148 results about "Patch type" patented technology

The invention belongs to the technical field of manufacturing of special equipment for the electronic industry, and particularly relates to an automatic chip mounter for a surface-mounted buzzer, which comprises a machine table, a working table is arranged at the upper end of the machine table, a three-axis industrial manipulator is arranged on the working table, a chip mounting head is arranged on the three-axis industrial manipulator, and a transfer mechanism is arranged below the three-axis industrial manipulator. A material storage cup is arranged in front of the transfer mechanism, the material storage cup is connected with a material carrying block in a sliding mode, an air cylinder used for driving the material carrying block is fixedly installed on the workbench, the transfer mechanism comprises a fixing column, the fixing column is fixedly installed on the workbench, and a transfer disc is rotatably installed on the fixing column. According to the device, a worker can place the next group of dies in the group of material placing frames at the material placing point position and take down the dies after surface mounting processing from the corresponding material placing frames, so that surface mounting and material taking and placing are carried out at the same time, the material taking and placing time is saved, and the surface mounting processing efficiency of the surface mounting type buzzer is improved.

The embodiment of the invention discloses a read-only code patch repairing method and device and a storage medium, and relates to the field of embedding. According to the method, the read-write request on the system bus is monitored, so that all-bus patch coverage of any code / data is realized. According to the patch repairing device, the patch pool containing various kinds of information is preset, and when a read-write request of a specific address is detected, corresponding patch data items can be quickly inquired and matched. And if the matching is successful and the patch is valid, replacing the target data according to the patch type or triggering a CPU exception instruction to enter an interrupt processing flow to obtain the patch. The method is universal and flexible, supports undifferentiated full-function patches, can cope with various code / data errors, and greatly reduces the risk of chip scrapping or re-burning caused by ROM code abnormity. By means of bus replacement, abnormal triggering and the like, effective repair of read-only codes is achieved, remarkable economic effects are achieved, production efficiency is improved, and product cost is reduced.

The invention relates to the technical field of inertial units, and discloses a surface-mounted inertial measurement unit IMU module and a preparation method, the surface-mounted inertial measurement unit IMU module comprises a substrate, the substrate is provided with at least one IMU chip and a control chip, the bottom of the substrate is provided with an external bonding pad used for surface mounting, the IMU module is mounted in front of an external mainboard after packaging is completed, and the IMU chip is connected with the control chip. The calibration of inertial parameters is completed, and the calibration parameters are stored in an internal storage unit of the control chip; the substrate is a ceramic substrate, a sealing box dam is arranged on the periphery of the substrate, the top of the sealing box dam is fixedly connected with an upper cover, and an airtight or nearly airtight packaging structure is formed. According to the compact surface-mounted inertial measurement unit IMU module and the preparation method thereof, the compact surface-mounted inertial measurement unit IMU module has the advantages of capability of avoiding welding stress influence, stable performance, low cost, small size, easiness in automatic production and the like, and the problems of poor performance stability, high cost, high production complexity and huge size of an IMU module in the prior art are solved.

The invention provides a patch type thrombus monitoring and NO release closed-loop system for treating venous thrombosis, which comprises a flexible patch substrate on which a sensor module is integrated, and the sensor module comprises a blood flow velocity sensor, a biological impedance sensor, an acceleration sensor and a temperature sensor, the acquisition units are respectively used for acquiring blood flow velocity v at a target vein, related parameters of vascular resistance R, limb movement states and skin temperature of a patch area; the NO release module is used for releasing NO to act on the venous thrombosis part; the control module comprises a signal processing unit and a control unit and is used for receiving the signal output by the sensor module and operating a closed-loop control algorithm to generate an NO release control instruction; and the power supply module provides electric energy for the sensor module, the control module and the NO release module. The invention provides a patch type closed-loop system which integrates thrombus multi-mode monitoring, decision making, NO release assisting and treatment mode self-adaptive switching.

