Heat dissipation coating for LED (Light Emitting Diode) lamps and preparation method thereof

A technology for heat-dissipating coatings and LED lamps, applied in the direction of coatings, etc., can solve the problems of poor temperature resistance and aging resistance, low substrate adhesion, poor heat dissipation effect, etc., to achieve easy painting, high adhesion, Easy to apply effect

Inactive Publication Date: 2014-06-25
程实
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat conduction adhesive is used to solve the heat dissipation problem of LED lamps, but the materials used have poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect, and inconvenient construction. It is difficult to meet people's expectations for LED lamps. Cooling Requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] A heat-dissipating paint for LED lamps, made of the following parts by weight (kg) of raw materials: polyacrylic resin 33, polyimide resin 43, polyacrylamide 5, isophorone diamine IPDA 10, xylene 22, Polyethyl silicate 7, silane coupling agent KH550 2.5, nano clay 2.5, ethyl acetate 10, benzyl trimethyl ammonium tribromide 3, aluminum nitride 11, beryllium oxide 11, and film forming aid 4.5.

[0011] The said film-forming aid is prepared from the following parts by weight (kg) of raw materials: ethylene glycol ethyl ether acetate 8, 2-oxoacetoxybutyric acid 3, acrylic acid 4, polyvinyl butyral 3, hexamethyl Phosphorus triamide 4, geranyl acetate 4, isopropyl tris(dioctyl pyrophosphate acyloxy) titanate 0.7, hydroxymethyl propyl cellulose 2.5, nano chitin 0.4, plastic starch 1.5, Acetyl peroxide 0.3, propylene glycol monomethyl ether acetate 17; the preparation method is: ethylene glycol ethyl ether acetate, hexamethylphosphoric triamide, geranyl acetate, hydroxymethyl prop...

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PUM

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Abstract

The invention provides heat dissipation coating for LED (Light Emitting Diode) lamps. The heat dissipation coating is prepared from the following raw materials in parts by weight: 30-35 parts of polyacrylic acid resin, 40-46 parts of polyimide resin, 4-6 parts of polyacrylamide, 8-12 parts of isophorone diamine (IPDA), 20-24 parts of xylene, 6-9 parts of polyethyl silicate, 2-3 parts of silane coupling agent KH550, 2-3 parts of nanometer clay, 8-12 parts of ethyl acetate, 2-4 parts of benzyltrimethylammonium tribromide, 10-12 parts of aluminum nitride, 10-12 parts of beryllium oxide and 4-5 parts of film forming additive. The heat dissipation coating for the LED (Light Emitting Diode) lamps has high-radiation cooling property due to addition of the nanometer clay, the aluminum nitride and the beryllium oxide and is used for reducing the surface temperature of heat dissipation cups, aluminum substrates and lampshades in the LED lamps, so that the service life of the lamps is prolonged; the heat dissipation coating is stable in dispersion, convenient to apply and aging-resistant and has large binding power; and the film forming additive is used for ensuring that the film-forming property of the coating is good, and the coating is easy to apply.

Description

Technical field [0001] The invention belongs to the technical field of coatings, and particularly relates to a heat dissipation coating for LED lamps and a preparation method thereof. Background technique [0002] With the rapid expansion of the scope of use of LED lights, extending the service life of LED lights has become an urgent problem to be solved. With the increase of LED power, the heat dissipation problem has been paid more and more attention. At present, thermal conductive glue is used to solve the heat dissipation problem of LED lights, but the materials used have poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation, and inconvenient construction. It is difficult to meet people's technical problems with LED lights. Heat dissipation requirements. Summary of the invention [0003] The purpose of the present invention is to provide a heat dissipation paint for LED lamps and a preparation method thereof. The paint of the p...

Claims

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Application Information

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IPC IPC(8): C09D179/08C09D133/00C09D7/12
Inventor 程实
Owner 程实
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