnetic compatibility and the working reliability of the
system are improved.