The invention discloses a cuff-free calibration-free flexible patch type blood pressure detection system based on an ultrasonic echo method, and relates to the technical field of blood pressure detection of biomedical engineering. Comprising a transmitting and receiving integrated probe, a transmitting circuit, an amplitude limiting circuit, an amplifying circuit, a filter circuit, an A / D conversion circuit, an FPGA chip, a Bluetooth module and a mobile terminal. Wherein the FPGA chip outputs a high-frequency signal, a low-voltage signal is converted into a negative high-voltage signal through the transmitting circuit to drive the ultrasonic transducer, the ultrasonic transducer generates ultrasonic waves under excitation and receives an echo signal from a blood vessel wall, the echo signal firstly passes through the amplitude limiting circuit, and the high-voltage component is limited while the signal is received; signals sequentially pass through the amplification circuit and the filter circuit, finally voltage signals are converted into digital signals through the A / D conversion circuit, and after the digital signals are processed by the FPGA chip, data are sent to a mobile terminal through the Bluetooth module. The accuracy of blood pressure detection is improved.

Automatic redeploying / upgrade of containers on multiple nodes using an Automated Deployment Software (ADS) having an Automated Deployment Tool (ADT) includes updating the ADS with a planned patch of a target layer, introducing a patchname sync command into the ADT to introduce a required patch type / specific patch and redeploy the containers, updating the ADT with a Producer Module (PM) and a Consumer Module (CM), running the ADT to cause the PM to update an image manifest item attribute, and push the image manifest item / new layer to a repository and running the ADT to cause the CM to read the image manifest item, identify and pull the unimpacted layers, and performing at least one of deploying / upgrading an application, or waiting for an available patch fix and deploying / upgrading the application.

The utility model belongs to the technical field of connecting wires, and particularly relates to an anti-interference patch type connecting wire, which comprises an insulating body, a battery core wire and connectors at two ends, the battery core wire comprises six copper alloy core wires, the six core wires are linearly arranged in the connectors at equal intervals, and the distance between the core wires is 1.27 mm so as to realize high-density connection. The pins are arranged on the connectors and connected with the two ends of the battery core wire, the pins are of trapezoidal structures, the lower portions of the pins are wide, the upper portions of the pins are narrow, the contact area between the pins and a circuit board bonding pad can be increased conveniently during welding, the battery core wire is wrapped in the insulation body, the shielding layer is further wrapped outside the battery core wire, electromagnetic interference is reduced, and the heat dissipation structures are arranged on the connectors and the insulation body. According to the connecting line, the connection density is improved, the requirements of miniaturization and integration of electronic equipment are met, the space of a circuit board can be effectively saved, the connection is stable and reliable, and the problems of looseness, unsoldering and the like are effectively prevented.

The utility model discloses a surface-mounted resistor CCD (Charge Coupled Device) detection device, which relates to the technical field of detection equipment and comprises a bottom plate, a control and calculation analysis unit, a feeding mechanism, a CCD detection camera, a discharging mechanism, a turntable and three supporting tables, the rotating disc is horizontally designed, the center of the bottom of the rotating disc is fixedly connected with the output end of the second motor, the edge of the rotating disc is rotationally connected with the bottom plate through a limiting piece, three through holes are evenly formed in the rotating disc, rotating shafts are rotationally arranged in the through holes, and a first motor is arranged at the position, corresponding to the through holes, of the bottom face of the rotating disc. According to the utility model, the CCD detection camera is used for shooting the surface-mounted resistor on the support table, and the support table can rotate by 360 degrees, so that the CCD detection camera can shoot and detect each side surface and upper surface of the surface-mounted resistor, the detection efficiency is greatly improved, the overall structure is simple, and the repair and maintenance are convenient.

The utility model discloses a surface-mounted full-color LED lamp bead which comprises an outer package, connecting grooves are symmetrically formed in the front outer surface of the outer package, a support is connected to the middle of the outer package in a clamped mode, a heat dissipation pad is fixedly connected to the lower surface of the support, and an L-shaped conductive block is fixedly connected to the upper surface of the heat dissipation pad. According to the patch type full-color LED lamp bead, through the arrangement of the outer package, the anode plate and the cathode plate, the safety of the LED lamp bead assembly is protected through the outer package, the protection support and the heat dissipation pad are installed in the LED lamp bead assembly, and when circuit connection needs to be conducted, the cathode plate and the anode plate on the conductive plate are in circuit connection with the L-shaped conductive block through screws; when the LED lamp bead has a problem and needs to be disassembled, screws are disassembled, the conductive plate is taken out from the connecting groove, the outer package is taken down from the upper portion, and then the support, the heat dissipation pad and the L-shaped conductive block can be exposed, maintenance inspection and replacement of part of assemblies are facilitated, the cost fund for replacing the whole set of assemblies when the problem occurs is reduced, and the service life of the LED lamp bead is prolonged.

