The
composite material is mainly applied to protection and improvement of electronic devices in a high-temperature environment. (1) a
polyimide film layer; because the
polyimide film has excellent
ductility, high and low
temperature resistance, electrical insulation, cohesiveness,
radiation resistance and medium resistance, the
polyimide film can be used for a long time in a temperature range of-269 DEG C to 280 DEG C, and can reach a high temperature of 400 DEG C in a short time. The polyimide film has excellent high-
voltage-resistant insulativity, and the highest withstand
voltage of the film with the thickness of 0.1 mm is larger than or equal to 12 kv. The polyimide film can be bent and extended in various ways according to use scenes, and has no influence on material performance (2) the lowest density of the polyimide foam can reach 5.4 kg per cubic meter, and the density is far lower than that of other common materials. The high-
toughness high-temperature-resistant steel not only can bear the long-term
working temperature as high as 350 DEG C, but also can keep excellent
toughness in an environment as low as-269 DEG C. Zero VOC and
flame retardance are achieved, and good environment friendliness and
chemical stability are achieved. After the two materials are compounded and combined, better heat insulation and
temperature resistance can be achieved in the using process, meanwhile, due to the
low density of the polyimide foam, better shaping can be achieved after the insulating paint is combined and cured, and better heat conduction and heat dissipation can be achieved on the surface.