64 results about "Patch type" patented technology

The utility model belongs to the technical field of connecting wires, and particularly relates to an anti-interference patch type connecting wire, which comprises an insulating body, a battery core wire and connectors at two ends, the battery core wire comprises six copper alloy core wires, the six core wires are linearly arranged in the connectors at equal intervals, and the distance between the core wires is 1.27 mm so as to realize high-density connection. The pins are arranged on the connectors and connected with the two ends of the battery core wire, the pins are of trapezoidal structures, the lower portions of the pins are wide, the upper portions of the pins are narrow, the contact area between the pins and a circuit board bonding pad can be increased conveniently during welding, the battery core wire is wrapped in the insulation body, the shielding layer is further wrapped outside the battery core wire, electromagnetic interference is reduced, and the heat dissipation structures are arranged on the connectors and the insulation body. According to the connecting line, the connection density is improved, the requirements of miniaturization and integration of electronic equipment are met, the space of a circuit board can be effectively saved, the connection is stable and reliable, and the problems of looseness, unsoldering and the like are effectively prevented.

The utility model discloses a surface-mounted resistor CCD (Charge Coupled Device) detection device, which relates to the technical field of detection equipment and comprises a bottom plate, a control and calculation analysis unit, a feeding mechanism, a CCD detection camera, a discharging mechanism, a turntable and three supporting tables, the rotating disc is horizontally designed, the center of the bottom of the rotating disc is fixedly connected with the output end of the second motor, the edge of the rotating disc is rotationally connected with the bottom plate through a limiting piece, three through holes are evenly formed in the rotating disc, rotating shafts are rotationally arranged in the through holes, and a first motor is arranged at the position, corresponding to the through holes, of the bottom face of the rotating disc. According to the utility model, the CCD detection camera is used for shooting the surface-mounted resistor on the support table, and the support table can rotate by 360 degrees, so that the CCD detection camera can shoot and detect each side surface and upper surface of the surface-mounted resistor, the detection efficiency is greatly improved, the overall structure is simple, and the repair and maintenance are convenient.

The utility model discloses a patch type variable inductor, and relates to the technical field of variable inductors. The inductor comprises a base, a magnetic core is fixedly matched with one side of the base, and pins are wound around the periphery of the magnetic core in a matched mode. The winding part is fixedly matched with one side of the base, a T-shaped plate and two T-shaped blocks are elastically and slidably matched with one side of the winding part, an L-shaped plate is fixedly matched with the upper side of the T-shaped plate, and a rotating plate is rotatably matched between one side of the L-shaped plate and one side of each T-shaped block. According to the utility model, through the arrangement of the T-shaped plate, the rotating plate drives one side of the T-shaped plate to slide towards the direction of the base under the action of the T-shaped block, and the pin is positioned on the peripheral side of the winding part through the T-shaped plate, so that the effect of clamping and fixing the pin is achieved, and the problem that the pin falls off from the winding part is reduced.

1. Name of the designed product: electronic component (patch type). 2. Use of the designed product: the designed product is used as an electronic patch component welded on a circuit board. 3. Design points of the designed product: in shape. 4. Picture or photo best indicating the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design.

The application discloses a kind of based on machine vision's patch type infrared receiving head appearance detection method and system, belong to computer vision detection field.Method includes: through bottom collimating backlight source irradiation to be measured receiving head, utilize the image of two telecentric cameras of symmetrical arrangement Synchronous acquisition pin;Sub-pixel level feature positioning is carried out to image and rejects reflection false feature point;Based on binocular vision principle, reconstruct the three-dimensional space coordinates of pin end;Adopt lowest multipoint method to construct reference plane, calculate the vertical distance of each pin to reference plane as coplanarity deviation;Deviation and tolerance threshold are compared, and output determination signal.System includes object table, bottom collimating backlight source, double-side telecentric camera, hardware level synchronous trigger unit, image processing and three-dimensional reconstruction unit, coplanarity evaluation and determination unit.The application can high-precision measurement pin coplanarity, eliminate perspective distortion and stray light interference, suitable for on-line full inspection on automatic production line.