The application provides a patch type LED chip automatic stripping stacker, which comprises a disc type feeding assembly, a turnover rack is arranged in a ring array on the surface of the disc type feeding assembly, and a lamp core loading disc is stacked in the turnover rack; an automatic stripping assembly, which comprises a machine table, a first conveying track is arranged on the top of the machine table, and a stripping roller group is arranged at the output end of the first conveying track; a first swing transfer assembly, which is installed between the disc type feeding assembly and the automatic stripping assembly; a loading disc correcting assembly, which comprises a second conveying track, a correcting roller group is installed on the top of the second conveying track, and the correcting roller group is used for flattening the input curved empty loading disc; and a temporary storage box is installed at the output end of the second conveying track. The application forms a special cross docking groove through independent lifting of a cross movable plate; a pushing component is arranged in four directions around the cross docking assembly, a cross pushing layout is formed, four groups of binding tape ends can be simultaneously and oppositely fed, and the loading and bundling of the loading disc can be completed.

1. The name of the design product: circuit board substrate set (patch type electronic detonator circuit board substrate set). 2. The use of the design product: the design product is used to mount electronic components through the electronic component patching process to obtain a plurality of patch type electronic detonator control modules, and the patch type electronic detonator control modules formed by production are arranged in the electronic detonator, so that the electronic detonator can be controlled by the patch type electronic detonator control module. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view. 5. Design 1 is designated as the basic design.

The utility model discloses a patch type variable inductor, and relates to the technical field of variable inductors. The inductor comprises a base, a magnetic core is fixedly matched with one side of the base, and pins are wound around the periphery of the magnetic core in a matched mode. The winding part is fixedly matched with one side of the base, a T-shaped plate and two T-shaped blocks are elastically and slidably matched with one side of the winding part, an L-shaped plate is fixedly matched with the upper side of the T-shaped plate, and a rotating plate is rotatably matched between one side of the L-shaped plate and one side of each T-shaped block. According to the utility model, through the arrangement of the T-shaped plate, the rotating plate drives one side of the T-shaped plate to slide towards the direction of the base under the action of the T-shaped block, and the pin is positioned on the peripheral side of the winding part through the T-shaped plate, so that the effect of clamping and fixing the pin is achieved, and the problem that the pin falls off from the winding part is reduced.

1. Name of the designed product: electronic component (patch type). 2. Use of the designed product: the designed product is used as an electronic patch component welded on a circuit board. 3. Design points of the designed product: in shape. 4. Picture or photo best indicating the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design.

The application discloses a kind of based on machine vision's patch type infrared receiving head appearance detection method and system, belong to computer vision detection field.Method includes: through bottom collimating backlight source irradiation to be measured receiving head, utilize the image of two telecentric cameras of symmetrical arrangement Synchronous acquisition pin;Sub-pixel level feature positioning is carried out to image and rejects reflection false feature point;Based on binocular vision principle, reconstruct the three-dimensional space coordinates of pin end;Adopt lowest multipoint method to construct reference plane, calculate the vertical distance of each pin to reference plane as coplanarity deviation;Deviation and tolerance threshold are compared, and output determination signal.System includes object table, bottom collimating backlight source, double-side telecentric camera, hardware level synchronous trigger unit, image processing and three-dimensional reconstruction unit, coplanarity evaluation and determination unit.The application can high-precision measurement pin coplanarity, eliminate perspective distortion and stray light interference, suitable for on-line full inspection on automatic production line.

