Method for preparing radiating coating of light-emitting diode (LED) lamp
A heat-dissipating coating and LED lamp technology, applied in polyamide coatings, epoxy resin coatings, lighting and heating equipment, etc., can solve problems such as poor temperature resistance and aging resistance, poor heat dissipation effect, and low adhesion to substrates , to achieve good self-cleaning, excellent protection and decoration functions, and improve the effect of activity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Examples
Embodiment 1
[0011] A method for preparing a heat-dissipating coating for LED lamps, comprising the following steps: (1), preparing the following components by weight percentage, 30% of water-based silicone resin, 20% of low-molecular polyamide, and 10% of carbon nanotubes , 1% silane coupling agent KH550, 5% aluminum powder, 10% rare earth element oxide, 13% silicon nitride, 15% acetone, 1% curing agent, 2% dustproof agent and smooth agent mixture and 3% phenol; (2) Stir the above materials in a mixer at a speed of 1000 rpm for 2 hours, then heat at 90°C for 2 hours and filter.
Embodiment 2
[0013] A preparation method for a heat-dissipating coating for LED lamps, comprising the following steps: (1), preparing the following components by weight percentage, 45% of water-based epoxy resin, 20% of low-molecular polyamide, and 15% of carbon nanotubes , 3% silane coupling agent KH550, 25% aluminum powder, 10% rare earth element oxide, 13% silicon nitride, 18% acetone, 1% curing agent, 3% dustproof agent and smooth (2) Stir the above material in a mixer at a speed of 1000 rpm for 2 hours, then heat it at 80°C for 2 hours and filter it.
Embodiment 3
[0015] A method for preparing a heat-dissipating coating for LED lamps, comprising the following steps: (1), preparing the following components by weight percentage, 60% of water-based polyurethane resin, 20% of low-molecular polyamide, 20% of carbon nanotubes, 5% silane coupling agent KH550, 40% aluminum powder, 10% rare earth element oxide, 13% silicon nitride, 20% acetone, 2% curing agent, 5% dustproof agent and smoothing agent The mixture and 5% phenol; (2) Stir the above materials in a mixer at a speed of 1000 rpm for 2 hours, then heat at 90°C for 2 hours and filter.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com