Method for manufacturing embedded high-conductivity printed circuit board (PCB)

Abstract

The invention discloses a method for manufacturing an embedded high-conductivity printed circuit board (PCB). The method comprises the following steps of 1, providing a plurality of PCB core boards and prepregs; 2, pre-slotting on the PCB core boards and the prepregs, slotting at positions where conductive materials are to be embedded on the PCB core boards and the prepregs, and respectively forming slots, wherein the core boards and the prepregs have matched positioning holes; 3, providing the conductive materials and manufacturing conductive elements by using the conductive materials; 4, placing the conductive elements in the slots of the PCB core boards and the prepregs for laminating the conductive elements into PCB multi-layer boards which have component faces and welding faces; 5, laminating the plurality of PCB core boards and prepregs to manufacture PCB multi-layer boards and fixing the conductive elements in the slots by using resins; 6, performing degumming on the surfaces of the PCB multi-layer boards and the conductive elements; and 7, processing the PCB multi-layer boards after degumming to obtain PCB finished products. The method has the advantages of simple manufacturing flows and realization of high radiation, high-speed signal transmission and the like by embedding the conductive materials into the PCB in a laminating manner and matching the conductive materials with the thickness of the PCB.

Description

technical field [0001] The invention relates to a method for manufacturing a PCB board, in particular to a method for manufacturing a PCB board with high thermal conductivity by adopting a lamination method. Background technique [0002] With the widespread use of high-frequency electronic signals, the heat generated by the components of the chip on the printed circuit board (PCB), especially the heat generated by the high-power components will cause great damage to the components, which needs to be used Heat dissipation or cooling methods help to dissipate heat energy, so it is necessary to design an effective heat dissipation method on the PCB board to dissipate the high heat generated during the operation of the chip at any time. The traditional method is to attach a large metal heat dissipation substrate on the back of the entire circuit board. Larger size increases the space occupied by the whole device. In addition, the traditional metal substrate uses a whole piece ...

AI Technical Summary

Problems solved by technology

The traditional method is to attach a large metal heat dissipation substrate on the back of the entire circuit board. Larger, increasing the space occupied by the whole device

In addition, the traditional metal substrate uses a whole piece of copper or aluminum, which not only wastes materials and has a great impact on the environment, but also the whole piece of metal has an impact on PCB high-frequency signals, which is not suitable for wireless microwave products

Images