The utility model relates to the technical field of network interfaces, and discloses an integrated patch type network interface, which comprises a base, two sides of the base are provided with shell clamping blocks, and the tail parts of the shell clamping blocks are provided with shell pressing parts; the shielding shell is clamped and fixed with the base, and a clamping part matched with the shell clamping block is arranged on the shielding shell; the plurality of gold needles are fixed in the base in a surface-mounted manner, one end of each gold needle extends to form a pin, and the pins penetrate through the bottom of the base. The arranged base and the shielding shell are clamped and fixed through the shell clamping blocks and the clamping parts, the production process is simplified, a molding inner core does not need to be used, the production cost is reduced, and the production efficiency is improved. Meanwhile, the gold pins are fixed in the base in a patch mode, the structure is stable, and the signal transmission effect is good. In addition, due to the design of the concave structure of the pressing shell part, the elastic buckle structure of the shielding shell, the L-shaped bending structure of the gold needle and the like, the stability and reliability of the network interface are further enhanced, and the user experience is improved.

1. The name of the design product: control module glue forming body (patch type electronic detonator control module glue forming body). 2. The use of the design product: the design product is used to produce a plurality of patch type electronic detonator control modules, and the patch type electronic detonator control modules produced are arranged in the electronic detonator, so that the patch type electronic detonator control module can control the detonation of the electronic detonator. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.

The utility model relates to the technical field of sound production instruments, and provides a patch type buzzer, which adopts a double-layer circuit board structure, a second circuit board is provided with a conversion element, and the conversion element and an electric appliance element on the second circuit board form a direct current-alternating current conversion circuit for converting direct current into alternating current. When the second circuit board and the first power connection board are stacked up and down, the conversion element is limited on the conversion element receding groove, so that the second circuit board abuts against the first power connection board, and when the buzzer adopts single-frequency sound production, the size of the buzzer can be designed to be smaller, and the buzzer can be more compact. When the volume of the buzzer is the same as that of a buzzer in the prior art, the internal space of the buzzer is relatively increased due to the fact that the second circuit board abuts against the first power connection board, and multi-frequency sound can be made.

The invention relates to the technical field of medical monitoring equipment, and particularly discloses patch type wireless monitoring equipment. A patch type wireless monitoring device comprises an adhesion substrate, an optical assembly used for reflective photoplethysmography and a wireless electronic module, the adhesion substrate comprises a circumferential adhesion fixing ring and an optical bin located in the center, and the circumferential adhesion fixing ring is provided with a medical pressure-sensitive adhesive adhesion layer. A glue-free window structure is arranged in a corresponding area of the optical bin; the optical bin is connected with the circumferential adhesion fixing ring through an annular elastic buffer connecting part, so that shear displacement generated by the circumferential adhesion fixing ring relative to the skin is absorbed by elastic deformation of the annular elastic buffer connecting part; the equipment shades and stabilizes a light path through a non-glue window and a labyrinth, absorbs and shears through an annular elastic buffer connecting part to reduce motion artifacts, enhances attachment, resists upwarp and discharges sweat and water by combining a wedge-shaped outer edge and a segmented notch with a micro air channel, and is convenient to replace and ensures alignment by matching with a guide slide-in lock catch and fool-proof positioning.

The utility model provides a patch type heating module, which comprises an aluminum block and a flexible circuit board, one surface of the aluminum block is fixed with the flexible circuit board in a sticking way, the opposite surface of the aluminum block and the flexible circuit board is used for heating a transparent medical slide, and heating wires which are uniformly distributed on the sticking surface of the aluminum block are arranged in the flexible circuit board; the flexible circuit board heating aluminum block is adopted to replace a traditional ceramic heating block, heat loss is reduced, and meanwhile heating is more uniform.

The utility model discloses a non-solid electrolyte tantalum capacitor with a surface-mounted tantalum shell, which relates to the technical field of tantalum capacitors and comprises a base, a connecting unit arranged at the top end of the base and an assembling unit arranged in the base. The connecting unit comprises two connecting bases arranged at the top end of the base, external connecting assemblies arranged on the side faces of the connecting bases, a gland arranged between the two connecting bases and a locking assembly arranged on the side face of the gland. The assembling unit comprises inner sinking grooves formed in the two sides of the interior of the base and a filling assembly arranged at the top end of the base. According to the non-solid electrolyte tantalum capacitor with the surface-mounted tantalum shell, the capacitor is convenient and fast to assemble, the stability of the capacitor shell is optimized, and the limiting effect on the non-solid electrolyte is optimized at the same time.

