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1490 results about "High radiation" patented technology

Single particle upset and single particle transient pulse resisiting D trigger

InactiveCN101499788ASingle event upsetCapable of single-event transient pulse performanceSingle output arrangementsElectronic switchingMultiway switchingRadiation resistance
The invention relates to a D trigger used for single particle upsetting resistance and single particle transient pulse in the technical filed of an integrated circuit, comprising two multichannel switches, two delay circuits, two protecting gate circuits and three inverters; wherein, the multichannel switches are used for forming a feedback loop for latching data; the delay circuits are used for generating signals in delay modes; the protecting gate circuits are used for filtering voltage transient fluctuation of the input signals; in the feedback loop of the D trigger, data input signal D and the delayed mode thereof enter the protecting gate circuit; and the output signals of the protecting gate circuit filter the delayed voltage transient fluctuation of the data input signal D and the width of the voltage transient fluctuation is not wider than the delay of the delay circuit. The invention can be applied to application occasions needing higher radiation resistance, leads the single particle upsetting resistance and single particle transient pulse performance of D trigger to reach the same level as a time sampling D trigger; and simultaneously, the increasing of the unit area is less than that of the time sampling D trigger and the working speed is superior to that of the time sampling D trigger.
Owner:SHANGHAI JIAO TONG UNIV

Graphene radiation material, and preparation method and application thereof

The invention provides a graphene radiation material, which comprises more than one layer of graphene radiation film. Each graphene radiation film comprises a support layer, a graphene layer and a bonding layer, which are combined with one another, wherein the graphene layer is positioned between the support layer and the bonding layer, and comprises more than one layer of graphene or graphene composite material with a mono-molecule thickness. The invention also provides a preparation method for the graphene radiation material and the use of the graphene radiation material. The material has a high heat-conducting property; and by the material, the radiation effect of an electronic product can be improved, the temperature of the electronic product can be reduced, the use comfort of a user can be improved, the reliability of the electronic product can be improved, and the service life of the electronic product can be prolonged. The graphene radiation films have remarkable cooling effects; and moreover, an industrial preparation method can be adopted, so that cost is greatly decreased, and automatic production is realized. The graphene radiation material can be widely applied to equipment such as smart phones, tablet personal computers, notebooks and the like with small spaces and high radiation requirements.
Owner:深圳市爱诺菲科技有限公司

Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom

The present invention relates to radiation, preferably light emitting, devices with a high radiation emission efficiency and to fabricating these as small devices in an array of such devices. In one embodiment, the emitting devices can be placed in dense arrays. In another embodiment, outcoupling efficiency of the devices is improved, which leads to a reduced power consumption for a given radiation output power. In another embodiment, the speed of the radiation is increased, hence the serial bandwidth per optical channel is increased. The invention further relates to light emitting devices that exhibit uniform radiation emission characteristics. The light emitting devices (diodes, LEDs) of the present invention can be used for applications wherein two-dimensional LED arrays, particularly low-power arrays, are useful, such as in display technology. Active matrix displays relying on liquid crystals (e.g. integrated on CMOS circuitry) could be replaced by LED arrays. Dense and bright one-dimensional LED arrays are useful for example for printing and copying. Also for single LED applications it is important to have a maximum of photons escaping from the light emitting surface. The intensity of light per unit area (the brightness) is larger, and this is useful in many applications. Furthermore, the packaging cost can be reduced. In order to achieve a large global efficiency, many conventional LEDs need an elaborate package that includes a cavity with mirrors, because the light is emitted from more than one surface of the LED.
Owner:SIGNIFY HLDG BV

Method for manufacturing embedded high-conductivity printed circuit board (PCB)

The invention discloses a method for manufacturing an embedded high-conductivity printed circuit board (PCB). The method comprises the following steps of 1, providing a plurality of PCB core boards and prepregs; 2, pre-slotting on the PCB core boards and the prepregs, slotting at positions where conductive materials are to be embedded on the PCB core boards and the prepregs, and respectively forming slots, wherein the core boards and the prepregs have matched positioning holes; 3, providing the conductive materials and manufacturing conductive elements by using the conductive materials; 4, placing the conductive elements in the slots of the PCB core boards and the prepregs for laminating the conductive elements into PCB multi-layer boards which have component faces and welding faces; 5, laminating the plurality of PCB core boards and prepregs to manufacture PCB multi-layer boards and fixing the conductive elements in the slots by using resins; 6, performing degumming on the surfaces of the PCB multi-layer boards and the conductive elements; and 7, processing the PCB multi-layer boards after degumming to obtain PCB finished products. The method has the advantages of simple manufacturing flows and realization of high radiation, high-speed signal transmission and the like by embedding the conductive materials into the PCB in a laminating manner and matching the conductive materials with the thickness of the PCB.
Owner:DONGGUAN SHENGYI ELECTRONICS

