This invention discloses a high-temperature resistant
beryllium copper oxide alloy for switches and its preparation process. The
alloy composition, by weight percentage, includes: Be: 1.30%–1.60%, Co: 0.80%–1.20%, Ni: 0.40%–0.60%, Si: 1.80%–2.00%, Cr: 2.20%–2.50%, Al: 1.20%–1.50%, Ti: 2.30%–2.60%, Mg: 0.30%–0.50%, Zr: 0.030%–0.050%, RE: 0.022%–0.028%, Pb ≤ 0.003%, Sn ≤ 0.003%, and the total amount of other
impurity elements ≤ 0.01%, with the balance being Cu. The total amount of other unavoidable
impurity elements ≤ 0.01%, with the balance being Cu. The preparation process includes batching,
smelting, hot rolling, cold rolling, and secondary aging treatment, resulting in the in-situ formation of a dense
composite oxide film on the
alloy surface. This invention significantly improves the high-temperature strength and high-temperature
oxidation resistance of the alloy through the synergistic effect of Be-strengthened alloy and multiple
antioxidant elements. The finished strip exhibits a yield strength ≥880MPa, tensile strength ≥1000MPa, elongation ≥7%, and
oxidation rate ≤8×10⁻⁶ at 300℃. ‑5 mg / (cm 2 ·h), a high-reliability switching element suitable for high-temperature environments.