The utility model provides a patch type remote dynamic electrocardiogram recorder which comprises a shell, and the shell comprises a face shell and a bottom shell which are buckled together. A PCB (Printed Circuit Board) and a rechargeable battery are arranged in the shell, and a main control chip, a Bluetooth transceiving device, a key, an indicator lamp FPC (Flexible Printed Circuit), a clock circuit, a charging circuit, a storage device, a switching circuit, a card reading circuit, a signal acquisition circuit and an elastic needle flat cable are integrated on the PCB. The electrocardiograph monitor is small in size, convenient to use and good in waterproofness, data can be sent to mobile terminals such as a mobile phone through the Bluetooth receiving and transmitting device, monitored electrocardiograph dynamic waveforms can be displayed in real time, the electrocardiograph dynamic waveforms can be forwarded to a server in real time through a 4G module through a transfer device with a Bluetooth module, and the electrocardiograph dynamic waveforms can be displayed in real time through a USB interface of the transfer device with a charging function. Data is exported in a wired mode; the electrocardio monitoring device is adaptive to different electrocardio patches and different monitoring requirements, and the cost is reduced.

The application discloses a kind of production devices of outer inlay patch type drip irrigation belt, belong to drip irrigation belt production technical field, including base, workbench, extrusion equipment, electromagnetic punching equipment and dripper conveying device are installed on base, workbench is used to assemble drip irrigation pipe and dripper, extrusion equipment is used to transport plastic forming drip irrigation pipe, extrusion equipment is provided with closed annular output hole, electromagnetic punching equipment is located in the hollow structure of annular output hole, to be punched from inside to outside to the drip irrigation pipe formed, dripper conveying device is used to convey the dripper of outer inlay to workbench, and the output end of annular output hole and electromagnetic punching equipment is located in workbench, so that the punching communication of drip irrigation pipe and dripper and the pressing assembly of drip irrigation pipe and dripper are carried out simultaneously in workbench, and outer inlay patch type drip irrigation belt is formed.The present application realizes the full automation production of outer inlay patch type drip irrigation belt, solves the problem of low production efficiency of outer inlay type drip irrigation belt in prior art, and depends on manual assembly.

The invention relates to the technical field of underground casing pipe repairing, and discloses an underground casing pipe patch type repairing device and method.The underground casing pipe patch type repairing device comprises an underground casing pipe, the interior of the underground casing pipe is connected with connecting discs on the upper side through a hoisting mechanism arranged on the upper portion, and a connecting cylinder is connected between the upper connecting disc and the lower connecting disc through a rotating mechanism; repair can be achieved through the repair patch, the defect of extrusion forming repair is overcome, repair and pasting of the repair patch can be achieved at the angle positions in multiple directions, the repair efficiency is high, and repair is firm; the edge of the repairing patch can be glued, the edge of the pasted repairing patch can be sealed, the repairing firmness is improved, and it is guaranteed that other impurities cannot enter the space between the patch and the sleeve, and the repairing firmness is not affected; according to the repairing device, the repairing patch can be rolled and pressed in multiple directions and angles, so that the repairing patch is tightly attached to the surface of the sleeve, and the repairing efficiency is improved.

The invention discloses a surface-mounted transformer for a charging gun, and relates to the technical field of surface-mounted transformers, the surface-mounted transformer comprises a transformer main body, the lower side of the transformer main body is fixedly connected with a mounting seat, the left side and the right side of the mounting seat are fixedly connected with a plurality of pins, and the upper side of the mounting seat is fixedly connected with a fixed cover; the outer side of the fixing cover is fixedly connected with a cover plate, the upper side of the mounting seat is provided with a stabilizing unit for damping the pins, the stabilizing unit comprises a contact assembly, a control assembly and a damping assembly, and the contact assembly reinforces the pins. According to the patch type transformer for the charging gun, the fixing blocks, the stabilizing plates, the control rods, the side blocks, the lifting rods, the pressing blocks, dampers and screw rods are arranged, the screw rods are conveniently rotated, the multiple stabilizing plates are controlled to rotate, the pressing blocks reinforce pins, external vibration is reduced, the tightness of pin connection is improved, and poor contact of the pins caused by the external vibration is avoided.

