Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof

Abstract

The invention discloses a multi-ring-arranged double-integrated circuit (IC) chip packaging piece and a production method thereof. The multi-ring-arranged double-IC chip packaging piece comprises a multi-ring quad flat no (QFN) lead frame with a carrier, an internal pin, IC chips and a plastic package body. The production method comprises the following steps of: thinning; scribing; adding the chips primarily; performing pressure welding; inversely adding the chips secondarily; filling the bottom and solidifying; performing plastic packaging and post solidifying; printing; separating pins; electroplating; separating products; testing the products; packing; and warehousing. Compared with a single-row lead frame with the same area as the multi-ring QFN lead frame, the multi-ring QFN lead frame increases the pins by over 40 percent, so that the requirements of high density and multiple input / output (I / O) packages are met; the chips are inversely added, so that the packaging piece has a small number of short welding lines, a short heat conduction distance and high radiation capacity; through the inverse addition of the chips, the capacitance and the inductance between protruding points and the pins are far lower than those of the welding lines between a chip welding disc and the pins, so that the influence on high frequency application is reduced; and the thickness of a QFN can be reduced to be below 0.5mm, so that the intersection and the open circuit of the welding lines are avoided and testing qualified rate and testing reliability are improved.

Description

technical field

[0001] The invention relates to the technical field of electronic information automation components manufacturing, in particular to four-sided flat leadless IC chip packaging, specifically a multi-circle arrangement carrierless dual IC chip package, and the invention also includes a production method for the package . Background technique

[0002] In recent years, with the rapid development of portable electronic components in the field of mobile communications and mobile computers, small packaging and high-density assembly technology has been greatly developed; at the same time, a series of strict requirements have been put forward for small packaging technology, such as requirements The package dimensions should be kept as small as possible, especially if the package height is less than 1 mm. The connection reliability after packaging is improved as much as possible, suitable for lead-free soldering (protecting the environment) and effectively reducing cos...

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