Preparation method of heat-dissipation coating for LED (Light Emitting Diode) lamps

A technology of heat-dissipating coatings and LED lights, applied in the direction of coatings, etc., can solve the problems of low adhesion of substrates, inconvenient operation, poor temperature resistance and aging resistance, etc., and achieve excellent protection and decoration, convenient construction, and convenient use Effect

Inactive Publication Date: 2012-11-14
HUASU QINGDAO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the thermal conductive adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation e

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0015] Example 1

[0016] The following components are prepared by weight percentage, 30% silicone resin, 40% butyl acetate, 5% nano silicon dioxide, 40% aluminum nitride, 15% beryllium oxide, 1% curing agent and 0.5 % Dustproof agent and smoothing agent mixture are mixed together thoroughly, stirred in a mixer at 1000 rpm for 3 hours, filtered with a 200 mesh screen to remove impurities, obtained the frosted paint, and then stand; spray the heat dissipation paint The surface of the LED lamp parts (heat dissipation cup, aluminum substrate, lampshade) is cleaned with oil, decontamination; the mixed heat dissipation paint is fully stirred for 2 minutes and then poured into the spray gun; the spray gun is aimed at the LED lamp parts to be sprayed The distance between the two can be adjusted in the range of 5-20cm according to the pressure of the spray gun and the diameter of the spray gun. The pressure of the spray gun is 0.4~0.5MPa, and the diameter of the spray gun is 1.3~1.5mm. A...

Example Embodiment

[0017] Example 2

[0018] The following components are prepared by weight percentage: 40% silicone resin, 30% butyl acetate, 6% nano-silica, 30% aluminum nitride, 16% beryllium oxide, 1% curing agent and 1.5 % Dustproof agent and smoothing agent mixture are mixed together thoroughly, stirred in a mixer at 1000 rpm for 3 hours, filtered with a 200 mesh screen to remove impurities, obtained the frosted paint, and then stand; spray the heat dissipation paint The surface of the LED lamp parts (heat dissipation cup, aluminum substrate, lampshade) is cleaned with oil, decontamination; the mixed heat dissipation paint is fully stirred for 2 minutes and then poured into the spray gun; the spray gun is aimed at the LED lamp parts to be sprayed The distance between the two can be adjusted in the range of 5-20cm according to the pressure of the spray gun and the diameter of the spray gun. The pressure of the spray gun is 0.4~0.5MPa, and the diameter of the spray gun is 1.3~1.5mm. After spra...

Example Embodiment

[0019] Example 3

[0020] The following components are prepared by weight percentage, 50% silicone resin, 20% butyl acetate, 8% nano-silica, 20% aluminum nitride, 18% beryllium oxide, 1.5% curing agent and 3 % Dustproof agent and smoothing agent mixture are mixed together thoroughly, stirred in a mixer at 1000 rpm for 3 hours, filtered with a 200 mesh screen to remove impurities, obtained the frosted paint, and then stand; spray the heat dissipation paint The surface of the LED lamp parts (heat dissipation cup, aluminum substrate, lampshade) is cleaned with oil, decontamination; the mixed heat dissipation paint is fully stirred for 2 minutes and then poured into the spray gun; the spray gun is aimed at the LED lamp parts to be sprayed The distance between the two can be adjusted in the range of 5-20cm according to the pressure of the spray gun and the diameter of the spray gun. The pressure of the spray gun is 0.4~0.5MPa, and the diameter of the spray gun is 1.3~1.5mm. After spra...

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PUM

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Abstract

The invention relates to a preparation method of a heat-dissipation coating for LED (Light Emitting Diode) lamps. The preparation method comprises the following steps of: firstly preparing the following components in percentage by weight: 30-60% of silicon resin, 15-40% of n-butyl acetate, 5-10% of nanometer silicon dioxide, 13-40% of aluminum nitride, 15-20% of beryllium oxide, 1-2% of curing agent and 0.5-5% of dust preventive and smoothing agent mixture; fully mixing the materials; fully stirring the heat-dissipation coating, then pouring the stirred heat-dissipation coating into a spray gun and aligning the spray gun at the surface of a part to be sprayed for to-and-fro spraying to ensure that the heat-dissipation coating evenly covers the surface of the part; and curing. The heat-dissipation coating for the LED lamps has the advantages of high radiation cooling performance and convenience in use, and is used for reducing the surface temperature of heat-dissipation cups, aluminum substrates, lampshades and the like in the LED lamps so as to achieve the cooling effect. The heat-dissipation coating for the LED lamps has excellent protection and decoration effects, and has the characteristics of good self-cleaning performance, water repellency, fire retardancy, insulation performance and convenience in construction besides the radiation cooling performance.

Description

technical field [0001] The invention relates to a heat dissipation coating, in particular to a preparation method of the heat dissipation coating used for LED lamps. Background technique [0002] With the rapid expansion of the scope of use of LED lamps, prolonging the service life of LED lamps has also become a problem that continues to be solved. At present, most of the thermal conductive adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps. Some manufacturers also start to select materials with higher thermal conductivity, but this will increase the production cost of LEDs. Contents of the invention [0003] The object of the present invention is to provide a metho...

Claims

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Application Information

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IPC IPC(8): C09D183/04C09D7/12
Inventor 乔振基曾兆永孙正义
Owner HUASU QINGDAO TECH
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