The utility model relates to the technical field of network interfaces, and discloses an integrated patch type network interface, which comprises a base, two sides of the base are provided with shell clamping blocks, and the tail parts of the shell clamping blocks are provided with shell pressing parts; the shielding shell is clamped and fixed with the base, and a clamping part matched with the shell clamping block is arranged on the shielding shell; the plurality of gold needles are fixed in the base in a surface-mounted manner, one end of each gold needle extends to form a pin, and the pins penetrate through the bottom of the base. The arranged base and the shielding shell are clamped and fixed through the shell clamping blocks and the clamping parts, the production process is simplified, a molding inner core does not need to be used, the production cost is reduced, and the production efficiency is improved. Meanwhile, the gold pins are fixed in the base in a patch mode, the structure is stable, and the signal transmission effect is good. In addition, due to the design of the concave structure of the pressing shell part, the elastic buckle structure of the shielding shell, the L-shaped bending structure of the gold needle and the like, the stability and reliability of the network interface are further enhanced, and the user experience is improved.

The utility model relates to the technical field of sound production instruments, and provides a patch type buzzer, which adopts a double-layer circuit board structure, a second circuit board is provided with a conversion element, and the conversion element and an electric appliance element on the second circuit board form a direct current-alternating current conversion circuit for converting direct current into alternating current. When the second circuit board and the first power connection board are stacked up and down, the conversion element is limited on the conversion element receding groove, so that the second circuit board abuts against the first power connection board, and when the buzzer adopts single-frequency sound production, the size of the buzzer can be designed to be smaller, and the buzzer can be more compact. When the volume of the buzzer is the same as that of a buzzer in the prior art, the internal space of the buzzer is relatively increased due to the fact that the second circuit board abuts against the first power connection board, and multi-frequency sound can be made.

The invention relates to the technical field of medical monitoring equipment, and particularly discloses patch type wireless monitoring equipment. A patch type wireless monitoring device comprises an adhesion substrate, an optical assembly used for reflective photoplethysmography and a wireless electronic module, the adhesion substrate comprises a circumferential adhesion fixing ring and an optical bin located in the center, and the circumferential adhesion fixing ring is provided with a medical pressure-sensitive adhesive adhesion layer. A glue-free window structure is arranged in a corresponding area of the optical bin; the optical bin is connected with the circumferential adhesion fixing ring through an annular elastic buffer connecting part, so that shear displacement generated by the circumferential adhesion fixing ring relative to the skin is absorbed by elastic deformation of the annular elastic buffer connecting part; the equipment shades and stabilizes a light path through a non-glue window and a labyrinth, absorbs and shears through an annular elastic buffer connecting part to reduce motion artifacts, enhances attachment, resists upwarp and discharges sweat and water by combining a wedge-shaped outer edge and a segmented notch with a micro air channel, and is convenient to replace and ensures alignment by matching with a guide slide-in lock catch and fool-proof positioning.

The utility model provides a patch type remote dynamic electrocardiogram recorder which comprises a shell, and the shell comprises a face shell and a bottom shell which are buckled together. A PCB (Printed Circuit Board) and a rechargeable battery are arranged in the shell, and a main control chip, a Bluetooth transceiving device, a key, an indicator lamp FPC (Flexible Printed Circuit), a clock circuit, a charging circuit, a storage device, a switching circuit, a card reading circuit, a signal acquisition circuit and an elastic needle flat cable are integrated on the PCB. The electrocardiograph monitor is small in size, convenient to use and good in waterproofness, data can be sent to mobile terminals such as a mobile phone through the Bluetooth receiving and transmitting device, monitored electrocardiograph dynamic waveforms can be displayed in real time, the electrocardiograph dynamic waveforms can be forwarded to a server in real time through a 4G module through a transfer device with a Bluetooth module, and the electrocardiograph dynamic waveforms can be displayed in real time through a USB interface of the transfer device with a charging function. Data is exported in a wired mode; the electrocardio monitoring device is adaptive to different electrocardio patches and different monitoring requirements, and the cost is reduced.

