2475 results about "Radiation effect" patented technology

The invention provides an adaptive management method for the power consumption of a data center. The method comprises the following steps of: partitioning a computer room according to functions of each part, arranging N+1 precision air conditioners in each function area, and sorting by priority according to the importance of a refrigerating action; adjusting the power consumption of a server in real time by using monitoring software according to a service load in the computer room; accomplishing generation of an air conditioner adjustment strategy with the help of a computational fluid dynamics (CFD) simulation computed result; and controlling the air conditioners of the computer room by using a fuzzy neural network control strategy. By the method, an optimum value can be achieved under the conditions of good radiation effect and low energy consumption.

The present invention provides methods of using metal nanoparticles 0.5 to 400 nm in diameter to enhance the dose and effectiveness of x-rays or of other kinds of radiation in therapeutic regimes of ablating a target tissue, such as tumor. The metal nanoparticles can be administered intravenously, intra-arterially, or locally to achieve specific loading in and around the target tissue. The metal nanoparticles can also be linked to chemical and / or biochemical moieties which bind specifically to the target tissue. The enhanced radiation methods can also be applied to ablate unwanted tissues or cells ex vivo.

Provided is a lighting apparatus using light emitting diodes (LEDs) having a lateral heat radiation unit structure that can maximize heat radiation effect by employing an air vent structure causing atmospheric pressure difference between both side ends of an air circulation path. The lighting apparatus comprising a housing having a power supply accommodation space therein, a heat radiation unit that comprises an LED module accommodation groove that is installed on the top of the housing and having at least one inclined surface or mounting surface on which the LED module is mounted, and a number of fins that are formed on the outer circumferential surface of the LED module accommodation groove, an air circulation path that is lengthily formed between the housing and the heat radiation unit.

A virtual grid imaging method capable of eliminating scattered radiation effect and an imaging system thereof are provided. The method is mainly applicable for imaging with high energy rays, in which scattered rays reaching a surface of a detector are not filtered, and data of the scattered rays and straight rays are all sampled, and then, separation and inhibition of scattered ray component are performed for the sampled data, thereby eliminating the scattered ray component in the resulted image. The method particularly includes the following steps: (1) decomposing a digital image into multi-band images from high to low according to frequencies; (2) performing de-scattering process for low-frequency band images; (3) performing contrast enhancement process for high-frequency band images; and (4) merging the images of various frequency bands processed in the step (2) and the step (3), and forming an output image. Experiment shows that, in digital X-ray imaging, the present invention can obviously eliminate the scattered radiation effect, and meanwhile significantly reduce the dosage of the rays, in which only one third of the required dosage of a common grid is used to obtain the same image brightness.

A thermocured, heat conductive and heat radiating paint for an LED lamp is prepared by the following raw materials by weight: 40-45 parts of polyacrylic resin, 5-8 parts of polyurethane resin, 4-6 parts of polyacrylamide, 6-8 parts of isophorone diamine IPDA, 20-24 parts of xylene, 2-3 parts of silane coupling agent KH550, 1-2 parts of aluminium powder, 8-12 parts of ethyl acetate, 2-4 parts of benzyltrimethylammonium tribromide, 10-12 parts of aluminium nitride, 2-3 parts of beryllia, and 4-5 parts of film forming auxiliary agent. Aluminium nitride powder, the beryllia and the aluminium powder are added, so as that the paint has high heat conduction rate and good heat radiation effect, and can be long-term used under 200 DEG C without change of mechanical property; polyacrylic resin is used, so as that the paint has advantages of excellent fullness, glossiness, hardness, solvent resistance and weatherability, without color change and brightness reversion when high temperature baked; and the paint has advantages of large adhesion stress, not-easy shedding, aging resistance and long usage life.