Miniaturization substrate integrated multi-beam antenna

The invention relates to a miniaturization substrate integrated multi-beam antenna which comprises a metal copper-clad upper layer, a dielectric layer and a metal copper-clad lower layer which are sequentially laminated from top to bottom, wherein the metal-clad upper layer comprises a feed upper meter area, a multi-mode upper meter area and N groups of triangular upper meter areas which are sequentially arrayed from the input end to the radiation end; the multi-mode upper meter area is connected with the feed upper meter area; the N groups of triangular upper meter areas are connected with the multi-mode upper meter area; the metal copper-clad lower layer comprises a feed lower meter area, a multi-mode lower meter area and N groups of triangular lower meter areas; the feed lower meter area, the multi-mode lower meter area and the N groups of triangular lower meter areas are sequentially arrayed from the input end to the radiation end; the multi-mode lower meter area is connected with the feed lower meter area; the N groups of triangular lower meter areas are connected with the multi-mode lower meter area; and the dielectric layer is internally provided with N+1 rows of metallized through holes which penetrate through the feed upper meter area and the dielectric layer and are connected with the feed lower meter area as well as penetrate through the feed upper meter area and the dielectric layer and are connected with the multi-mode lower meter area. The invention has the benefit that a multi-beam antenna structure is compact, thus higher radiation efficiency is acquired.
Owner:CHENGDU RDW TECH CO LTD

Antenna control system and method of phased array radar

The invention discloses an antenna control system and method of a phased array radar, and belongs to the technical fields of radio orientation, radio navigation, radio wave range finding or velocity measurement, positioning or existence detection via reflection or re-radiation of radio waves, and similar devices with other waves. The system comprises an antenna array module, an array plane selector switch module, a transmitting-receiving amplifier and filter module, a phase shifter and power divider module, a GPS/BD positioning module, an attitude sensor module, a control and power supply module and a wave beam oriented automatic control module. The system and method can satisfy the requirements of minimization, low power consumption, high radiation efficiency and high isolation degree. Compared with a traditional phased array configuration system, the number of RF transmitting-receiving channels is reduced to 1/5, the power consumption is reduced to 1/5 correspondingly, a switch linephase shifter is used, the phase delay within the work bandwidth satisfies the time delay characteristic of a signal space, and different frequency points are directed accurately; all machinery related equipment is omitted; and the total power consumption is reduced greatly.
Owner:西安欣创电子技术有限公司

Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof

The invention discloses a multi-ring-arranged double-integrated circuit (IC) chip packaging piece and a production method thereof. The multi-ring-arranged double-IC chip packaging piece comprises a multi-ring quad flat no (QFN) lead frame with a carrier, an internal pin, IC chips and a plastic package body. The production method comprises the following steps of: thinning; scribing; adding the chips primarily; performing pressure welding; inversely adding the chips secondarily; filling the bottom and solidifying; performing plastic packaging and post solidifying; printing; separating pins; electroplating; separating products; testing the products; packing; and warehousing. Compared with a single-row lead frame with the same area as the multi-ring QFN lead frame, the multi-ring QFN lead frame increases the pins by over 40 percent, so that the requirements of high density and multiple input/output (I/O) packages are met; the chips are inversely added, so that the packaging piece has a small number of short welding lines, a short heat conduction distance and high radiation capacity; through the inverse addition of the chips, the capacitance and the inductance between protruding points and the pins are far lower than those of the welding lines between a chip welding disc and the pins, so that the influence on high frequency application is reduced; and the thickness of a QFN can be reduced to be below 0.5mm, so that the intersection and the open circuit of the welding lines are avoided and testing qualified rate and testing reliability are improved.
Owner:TIANSHUI HUATIAN TECH +1

Hollow photonic crystal fiber gyroscope

The invention relates to a hollow photonic crystal optical fiber gyro, which is characterized in that a hollow optical fiber resonant ring coiled by hollow photonic crystal optical fibers is adopted; laser light emitted by a tunable narrow linewidth laser is divided into two equal parts by an integrated optical modulator; the two parts enter an optical coupling module respectively through two polarization-maintaining fiber couplers, then are output from the optical coupling module and injected into the hollow optical fiber resonant ring; a convex spherical mirror adopted by the optical coupling module has high reflectivity and transmissivity, and a resonant cavity for the gyro is formed between the optical coupling module and the hollow optical fiber resonant ring to realize input and output of light; a small part of harmonic light penetrates the resonant cavity and returns to two detectors respectively through two polarization-maintaining fiber couplers, frequency difference of the harmonic light in the clockwise / anticlockwise direction is measured according to signals detected by the two detectors, and the angular speed of a carrier can be obtained through a testing circuit, so as to realize the function of a gyroscopic instrument. The optical fiber gyro has the advantages of small volume, convenient realization, high reliability, high radiation-resistant capacity and suitability of space application.
Owner:BEIHANG UNIV
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