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High thermal conductivity polyimide film and preparation method thereof

A technology of polyimide film and polyimide resin, which is applied in the field of high thermal conductivity polyimide film and its preparation, can solve the problems of easy accumulation of heat, poor thermal conductivity, safety, etc., and achieve simple operation, clear steps, Effect of improving thermal conductivity

Inactive Publication Date: 2015-12-02
苏州嘉银新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in these fields, microelectronics are in a state of high-density and high-speed operation, which makes electronic components and integrated circuits dissipate a lot of heat; the thermal conductivity of ordinary polyimide films is about 0.2Wm -1 k -1 , poor thermal conductivity, easy to accumulate heat, affect the stability of electronic components, and cause safety problems

Method used

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  • High thermal conductivity polyimide film and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] This embodiment provides a high thermal conductivity polyimide film, which is prepared through the following steps:

[0018] (a) Configure nanomaterial slurry: disperse 2g vinyltrimethoxysilane, 2g silane coupling agent, and 50g nano-graphite powder evenly in 46gN, N-dimethylformamide (DMF) to form nanomaterial slurry ;

[0019] (b) Preparation of polyimide resin: Take 0.6mol pyromellitic dianhydride (PMDA), 0.4mol3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 0.7mol4,4'- After mixing diaminodiphenyl ether (ODA) and 0.3mol 2,2-bis[4(4-aminophenoxy)phenyl]propane (BAPP) evenly, add them to the reaction kettle, condense and reflux at room temperature for 2 hours to obtain Polyimide resin;

[0020] (c) Preparation of composite polyimide resin: get 2g of the nanomaterial slurry in step (a) and add it to 98g of the above polyimide resin under constant stirring, fully disperse, and continue to react until the viscosity of the system is 80Pa. S / 25°C;

[0021] (d) Fo...

Embodiment 2

[0023] This embodiment provides a high thermal conductivity polyimide film, which is prepared through the following steps:

[0024] (a) Configure nanomaterial slurry: uniformly disperse 5g vinyltriethoxysilane, 5g titanate coupling agent, 40g nano-alumina powder, 10g carbon black powder, and 10g ferric oxide (iron oxide) In 30gN, in N dimethylacetamide (DMAc), form nano material slurry;

[0025] (b) Preparation of polyimide resin: Take 0.6mol pyromellitic dianhydride (PMDA), 0.4mol3,3',4,4'-diphenyl ether tetraacid dianhydride (ODPA), 0.7mol4,4' -diaminodiphenyl ether (ODA), 0.3mol1,3-bis(4-aminophenoxy)benzene (TPE-R) mixed evenly, then added to the reaction kettle, condensed and refluxed at room temperature for 5 hours to obtain polyamide imide resin;

[0026] (c) Preparation of composite polyimide resin: get 20g of the nanomaterial slurry in step (a) and add it to 80g of the above polyimide resin under constant stirring, fully disperse, and continue to react until the vis...

Embodiment 3

[0029] This embodiment provides a high thermal conductivity polyimide film, which is prepared through the following steps:

[0030] (a) Configure nanomaterial slurry: uniformly disperse 5g of vinyltriethoxysilane, 5g of titanate coupling agent, and 60g of nano-alumina powder in 30g of N,N dimethylacetamide (DMAc) to form nano Material slurry;

[0031] (b) Preparation of polyimide resin: Take 0.6mol pyromellitic dianhydride (PMDA), 0.4mol3,3',4,4'-diphenyl ether tetraacid dianhydride (ODPA), 0.7mol4,4' -diaminodiphenyl ether (ODA), 0.3mol1,3-bis(4-aminophenoxy)benzene (TPE-R) mixed evenly, then added to the reaction kettle, condensed and refluxed at room temperature for 5 hours to obtain polyamide imide resin;

[0032] (c) Preparation of composite polyimide resin: get 20g of the nanomaterial slurry in step (a) and add it to 80g of the above polyimide resin under constant stirring, fully disperse, and continue to react until the viscosity of the system is 120Pa. S / 25°C;

[0...

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Abstract

The invention relates to a high thermal conductivity polyimide film. The high thermal conductivity polyimide film is prepared from 80-99 wt% of reaction monomer mixtures and 1-20 wt% of nanometer material slurry; the reaction monomer mixtures are composed of amine monomers and anhydride monomers, and the mole ratio of the amine monomers to the anhydride monomers is 1:1-1.15; the nanometer material slurry is prepared from 30-40 wt% of aprotic polar solvent, 50-66 wt% of inorganic nano-materials, 2-5 wt% of dispersing agents and 2-5 wt% of coupling agents, wherein the inorganic nano-meterials adopt one of or several of beryllium oxide, mica, boron nitride, aluminum oxide, diamond, magnesium oxide and graphite; the thermal conductivity coefficient of the high thermal conductivity polyimide film is set as 1-5 Wm-1k-1, and the glass transition temperature is set at 300-380 DEG C. The inorganic nano-materials with the high thermal conductivity are added in the formula of the polyimide film, therefore, the thermal conductivity performance of the polyimide film is improved, the thermal conductivity coefficient of the polyimide film is increased to 1-5 Wm-1k-1 from the original 0.2 Wm-1k-1, and meanwhile the glass transition temperature is lowered to 300-380 DEG C from 400-420 DEG C.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, and in particular relates to a high thermal conductivity polyimide film and a preparation method thereof. Background technique [0002] Polyimide is currently the most heat-resistant variety among industrialized polymer materials. Due to its superior comprehensive performance, it can be used as films, coatings, plastics, composite materials, adhesives, foam plastics, fibers, separation membranes, liquid crystals, etc. Alignment agents, photoresists, etc. are widely used in high-tech fields. [0003] Polyimide film is a new type of high-temperature-resistant organic polymer film. It is generally formed by polycondensation and salivation of pyromellitic dianhydride and diaminodiphenyl ether in a strong solvent. It has been used in flexible printed circuits. Substrates, microelectronic integrated circuits, battery packaging, special electrical appliances and other fields. However, in the...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08G73/10C08K13/02C08K3/04C08K3/22C08K5/5425C08K3/34C08K3/38C08J5/18
CPCC08K13/02C08G73/1067C08G73/1071C08J5/18C08J2379/08C08K3/04C08K3/22C08K5/5425C08K2003/222C08K2003/2227C08K2003/2275C08K2201/011C08L2203/16C08L79/08
Inventor 林志刚
Owner 苏州嘉银新材料科技有限公司
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