Method for making LED (Light Emitting Diode) light resource module and product made by the method

A technology of LED light source and manufacturing method, which is applied in the direction of light source, electric light source, point light source, etc. It can solve the problems of poor heat dissipation effect of products and cannot meet the heat dissipation requirements of multi-chip packaging, so as to ensure product consistency and avoid mold pollution , to avoid the effect of air bubbles

Inactive Publication Date: 2011-04-13
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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Problems solved by technology

Although the thermal conductivity of the metal plate and the copper clad layer can reach more than 200W/mK, the thermal conductivity of the intermediate insulating layer is only 0.6W/mK, so the overall thermal conductivity of the metal core PCB is only 0.5~2W/mK
Even the thermal conductivity of ultra-high the...

Method used

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  • Method for making LED (Light Emitting Diode) light resource module and product made by the method
  • Method for making LED (Light Emitting Diode) light resource module and product made by the method
  • Method for making LED (Light Emitting Diode) light resource module and product made by the method

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Embodiment 1

[0082] In combination with the first embodiment, the present invention also provides a novel injection molding colloid method suitable for the manufacturing method of the LED light source module of the metal core PCB board of the present invention. The encapsulating colloid of lens structure, its specific process step is as follows: d.1) prepare mold: described mold has upper mold and lower mold, and described upper mold is in order to carry the metal core PCB board with LED chip, and has air Channel two; the lower mold has a mold cavity with an optical lens structure corresponding to the chip placement part of the metal core PCB board one by one, and has an air channel one; there is an air channel three between the upper mold and the lower mold; d.2) Place and fix the separation membrane, place the separation membrane on the lower mold, and use vacuum to draw out the air between the separation membrane and the lower mold through the gas channel, so that the separation membrane...

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Abstract

The invention discloses a method for making an LED (Light Emitting Diode) light source module and a product made by the method, solving the problems of poor heat radiation effect, low production efficiency and poor consistency of the existing LED light resource modules. The method for making an LED light resource module comprises the following steps of: preparing a metal core PCB (Printed Circuit Board); processing the metal core PCB; and arranging an LED chip in the chip placing part of the metal core PCB; connecting circuit layers; and injecting colloid. The light source module made by the method of the invention comprises the metal core PCB, at least one LED chip arranged on the metal core PCB and the packaged colloform covering the LED chip and the metal core PCB and has an integral structure. The method of the invention has high production efficiency and can realize complete automation mass production. The LED light source module of the invention has the advantages of good heat radiation effect, low cost, ingenious structure, good consistency and adjustable optical visual angle range.

Description

technical field [0001] The invention relates to a method for manufacturing an LED light source module and a product of the method, in particular to a method for manufacturing an LED light source module based on a metal core PCB board and a product of the method. Background technique [0002] Light-emitting diodes (LEDs) have become a new generation of green solid-state light sources and are gradually entering the field of general lighting. Since LED is a point light source with a limited irradiation area, it still fails to meet the technical requirements of large irradiation area and uniform light emission required by general lighting. Therefore, the industry currently adopts two process routes to break through the technical bottleneck of LEDs: one is to combine multiple LEDs The light source module where the device is installed on the circuit board; the second is the light source module that directly encapsulates the LED chip on the heat dissipation substrate. [0003] Suc...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V19/00F21V23/00F21V5/04H01L33/00H05K1/03F21Y101/02
Inventor 余彬海李伟平夏勋力李军政梁丽芳
Owner FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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