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Low-temperature sintered ceramic material

A technology of low-temperature co-fired ceramics and ceramic materials, applied in the field of low-temperature co-fired ceramic materials, can solve the problems of low thermal conductivity and low thermal conductivity, and achieve the effect of improving comprehensive performance and thermal conductivity

Inactive Publication Date: 2008-04-16
LEATEC FINE CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The composition of the LTCC system is based on Al 2 o 3 It is mainly based on glass or glass-ceramic, but this kind of material has low thermal conductivity due to the low thermal conductivity of its main component and usually contains about 50wt% glass phase.

Method used

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Embodiment 1

[0036] The low-temperature co-fired ceramic material with high thermal conductivity in one embodiment of the present invention measures 45%wt. glass powder and 55%wt. aluminum nitride. About 1.5mm ceramic green sheet, cut into appropriate size with a knife, and then sintered at 800°C for about 60 minutes to obtain a dense ceramic test piece.

Embodiment 2

[0042] In another embodiment of the present invention, the low-temperature co-fired ceramic material with high thermal conductivity is made by measuring 45%wt. A ceramic green sheet with a thickness of about 1.5mm was cut into an appropriate size with a knife, and then sintered at 800°C for about 60 minutes to obtain a dense ceramic test piece (A).

Embodiment 3

[0044] The low temperature co-fired ceramic material with high thermal conductivity in another embodiment of the present invention is made by measuring 40%wt. A ceramic green sheet with a thickness of about 1.5mm was cut into an appropriate size with a knife, and then sintered at 800°C for about 60 minutes to obtain a dense ceramic test piece (B).

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Abstract

The invention discloses a low temperature co-fired ceramic material which mainly comprises high heat conductivity ceramic materials such as beryllium oxide, carborundum and so on, as well as borosilicate series powder glass materials.

Description

technical field [0001] The invention is a low-temperature co-fired ceramic material, especially a low-melting-point glass composed of aluminum nitride (AlN) powder as the main raw material and borosilicate series, and adding appropriate sintering aids. Low-temperature sintered aluminum nitride (AlN) / glass composites were successfully prepared at a temperature of -850 °C. Background technique [0002] Ceramic materials have excellent thermal conductivity and electrical insulation properties, and can change their chemical composition to adjust their properties. They are widely used in electronic packaging. It is not only a common substrate and lid (Lid or Cap) material, It can also be combined with thick film metallization technology to make a multilayer interconnection substrate (Multilayer Interconnection Substrate) for high-density construction. Due to its high density and excellent resistance to water molecule penetration, ceramic materials have become the main material f...

Claims

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Application Information

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IPC IPC(8): C04B35/581C04B35/08C04B35/565
Inventor 李威昌吴颖昌曾国书
Owner LEATEC FINE CERAMICS
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