The application discloses a kind of production devices of outer inlay patch type drip irrigation belt, belong to drip irrigation belt production technical field, including base, workbench, extrusion equipment, electromagnetic punching equipment and dripper conveying device are installed on base, workbench is used to assemble drip irrigation pipe and dripper, extrusion equipment is used to transport plastic forming drip irrigation pipe, extrusion equipment is provided with closed annular output hole, electromagnetic punching equipment is located in the hollow structure of annular output hole, to be punched from inside to outside to the drip irrigation pipe formed, dripper conveying device is used to convey the dripper of outer inlay to workbench, and the output end of annular output hole and electromagnetic punching equipment is located in workbench, so that the punching communication of drip irrigation pipe and dripper and the pressing assembly of drip irrigation pipe and dripper are carried out simultaneously in workbench, and outer inlay patch type drip irrigation belt is formed.The present application realizes the full automation production of outer inlay patch type drip irrigation belt, solves the problem of low production efficiency of outer inlay type drip irrigation belt in prior art, and depends on manual assembly.

The invention relates to the technical field of underground casing pipe repairing, and discloses an underground casing pipe patch type repairing device and method.The underground casing pipe patch type repairing device comprises an underground casing pipe, the interior of the underground casing pipe is connected with connecting discs on the upper side through a hoisting mechanism arranged on the upper portion, and a connecting cylinder is connected between the upper connecting disc and the lower connecting disc through a rotating mechanism; repair can be achieved through the repair patch, the defect of extrusion forming repair is overcome, repair and pasting of the repair patch can be achieved at the angle positions in multiple directions, the repair efficiency is high, and repair is firm; the edge of the repairing patch can be glued, the edge of the pasted repairing patch can be sealed, the repairing firmness is improved, and it is guaranteed that other impurities cannot enter the space between the patch and the sleeve, and the repairing firmness is not affected; according to the repairing device, the repairing patch can be rolled and pressed in multiple directions and angles, so that the repairing patch is tightly attached to the surface of the sleeve, and the repairing efficiency is improved.

Automatic redeploying / upgrade of containers on multiple nodes using an Automated Deployment Software (ADS) having an Automated Deployment Tool (ADT) includes updating the ADS with a planned patch of a target layer, introducing a patchname sync command into the ADT to introduce a required patch type / specific patch and redeploy the containers, updating the ADT with a Producer Module (PM) and a Consumer Module (CM), running the ADT to cause the PM to update an image manifest item attribute, and push the image manifest item / new layer to a repository and running the ADT to cause the CM to read the image manifest item, identify and pull the unimpacted layers, and performing at least one of deploying / upgrading an application, or waiting for an available patch fix and deploying / upgrading the application.

The application discloses a kind of patch type performance detection method and system of opposite light photoelectric switch, the method includes: establishing three-dimensional parameter space and fitting logic conduction response surface;Control light blocking input quantity approaches surface boundary, utilize output response gradient field to construct stable margin surface, monitor its topological evolution with noise tolerance surface to determine logic flip time, to obtain hysteresis distance;Transient rising edge data under the use of step excitation is identified dynamic parameter, deduce reconfiguration waveform track and analyze dynamic response time;Hysteresis distance and dynamic response time are combined as performance vector to determine device performance grade.The application combines static topological analysis and dynamic model reconstruction, realizes the accurate comprehensive detection to photoelectric switch performance.

The application discloses a patch type high-power common mode inductor, which comprises a ring-shaped magnetic core and a wire winding wrapped around the magnetic core; the bottom surface of the magnetic core is symmetrically provided with a magnetic core boss, and the height of the magnetic core boss is greater than or equal to the outer diameter of the wire; a notch is arranged on the magnetic core boss in a spaced manner, and an electroplated layer is arranged on the inner wall of the notch; the wire winding comprises wire groups one and two with different models and insulating layers; the incoming and outgoing wires of the wire groups one and two are led out and placed in the notch, and the wire winding, the electroplated layer in the notch and the electroplated layer of a PCB are conductive through tinning welding. The magnetic core boss is arranged, the structure of the inductor shell, the wiring terminal and the partition plate can be cancelled, the volume of the common mode inductor is greatly reduced, and the volume of the finished product power supply is reduced; and the wire groups one and two with different models are selected, so that the overall voltage resistance of the common mode inductor is improved, and the safety requirement is better met.