The invention provides a graphene radiation material, which comprises more than one layer of graphene radiation film. Each graphene radiation film comprises a support layer, a graphene layer and a bonding layer, which are combined with one another, wherein the graphene layer is positioned between the support layer and the bonding layer, and comprises more than one layer of graphene or graphene composite material with a mono-molecule thickness. The invention also provides a preparation method for the graphene radiation material and the use of the graphene radiation material. The material has a high heat-conducting property; and by the material, the radiation effect of an electronic product can be improved, the temperature of the electronic product can be reduced, the use comfort of a user can be improved, the reliability of the electronic product can be improved, and the service life of the electronic product can be prolonged. The graphene radiation films have remarkable cooling effects; and moreover, an industrial preparation method can be adopted, so that cost is greatly decreased, and automatic production is realized. The graphene radiation material can be widely applied to equipment such as smart phones, tablet personal computers, notebooks and the like with small spaces and high radiation requirements.

The invention relates to an LED (Light Emitting Diode) surface patch type encapsulating structure based on a silicon base plate, which comprises the silicon base plate, an LED chip, a circular ring convex wall and a lens, wherein the upper surface of the silicon base plate is a plane structure, an oxidation layer is covered on the upper surface of the silicon base plate, a metal electrode layer is arranged on the upper surface of the oxidation layer, the upper surface of the metal electrode layer is provided with metal convex points, a through hole penetrating through the silicon base plate is arranged below the metal electrode layer, an insulation layer covers the inner wall of the through hole and the partial lower surface of the silicon base plate, a metal connecting layer covers the surface of the insulation layer in the through hole, two electric conducting metal welding discs are respectively arranged at the lower surface of the silicon base plate and are insulated from the silicon base plate, a heat conducting metal welding disc is arranged at the lower surface of the silicon base plate, the LED chip is inversely arranged on the silicon base plate, and the LED chip and the metal electrode layer in the LED chip are isolated from the outside through the circular ring convex wall and the lens. The encapsulating structure has the advantages of good heat radiation effect and small size, also has high reliability because of no gold thread encapsulation, realizes the wafer level mass production encapsulation and hereby reduces the encapsulation cost.

This invention relates to a LED light which can improve heat radiation effect. The light comprises a lamp body (1), a lamp body bottom cap (3), or a lamp body face cap (2), wherein the lamp body (1) can integrate the lamp body bottom cap (3) or the lamp body face cap (2) into a whole; the light also comprises a circuit which ha LED (4), electronic component and corresponding normal PCB printed circuit board (5); the circuit is in the lamp body or in the inner cavity of the lamp body bottom cap (3) or in the lamp body face cap (2); the printed circuit board has the corresponding filling hole with the LED (4), the LED pipe heat sink (7) will pass through the filling hole (6) and contact with the lamp body bottom cap (3) or lamp body (1) or lamp body face cap (2), forming the heat emission channel of the LED (4). By said invention, it can emit heat directly to air or water or earth.

The invention discloses a down lamp. The down lamp is characterized in that the down lamp comprises a heat radiation cylinder body; a reflecting cover is connected with the upper end of the heat radiation cylinder body; a plurality of heat radiation fins are arranged on the outer wall of the heat radiation cylinder body; a heat radiator main body capable of rotating relative to the heat radiation cylinder body is arranged in the heat radiation cylinder body; a cavity is arranged in the heat radiator main body; heat radiation fins are distributed on the inner wall of the heat radiator main body evenly; a plurality of heat radiation sheets capable of huddling up on the heat radiator main body are arranged on the outer wall of the heat radiator main body; a plurality of guide grooves are formed in the heat radiation cylinder body; the heat radiation sheets are arranged in the guide grooves; an installing groove is formed in the upper end portion of the heat radiator main body; an LED chip is arranged in the installing groove. According to the down lamp, shortcomings in the prior art are overcome; the down lamp is simple in structure; a heat radiator can be unfolded, so that the down lamp is good in heat radiation effect and convenient to assemble and disassemble.

