Ceramic substrate for LEDs

A technology of ceramic substrate and glass sintering aid, which is applied in the field of ceramic substrates for LEDs. It can solve problems such as the impact of life and the attenuation of luminous efficiency of high-power LED LEDs, and achieve the effects of enhancing ceramic performance, optimizing physical and chemical properties, and improving heat transfer.

Inactive Publication Date: 2015-09-23
GANSU RONGBAO IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has bee

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A ceramic substrate for LED, made of the following components and their parts by weight: 35 parts of aluminum nitride; 35 parts of boron nitride; 35 parts of aluminum oxide; 15 parts of beryllium oxide; 7 parts of glass sintering aid; 7 parts of nanoparticles; 3 parts of rare earth oxide; 7 parts of organic solvent; 1 part of plasticizer; 1 part of dispersant; 1 part of binder;

[0023] The weight composition of the glass sintering aid is 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 parts of lithium oxide;

[0024] The rare earth oxide is Y with a particle size of less than 100nm 2 o 3 , La 2 o 3 , Yb 2 o 3 and Eu 2 o 3 one or more of

[0025] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0026] The dispersant is a PEG dispersant;

[0027] Described binder is PVB binder;

[0028] The particle s...

Embodiment 2

[0036] A ceramic substrate for LED, which is made of the following components and their weight parts: 37 parts of aluminum nitride; 32 parts of boron nitride; 35 parts of aluminum oxide; 17 parts of beryllium oxide; 9 parts of glass sintering aid; 6 parts of nanoparticles; 4 parts of rare earth oxides; 8 parts of organic solvents; 2 parts of plasticizers; 2 parts of dispersants; 2 parts of binders;

[0037] The weight composition of the glass sintering aid is 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 parts of lithium oxide;

[0038] The rare earth oxide is Y with a particle size of less than 100nm 2 o 3 , La 2 o 3 , Yb 2 o 3 and Eu 2 o 3 one or more of

[0039] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0040] The dispersant is a PEG dispersant;

[0041] Described binder is PVB binder;

[0042] ...

Embodiment 3

[0050] A ceramic substrate for LED, made of the following components and their weight parts: 38 parts of aluminum nitride; 34 parts of boron nitride; 38 parts of aluminum oxide; 17 parts of beryllium oxide; 6 parts of glass sintering aid; 6 parts of nanoparticles; 4 parts of rare earth oxide; 8 parts of organic solvent; 1 part of plasticizer; 1 part of dispersant; 1 part of binder;

[0051] The weight composition of the glass sintering aid is 70 parts of silicon oxide; 10 parts of boron oxide; 10 parts of beryllium oxide; 10 parts of calcium oxide; 5 parts of aluminum oxide; 3 parts of phosphorus pentoxide; 3 parts of lithium oxide;

[0052] The rare earth oxide is Y with a particle size of less than 100nm 2 o 3 , La 2 o 3 , Yb 2 o 3 and Eu 2 o 3 one or more of

[0053] Described organic solvent is acetone, isopropanol binary mixed organic solvent system;

[0054] The dispersant is a PEG dispersant;

[0055] Described binder is PVB binder;

[0056] The particle size o...

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Abstract

The invention discloses a ceramic substrate for LEDs. Various raw materials used in the LTCC preparation technology are optimized, aluminum nitride, boron nitride, alumina and beryllium oxides serve as the main raw materials, meanwhile, glass sintering additives, copper and aluminum alloy nano-particles, rare earth oxides, solvents, plasticizer, dispersant, binder and other additives are added, and the physical and chemical properties of the ceramic substrate are further optimized. The thermal conductivity of the ceramic substrate is larger than 400 W/(m*k), the bending strength is larger than 300 Mpa, and the dielectric constant is smaller than 2. Meanwhile, due to a conventional LTCC preparation method, the main raw materials and the additives can be prepared into the high-conductivity ceramic substrate, the preparation technology is simple, and industrialization is facilitated.

Description

technical field [0001] The invention belongs to the field of substrates for LEDs, in particular to a ceramic substrate for LEDs. Background technique [0002] As the fourth-generation lighting source, light-emitting diodes (LEDs) are valued by countries all over the world for their advantages such as low maintenance costs, long life, good shock resistance, low power consumption, and environmental friendliness. They are widely used in indicator lights, display screens, Backlighting, landscape lighting, transportation, etc., the market potential is huge. [0003] As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); Fatal impact. At present, there are four kinds of ceramic heat dissipation substrates that are more common: direct copper clad ceramic board (DBC), direct copper clad substrate (DPC), high tem...

Claims

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Application Information

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IPC IPC(8): C04B35/581C04B35/583C04B35/10C04B35/63C04B35/64
Inventor 刘贞天
Owner GANSU RONGBAO IND GRP
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