The utility model discloses a printed circuit board (PCB) packaging structure of a double-row socket compatible with direct insertion and surface mounting, a surface mounting type welding area and a direct insertion type welding area are partially intersected, a plurality of groups of opposite surface mounting welding pads are uniformly distributed in the surface mounting type welding area, a plurality of groups of opposite through hole welding pads are uniformly distributed in the direct insertion type welding area, and a plurality of groups of through hole welding pads are uniformly distributed in the through hole welding pads. The edges of the surface-mounted bonding pad and the through hole bonding pad are overlapped, and the area where the surface-mounted bonding pad and the through hole bonding pad are located is a compatible welding area. According to the utility model, the switching between the direct insertion type socket and the patch type socket can be realized without changing the PCB or carrying out complex modification, so that the production period can be greatly shortened, the material cost is reduced, and the PCBA stacking flexibility is improved.

The invention relates to the technical field of integrated circuit manufacturing, in particular to a shaping and positioning device for a connecting board PCB of a surface-mounted LED digital display screen. Comprising a bottom plate, two fixed supporting plates are fixedly connected to the upper side of the bottom plate, two movable supporting plates are arranged on the upper side of the bottom plate, L-shaped plates are slidably connected to the positions, close to the two fixed supporting plates, of the bottom plate, and I-shaped plates are slidably connected to the sides, close to the fixed supporting plates, of the movable supporting plates through connecting rods; the positions, close to the two fixed supporting plates, of the L-shaped plate and the sides, close to the adjacent movable supporting plates, of the I-shaped plates are fixedly connected with extrusion rods through connecting rods, and the fixed supporting plates and the movable supporting plates are fixedly connected with L-shaped elastic pieces. According to the invention, the PCB is extruded by the L-shaped elastic pieces distributed along the circumferential direction of the PCB, so that the PCB is recovered and kept in a straight state, the shaping and positioning of the PCB are synchronously completed, the shaping process does not need to be added, the production cost is saved, the overall steps of assembling the PCB and the shell are reduced, and the production efficiency is improved.

The present application provides a circuit protection device, comprising: a patch type thermistor element including a first electrode and a second electrode; a first heat dissipation terminal connected with the first electrode; a second heat dissipation terminal connected with the second electrode; and a housing protecting the thermistor element, the first heat dissipation terminal and the second heat dissipation terminal. The circuit protection device according to the present application having an SMD (Surface Mount Device) structure can be applied to an ultra-thin wall-mounted television.

The utility model provides a heat accumulation prevention paster type LED lamp bead, which comprises a fast-assembly structure, the fast-assembly structure comprises a push plate, two ends of the push plate are rotatably connected with pull rods, one end of each pull rod is rotatably connected with a rotating plate, one side of the rotating plate is provided with a fitting hole, and the inner wall of the fitting hole is fitted with the outer wall of a conductive column. According to the utility model, through the arrangement of the quick-mounting structure, the surface-mounted LED lamp bead can be quickly mounted on the top of the circuit board, the push plate is pushed inwards to drive the pull rod to rotate, the rotating plate is pulled to rotate inwards and extrude the reset spring, the push plate is loosened after the fitting hole is aligned with the conductive column, and the reset spring drives the rotating plate to reset, so that the surface-mounted LED lamp bead can be quickly mounted on the top of the circuit board. And then, the inner wall of the attaching hole is attached to the outer wall of the conductive column, so that the corresponding surface-mounted LED lamp beads can be quickly mounted on the top of the circuit board.

The utility model discloses a magnetic coupling mechanism based on a bipolar track wireless power supply system, which belongs to the field of wireless power supply and comprises a picker consisting of a magnetic core and a coil wound on the magnetic core. Compared with the prior art, the device has the advantages that the transverse surface ends of the concave magnetic frame and the inverted L-shaped supporting frame are connected through the patch type insertion structure, and the conical clamping plates on the two sides of the inner wall of the opening end of the concave magnetic frame are clamped with the conical clamping grooves in the transverse surface ends of the inverted L-shaped supporting frame; the concave magnetic frame is arranged in the concave magnetic frame, so that the concave magnetic frame cannot generate angle deviation, the conical clamping plate is fixed and cannot slide off due to vibration by obliquely inserting a positioning pin rod into the side wall of the conical clamping plate and the side wall of the conical clamping groove, and the position of the positioning pin rod is locked through a threaded column at the outermost end of the positioning pin rod.