A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

The invention discloses a system for partitioned heat management based on a lithium ion battery pack. The system comprises a box body and a battery pack, wherein the battery pack is arranged in the box body and consists of a plurality of single square lithium ion batteries which are vertically arranged in parallel; a liquid inlet pipe with a flat pipe cross section is arranged at the outer side of a positive electrode lug of each single square lithium ion battery above the battery pack; a liquid outlet pipe with a flat pipe cross section is arranged at the outer side of a negative electrode lug of each single square lithium ion battery above the battery pack. The system has the advantages that the structure is simple, and the cost is low; by adopting a partitioned heat management method, a phase change material and liquid cooling are combined, the active and passive types are combined, the heat radiation, heating and heat insulation functions are realized, the accurate control on temperature in the square lithium ion battery pack is realized, the better heat radiation effect is realized, and the heat safety of the battery pack is guaranteed; the safety of the battery is effectively improved, and the service life of the battery is prolonged; the long-time efficient running of the battery heat management system is guaranteed, and the economy of the heat management system is improved.

An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

An ornament plate of a ring-shape made of a metal with a high heat radiation effect, for instance, aluminum, is attached to an end surface on an object side of a lens barrel such that the ornament plate covers the whole front part of the lens barrel. Four kinds of LEDs of high luminance type constructing an LED light source are attached to the lens barrel through the ornament plate used as a substrate. A light diffusion cover made of a transparent resin is attached to the front of the ornament plate for covering the LEDs. When using the flash, a high voltage current is applied to the LEDs to emit flash light. Each LED generates heat. However, the heat is radiated through the ornament plate.

The invention discloses a method for making an LED (Light Emitting Diode) light source module and a product made by the method, solving the problems of poor heat radiation effect, low production efficiency and poor consistency of the existing LED light resource modules. The method for making an LED light resource module comprises the following steps of: preparing a metal core PCB (Printed Circuit Board); processing the metal core PCB; and arranging an LED chip in the chip placing part of the metal core PCB; connecting circuit layers; and injecting colloid. The light source module made by the method of the invention comprises the metal core PCB, at least one LED chip arranged on the metal core PCB and the packaged colloform covering the LED chip and the metal core PCB and has an integral structure. The method of the invention has high production efficiency and can realize complete automation mass production. The LED light source module of the invention has the advantages of good heat radiation effect, low cost, ingenious structure, good consistency and adjustable optical visual angle range.

A technique that can make a heat radiation effect higher and makes even a transmission voltage of an ultrasonic diagnostic apparatus higher and then makes a diagnostic depth deeper is disclosed. According to this technique, an ultrasonic probe has: a plurality of piezoelectric elements 1 which are long in an X-direction, are arrayed in a y-direction and transmit and receive ultrasonic waves in a z-direction (diagnostic depth direction); a plurality of ground electrodes 2 and signal electrodes 3 which are placed on the front surfaces and the rear surfaces of the individual piezoelectric elements, respectively; a plurality of signal electrodes 4 for extracting respective signals from the individual signal electrodes; a backing load member 5 which has a function for mechanically holding the piezoelectric elements through the signal electrodes and attenuating the unnecessary ultrasonic signal as necessary; a plurality of sheet-shaped heat conduction members 6 which are embedded inside the backing load member and positively transmit the heat generated from the piezoelectric elements; and a heat radiating block 7 which is linked to the heat conduction members on the rear side of the backing load member and radiates the heat transmitted through the heat conduction members.

The invention relates to a system and method for the online testing of a radiation effect of a modular digital integrated circuit, and the system enables all needed function circuits in the effect testing to be divided into relatively independent modules on the basis of summarizing the similarities and differences of conventional digital integrated circuit radiation effect online testing systems. The electrical and mechanical connection among the modules, the design in the modules and the mechanical structure of a system board respectively employ conventional industrial standards, thereby achieving a purpose that a system can employ a commercial module or an independently developed modular for quick connection, enabling the system to be better in expandability, and saving the design time and cost of hardware. The method can be used for the majority of the online testing of the radiation effect of digital integrated circuits of bullets and satellites. The system plays an important role in standardizing a national radiation effect online testing system.

