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621 results about "Radiation emission" patented technology

Radiation is the emission of energy as electromagnetic waves or as moving subatomic particles, especially high-energy particles which cause ionization. Radiation can also be defined as the mode of traveling energy through space. Radiation can occur via either waves or particles. Radiation can go through space as well as through some materials.

Shaped biocompatible radiation shield and method for making same

A radiation applicator system is structured to be mounted to a radiation source for providing a predefined dose of radiation for treating a localized area or volume, such as the tissue surrounding the site of an excised tumor. The applicator system includes an applicator and an adapter. The adapter is formed for fixedly securing the applicator to a radiation source, such as a radiosurgery system which produces a predefined radiation dose profile with respect to a predefined location along the radiation producing probe. The applicator includes a shank and an applicator head, wherein the head is located at a distal end of the applicator shank. A proximate end of the applicator shank couples to the adapter. A distal end of the shank includes the applicator head, which is adapted for engaging and/or supporting the area or volume to be treated with a predefined does of radiation. The applicator can include a low energy radiation filter inside of the applicator head to reduce undesirable low energy radiation emissions. A biocompatible radiation shield may be coupled to the outer surface of the applicator head to block radiation emitted from a portion of the radiation probe, in order to shield an adjacent location or vital organ from any undesired radiation exposure. A plurality of applicators having applicator heads and radiation shields of different sizes and shapes can be provided to accommodate treatment sites of various sizes and shapes.
Owner:CARL ZEISS STIFTUNG DOING BUSINESS CARL ZEISS

Full spectrum endpoint detection

A method of endpoint detection during plasma processing of a semiconductor wafer comprises processing a semiconductor wafer using a plasma, detecting radiation emission from the plasma during the semiconductor processing, and tracking data points representing changes in spectra of the radiation as a function of time during the semiconductor processing. At any point prior to or during processing a plurality of profiles are provided, each profile representing a different processing condition affecting detection of the desired plasma processing endpoint of the semiconductor wafer. After selecting a desired profile, a first set of parameters are input, representing simplified values for determining when changes in spectra of the radiation indicate that plasma processing of the semiconductor wafer reaches a desired endpoint. The selected profile converts the input first set of parameters into a larger, second set of parameters, and then applies the second set of parameters to an algorithm that converts data points from the spectra of the radiation as a function of time into an endpoint curve. The method then uses the algorithm to track changes in spectra of the radiation as a function of time and determine when plasma processing of the semiconductor wafer reaches a desired endpoint.
Owner:NOVELLUS SYSTEMS

Method and arrangement for the efficient generation of short-wavelength radiation based on a laser-generated plasma

InactiveUS20060215712A1Losses in the main pulse (e.g., due to transmission) are minimizedLaser using scattering effectsActive medium materialIon densityElectromagnetic radiation
The invention is directed to a method and an arrangement for the efficient generation of intensive short-wavelength radiation based on a plasma. The object of the invention is to find a novel possibility for the generation of intensive short-wavelength electromagnetic radiation, particularly EUV radiation, which permits the excitation of a radiation-emitting plasma with economical gas lasers (preferably CO2 lasers). This object is met, according to the invention, in that a first prepulse for reducing the target density is followed by at least a second prepulse which generates free electrons in the target by multiphoton ionization after a virtually complete recombination of free electrons generated by the first prepulse has taken place due to a long-lasting expansion of the target for reducing the target density, and the main pulse of a gas laser with a low critical electron density typical for its wavelength is directed to the target immediately after the second prepulse when the second prepulse in the expanded target, whose ion density corresponds to the critical electron density of the gas laser, has created enough free electrons so that an efficient avalanche ionization is triggered by the main pulse of the gas laser until reaching the ionization level for the desired radiation emission of the plasma.
Owner:XTREME TECH

Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom

The present invention relates to radiation, preferably light emitting, devices with a high radiation emission efficiency and to fabricating these as small devices in an array of such devices. In one embodiment, the emitting devices can be placed in dense arrays. In another embodiment, outcoupling efficiency of the devices is improved, which leads to a reduced power consumption for a given radiation output power. In another embodiment, the speed of the radiation is increased, hence the serial bandwidth per optical channel is increased. The invention further relates to light emitting devices that exhibit uniform radiation emission characteristics. The light emitting devices (diodes, LEDs) of the present invention can be used for applications wherein two-dimensional LED arrays, particularly low-power arrays, are useful, such as in display technology. Active matrix displays relying on liquid crystals (e.g. integrated on CMOS circuitry) could be replaced by LED arrays. Dense and bright one-dimensional LED arrays are useful for example for printing and copying. Also for single LED applications it is important to have a maximum of photons escaping from the light emitting surface. The intensity of light per unit area (the brightness) is larger, and this is useful in many applications. Furthermore, the packaging cost can be reduced. In order to achieve a large global efficiency, many conventional LEDs need an elaborate package that includes a cavity with mirrors, because the light is emitted from more than one surface of the LED.
Owner:SIGNIFY HLDG BV
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