Fixed patching protocols waste memory resources and increase boot-up latency. In contrast, example implementations include a patch controller that receives a stream of multiple patch units from a non-volatile patch memory. The patch controller parses a descriptor patch unit, which precedes a set of patch units in the stream. From the descriptor patch unit, the patch controller extracts a ROM-patch type and a count. The type indicates whether the succeeding set of patch units includes fully associative patch units, direct-mapped patch units, or a combination. The count indicates the quantity of patch units of each type following the descriptor. Based on the extracted type and count, the patch controller processes the stream by routing the patch units to a fully associative memory or a direct-mapped memory. This streaming protocol enables flexible allocation of patch resources, reduces storage overhead in non-volatile memory, and shortens boot-up time by supporting an end-of-stream marker.

The invention discloses an ultra-thin infrared temperature measurement module and a detection method thereof, and relates to the technical field of temperature measurement modules, the ultra-thin infrared temperature measurement module comprises an infrared temperature measurement circuit board assembly, the infrared temperature measurement circuit board assembly comprises a circuit board substrate, a patch type indium gallium arsenic infrared detector fixedly connected to the upper surface of the circuit board substrate, a signal processing unit and a connector; the metal shell is provided with a containing cavity, an opening communicated with the containing cavity is formed in the upper surface of the metal shell, the infrared temperature measurement circuit board assembly is contained in the containing cavity, and the light sensing face of the patch type indium gallium arsenic infrared detector faces the opening. By designing the layout structure that the patch type indium gallium arsenic infrared detector and all components are arranged on the same side of the circuit board substrate, single-face welding and single-face protection of the module are achieved, and the problems that due to a traditional plug-in type detector and double-face layout, the thickness of the module is large, and the production process is tedious are solved.

The invention relates to the technical field of alloy resistance diverter processing, and discloses a bonding pad structure for a patch type alloy resistance diverter, which comprises a circuit board, first bonding pads are symmetrically and fixedly mounted on one side of the circuit board, second bonding pads are symmetrically and fixedly mounted on the other side of the circuit board, the first bonding pads and the second bonding pads are rectangular, and the first bonding pads and the second bonding pads are rectangular. The rectangular corner of the first bonding pad and the rectangular corner of the second bonding pad are respectively provided with a first fillet, the top of the first bonding pad and the top of the second bonding pad are respectively provided with a second fillet, and the bottom of the first bonding pad and the bottom of the second bonding pad are respectively provided with a third fillet. The first bonding pad bears main loop current, and the second bonding pad acquires voltage detection signals, so that additional resistors such as inherent resistance and soldering contact resistance of a copper electrode are prevented from being mixed into a detection loop, temperature drift of the copper electrode mainly affects a current conduction loop when temperature changes, and acquired voltage drop is closer to real voltage drop of the shunt body.

1. The name of the design product: control module (patch type electronic detonator control module). 2. The use of the design product: the design product is used to package and form multiple patch type electronic detonator control modules, and the patch type electronic detonator control modules produced are arranged in electronic detonators. The patch type electronic detonator control module can control the detonation of the electronic detonator. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: design 5 perspective view. 5. Design 1 is designated as the basic design.

The invention discloses a surface-mounted production method of a pyroelectric sensor, and relates to the technical field of sensor manufacturing, and the surface-mounted production method comprises the following steps: manufacturing a PCB bottom plate, and carrying out the backflow installation of a pyroelectric conditioning chip; dispensing a conductive adhesive material on the PCB bottom plate, fixing the supporting column, and drying and curing; dispensing a conductive adhesive material on the top of the support column, fixing the pyroelectric crystal, and drying and curing the pyroelectric crystal; dispensing conductive silver paste on the edge of the PCB bottom plate, attaching a PCB enclosure, drying and curing; and mounting an optical filter on the PCB enclosure, pouring an adhesive around the optical filter, and drying and curing the optical filter. The pyroelectric sensor produced or manufactured by using the patch type production method has the characteristics of low cost, high reliability and excellent electromagnetic shielding performance, and the production method also has the characteristic of high process compatibility.