The invention provides an outdoor distribution box, and relates to the electric power equipment technical field; the outdoor distribution box comprises a mounting plate; a pedestal is fixed on the topof the mounting plate; a holder is arranged on the pedestal top; the holder bottom and the pedestal top are fixedly connected through a damping spring; a support, a coiling motor, a coiling reel, a heat radiation chamber, a slide block, a heat radiation motor, fan blades, an air-out filter screen, a stay rope, a guide bar and a guide wheel are matched; when the heat radiation motor starts, the coiling reel on the output end makes back and forth reciprocating motions so as to wind up or release the stay rope; driven by the stay rope, the slide block drives the heat radiation motor so slide upand down on the right side of the box body inner wall; in addition, the heat radiation motor drives the fan blades to blow cool airs so as to dissipate the electric facilities in the box body, thus forming uninterrupted cold-hot circulations in the box body, and providing good heat radiation effect; the air circulation is good for moistureproof effect in the box body, thus ensuring the power equipment in the distribution box body to stably operate.

A sealed housing is provided with a body, a cover, and a movable fin for radiating heat while suppressing a change in internal pressure, and preventing invasion of water vapor or poisonous gas from the exterior to thereby avoid an accident caused by dew condensation, and corrosion of an electrical circuit component. The movable fin automatically slides toward the inside or outside of the sealed housing depending on a change in internal atmospheric pressure of the sealed housing following a change in internal temperature thereof. When the temperature inside the sealed housing rises due to heat from the electrical circuit component mounted in a package inside the sealed housing, a heat radiation area of the movable fin increases while keeping sealing tightness so that a heat radiation effect can be enhanced.

The present invention provides a liquid crystal display device having a linear light source, which is easily treated, in consideration of the heat radiation of a light-emitting diode in the liquid crystal display using the light-emitting diode as a light source.A light-emitting diode 150 is provided on a metal substrate 161. The metal substrate 161 is formed in a case shape such that the heat generated at the light-emitting diode 150 received in the case is efficiently radiated. A resin material 175 is filled in the metal case to form a plate-shaped light source 130. It is possible to improve reliability during the handling in the manufacturing process by filling the resin material 175 to form the plate-shaped light source. It is possible to improve heat radiation effect by filling the resin material 157.

A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

The invention discloses an intelligent machine antenna with a metal frame, wherein the intelligent machine antenna can cover seven frequency bands. The intelligent machine antenna divides the metal frame into a plurality of parts through outage seams and short-circuited connectors. Seam resonance between parts of the separated metal frame and a metal floor can be used for covering low-frequency frequency bands such as GSM850 / 900, and a triple resonance mold corresponding to the seam resonance can be used for covering high-frequency frequency bands such as LTE2300 / 2500; meanwhile, the separated metal frame can be taken as distributed single-pole sub branches and used for covering high-frequency frequency bands such as GSM1800 / 1900, an internal excitation unit can also produce resonance characteristics acting on the high-frequency frequency bands such as GSM1800 / 1900 and UTMS2100, and accordingly the bandwidth of metal frame radiation is complemented, and the multi-system seven-frequency-band radiation effect of the antenna with the metal frame is achieved. Resonance produced by a couple metal ring is involved in antenna radiation, resonance size pressure needing to be borne by the printed antenna is shared to a great extent, and the antenna is suitable for being used and popularized in the technical field of terminal antennas.

More efficient radiation of heat from a point-like light source is enabled, and thinning is promoted, while higher and more uniform brightness of a planar illumination device is accommodated. A radiation path is formed through which the heat generated from the point-like light source is transmitted to a radiator plate made of metal through an electrode terminal of the point-like light source, a land portion of a front side face of an FPC, a through hole of a conductor pattern, and a high heat-conductive resin. The radiation path for efficient radiation from a conductor pattern of the FPC to the radiator plate made of metal is extended, and direct radiation area is sufficiently ensured. Particularly even if a large-current type LED is used for the point-like light source, sufficient radiation effect can be obtained. Also, since freedom in wiring pattern on the FPC and freedom of outline are not different from a conventional FPC at all, a demand for thinning of the planar illumination device can be sufficiently satisfied.

