Method for making LED (Light Emitting Diode) light resource module and product made by the method

Abstract

The invention discloses a method for making an LED (Light Emitting Diode) light source module and a product made by the method, solving the problems of poor heat radiation effect, low production efficiency and poor consistency of the existing LED light resource modules. The method for making an LED light resource module comprises the following steps of: preparing a metal core PCB (Printed Circuit Board); processing the metal core PCB; and arranging an LED chip in the chip placing part of the metal core PCB; connecting circuit layers; and injecting colloid. The light source module made by the method of the invention comprises the metal core PCB, at least one LED chip arranged on the metal core PCB and the packaged colloform covering the LED chip and the metal core PCB and has an integral structure. The method of the invention has high production efficiency and can realize complete automation mass production. The LED light source module of the invention has the advantages of good heat radiation effect, low cost, ingenious structure, good consistency and adjustable optical visual angle range.

Description

technical field [0001] The invention relates to a method for manufacturing an LED light source module and a product of the method, in particular to a method for manufacturing an LED light source module based on a metal core PCB board and a product of the method. Background technique [0002] Light-emitting diodes (LEDs) have become a new generation of green solid-state light sources and are gradually entering the field of general lighting. Since LED is a point light source with a limited irradiation area, it still fails to meet the technical requirements of large irradiation area and uniform light emission required by general lighting. Therefore, the industry currently adopts two process routes to break through the technical bottleneck of LEDs: one is to combine multiple LEDs The light source module where the device is installed on the circuit board; the second is the light source module that directly encapsulates the LED chip on the heat dissipation substrate. [0003] Suc...

AI Technical Summary

Problems solved by technology

Although the thermal conductivity of the metal plate and the copper clad layer can reach more than 200W / mK, the thermal conductivity of the intermediate insulating layer is only 0.6W / mK, so the overall thermal conductivity of the metal core PCB is only 0.5~2W / mK

Even the thermal conductivity of ultra-high thermal conductivity metal core PCB board is only 5~10W / mK, which cannot meet the heat dissipation requirements of multi-chip packaging

The existing light source modules produced by using metal core PCB boards cannot solve the problem of poor heat dissipation due to the defects in the structural design of the products.

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