1. Name of the product in this design: Positioner (Patch type). 2. Purpose of this design: for location tracking. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The utility model relates to the technical field of electronic component, specifically is a kind of resonator, including resonator body, the bottom side of resonator body is equipped with mounting structure, the mounting structure includes substrate, the bottom side of resonator body is equipped with substrate, two contact pins are vertically installed on the substrate, the bottom side of the substrate is fixedly connected with base, one arc slot is respectively set up in the both sides of base, the end of contact pin is located in arc slot, one hanger board is respectively fixedly connected in the both ends of base, the bottom side of base is connected with protection structure;By setting up the bending slot of arc on base, so that contact pin can be bent according to the need of installation, conversion between the two kinds of installation mode of straight insertion type and patch type is realized, and the installation flexibility of resonator is improved.

The utility model discloses a cylinder body with two outer track grooves for an embedded patch type dripper screening machine. The cylinder body comprises an upper ring body, a lower ring body, a flow guide plate, a first infrared probe and a second infrared probe, the device is characterized in that an upper panel of the lower ring body is provided with an inner-ring outer track groove and an outer-ring outer track groove, and a flow guide groove is sequentially connected with the inner-ring outer track groove, the outer-ring outer track groove and a track groove of a conveying track fixed on a conveying track mounting groove; a top pressing device and a wrong dropper removing device are arranged on an upper panel of the upper ring body at the inlet end of the outer track groove of the inner ring; the first infrared probe is located above the inner ring outer rail groove on the rear side of the wrong dropper removing device. The second infrared probe is located above the inner ring outer rail groove in the front side of the jacking device. The device is installed in an embedded patch type emitter screening machine for use, patch type emitters with incorrect placement positions can be removed, and the placement positions of all patch type emitters adhered to the inner wall of a pipe belt are ensured to be correct.

The utility model provides a patch type hollow ion selective electrode, which comprises a substrate electrode and an electrode patch (42), the front of the substrate electrode is provided with a front conductive circuit (2) and an electrode loading area (1), the front conductive circuit (2) is provided with one or more than one via hole (24), and the electrode loading area (1) is provided with one or more than one electrode loading area (2). The electrode loading area (1) comprises an electrode detection layer and a first hollow hole (13), the first hollow hole (13) penetrates through the front surface and the back surface of the substrate electrode, and an anti-overflow structure is arranged on the outer side of the electrode loading area (1); and the electrode patch (42) is fixedly arranged on the back surface of the substrate electrode and completely covers the position of the first hollow hole (13).

The invention relates to a chip patch type tin planting method and a tin planting device. The tin planting device comprises a cleaning mechanism, a tin planting mechanism and a detection mechanism, the cleaning mechanism comprises a first conveying mechanism and a plurality of cleaning assemblies, and the first conveying mechanism is provided with a mounting seat relative to the cleaning assemblies; the tin planting mechanism comprises a second conveying mechanism, a net placing structure, a tin planting structure and a heating structure, a plurality of positioning seats are arranged on the second conveying mechanism, and a net collecting structure is arranged at the position, close to the second transferring structure, of the cooling discharging part; and the detection mechanism comprises a third transmission mechanism and a plurality of detection structures, and the chips sequentially pass through the plurality of detection structures under the action of the third transmission mechanism. The invention aims to rapidly and stably plant tin on chips of different models.

The invention discloses a rotary implanting device for an integrated frame of a surface-mounted component and a working method thereof, and relates to the technical field of chip multilayer ceramic capacitor component production equipment.The rotary implanting device comprises a vibration platform, supporting seats are fixedly installed on the front portion and the rear portion of the upper end of the vibration platform, and trays are installed above the supporting seats and used for positioning and fixing end sealing plates; a cover plate frame is arranged above the tray, the two sides of the cover plate frame are rotationally matched with the supporting base through rotating connecting arms, a fixing frame is fixedly arranged on the lower end face of the cover plate frame, a guide-in plate is installed in the cover plate frame, and a plurality of implanting holes are formed in the area, corresponding to the end sealing plate, of the guide-in plate; the front end of the leading-in plate and the front portion of the cover plate frame form a material box area, the two sides of the upper end face of the supporting base are each provided with an end sealing plate limiting mechanism, and the problems that the machining requirement of the joint position of the cover plate frame and the material box is high, maintenance is difficult, material leakage is caused by a joint gap, vibration transmission is unstable, and chip feeding and discharging are inconsistent are solved.