The invention provides electric power equipment used for a security system. The electric power equipment comprises an external cabinet body, an internal cabinet body and a top cap. Heat radiating fins are arranged on the internal side wall of the internal cabinet body. The heat radiating fins include a primary heat radiating fin. Multiple secondary heat radiating fins are evenly arranged on the primary heat radiating fin. Multiple tertiary heat radiating fins are evenly arranged on the secondary heat radiating fins. An annular water chamber is arranged at the lower part between the external cabinet body and the internal cabinet body. A water insulating plate is arranged at the top part of the annular water chamber. A water inlet is arranged at the upper part of the annular water chamber, and a water outlet is arranged at the lower part. The water inlet and the water outlet are connected through a circulating pipe. A water refrigerator is arranged on the circulating pipe. A temperature sensor and a heat radiating fan are arranged at the internal top part of the internal cabinet body. The beneficial effects of the electric power equipment used for the security system are that damage of water vapor to the internal parts and components of the cabinet body can be avoided by arrangement of the top cap; and the heat radiating mode is selected according to the temperature so that intelligent heat radiation selection can be realized, the heat radiation effect can be effectively guaranteed and energy can be saved.

The invention discloses a single event radiation effect resistant reinforced latch circuit. The single event radiation effect resistant reinforced latch circuit comprises a first transmission gate unit, a second transmission gate unit, a Schmitt inverter, a conventional input separation inverter, a first input separation clock-controlled inverter, a second input separation clock-controlled inverter, a delay circuit and a MullerC unit circuit. When the single event radiation effect resistant reinforced latch circuit operates under a transparent mode, a hysteresis effect of the Schmitt inverter and a delay difference of a latch interior unit are effectively used and SET pulses from a combinational logic unit are shielded through the MullerC unit; when the single event radiation effect resistant reinforced latch circuit operates under a latch mode, any interior node generating SEU due to the irradiation effect can be recovered through states of other nodes through a DIC unit structure having a self-recovery capability and correct output of the latch is guaranteed; accordingly the single event radiation effect resistant reinforced latch circuit has the advantages of effectively eliminating the radiation effect influences and being applicable to a clock gating circuit and small in power consumption and area costs.

The invention discloses an LED (light emitting diode) two-dimensional array light source with a flexible circuit substrate. The LED two-dimensional array light source comprises a plurality of LED chips or packaged LED light beads. The LED two-dimensional array light source is characterized by also comprising the flexible circuit substrate, wherein the flexible circuit substrate is provided with an electric conducting material with electric conducting patterns; solder mask layers are printed on the flexible circuit substrate to form a plurality of binding regions; the LED chips or the light beads are directly pasted on the binding regions, and are connected and conducted mutually through the electric conducting patterns; and array-type through holes are formed on the flexible circuit substrate. The invention provides the LED two-dimensional array light source with the flexible circuit substrate, a curve surface LED array light source type is solved, at the same time, the LED light source heat radiation effect is improved by the flexible circuit substrate and an array-type through-hole technology, thus the heat radiation capability and light dipping efficiency of a luminous light source are improved greatly, the service life is prolonged, the LED two-dimensional array light source with the flexible circuit substrate is more suitable for automatic production so as to be used by public consumers.

An IO extension module used on blade server is prepared as using base plate of basket shaped shell as host board being set with insertion slot, setting connector on front end of cabinet, connecting connector to medium plate connected with calculation blade, connecting said insertion slot to relevant calculation blades separately through medium plate and setting fan at middle part of server cabinet for providing excellent heat radiation effect.

The invention belongs to the technical field of advanced manufacturing, and relates to an electrojet 3D printing device and method based on the combination of an electric field and a heat field. According to the method, in the process of electrojet 3D micro-nano printing under the combined action of the electric field and the heat field, ink reaches an opening of a spray needle at the constant flow speed under the combined action of the fluid field and the gravity field, then the ink is drawn through electric field shear force between the spray needle and a substrate so as to form stable micro-nano flow with the size far smaller than the size of a spray hole, a solvent in the ink is promoted to evaporate in an accelerated mode through the heat radiation effect of the heat field on the ink, and finally jet flow is stacked on the substrate layer by layer, so that a 3D structure with the micro-nano dimension is formed. Compared with a drop-jet type printing technique, the electrojet 3D printing method based on the combination of the electric field and the heat field has the advantages that the material adaptability is high, and complex micro-nano 3D structures can be manufactured.