1. The name of the design product: control module sealing glue group (patch type electronic detonator control module sealing glue group). 2. The use of the design product: the design product is used to produce a plurality of patch type electronic detonator control modules, and the patch type electronic detonator control modules produced are arranged in electronic detonators, so that the patch type electronic detonator control modules can control the detonation of the electronic detonators. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.

Automatic redeploying / upgrade of containers on multiple nodes using an Automated Deployment Software (ADS) having an Automated Deployment Tool (ADT) includes updating the ADS with a planned patch of a target layer, introducing a patchname sync command into the ADT to introduce a required patch type / specific patch and redeploy the containers, updating the ADT with a Producer Module (PM) and a Consumer Module (CM), running the ADT to cause the PM to update an image manifest item attribute, and push the image manifest item / new layer to a repository and running the ADT to cause the CM to read the image manifest item, identify and pull the unimpacted layers, and performing at least one of deploying / upgrading an application, or waiting for an available patch fix and deploying / upgrading the application.

The application discloses a kind of patch type performance detection method and system of opposite light photoelectric switch, the method includes: establishing three-dimensional parameter space and fitting logic conduction response surface;Control light blocking input quantity approaches surface boundary, utilize output response gradient field to construct stable margin surface, monitor its topological evolution with noise tolerance surface to determine logic flip time, to obtain hysteresis distance;Transient rising edge data under the use of step excitation is identified dynamic parameter, deduce reconfiguration waveform track and analyze dynamic response time;Hysteresis distance and dynamic response time are combined as performance vector to determine device performance grade.The application combines static topological analysis and dynamic model reconstruction, realizes the accurate comprehensive detection to photoelectric switch performance.

The application discloses a patch type high-power common mode inductor, which comprises a ring-shaped magnetic core and a wire winding wrapped around the magnetic core; the bottom surface of the magnetic core is symmetrically provided with a magnetic core boss, and the height of the magnetic core boss is greater than or equal to the outer diameter of the wire; a notch is arranged on the magnetic core boss in a spaced manner, and an electroplated layer is arranged on the inner wall of the notch; the wire winding comprises wire groups one and two with different models and insulating layers; the incoming and outgoing wires of the wire groups one and two are led out and placed in the notch, and the wire winding, the electroplated layer in the notch and the electroplated layer of a PCB are conductive through tinning welding. The magnetic core boss is arranged, the structure of the inductor shell, the wiring terminal and the partition plate can be cancelled, the volume of the common mode inductor is greatly reduced, and the volume of the finished product power supply is reduced; and the wire groups one and two with different models are selected, so that the overall voltage resistance of the common mode inductor is improved, and the safety requirement is better met.

The utility model relates to the field of electrical element temperature detection. A temperature detection device for electrical elements of an alloy melting furnace comprises a patch type thermal resistor 1, a normally open relay 2, a digital quantity output template and a PLC which are installed on each electrical element, each patch type thermal resistor comprises a first power supply input connector 12, a second power supply input connector 13 and a temperature signal connector 11, all the temperature signal connectors are connected in series and then connected to the PLC, and the PLC is connected with the normally open relay 2. A normally-open relay control line connector 21 of the normally-open relay 2 is connected with a digital quantity output template, the digital quantity output template is connected with a PLC, the normally-open relay 2 comprises a relay set A and a relay set B, and a first power input connector 12 of each patch type thermal resistor is connected to a contact of a normally-open contact of the relay set A.

The utility model discloses a printed circuit board (PCB) packaging structure of a double-row socket compatible with direct insertion and surface mounting, a surface mounting type welding area and a direct insertion type welding area are partially intersected, a plurality of groups of opposite surface mounting welding pads are uniformly distributed in the surface mounting type welding area, a plurality of groups of opposite through hole welding pads are uniformly distributed in the direct insertion type welding area, and a plurality of groups of through hole welding pads are uniformly distributed in the through hole welding pads. The edges of the surface-mounted bonding pad and the through hole bonding pad are overlapped, and the area where the surface-mounted bonding pad and the through hole bonding pad are located is a compatible welding area. According to the utility model, the switching between the direct insertion type socket and the patch type socket can be realized without changing the PCB or carrying out complex modification, so that the production period can be greatly shortened, the material cost is reduced, and the PCBA stacking flexibility is improved.