This invention discloses a method for constructing a magnetron
sputtering system, relating to the field of
vacuum coating equipment
design technology. The method includes: S1, parametric modeling to obtain the spatial potential distribution and working gas
ionization characteristic distribution within the cavity, calculating the
argon ion trajectory to determine the
sputtering area on the
target surface, and calculating the secondary
electron trajectory for damage assessment; S2, calculating target
particle transport and static film thickness distribution based on the
sputtering area; S3, calculating the dynamic film thickness distribution and
coating uniformity of the carrier plate based on the movement mode of the transport mechanism, and obtaining the
coating efficiency based on deposition time and average film thickness; S4, comparing the
coating efficiency, coating uniformity, and secondary
electron damage assessment results with preset design indicators, iteratively optimizing until the indicators are met, and outputting the optimized design parameters of the magnetron sputtering
system. This method solves the modeling and calculation
convergence problem under
strong coupling conditions of multi-
physics fields, significantly reducing the debugging cost and structural redundancy after equipment manufacturing.