384results about How to "Increase heat radiation" patented technology

An LED lighting device comprises: a thermally conducting body having an at least one opening that connects with a cavity within the body and a plurality of LEDs mounted in thermal communication with a face of the body and positioned around the opening. One or more passages pass through the body from the cavity to an outer surface of the body and are configured such that in operation air moves through the cavity by thermal convection thereby to provide cooling of the body. Each passage is configured in a direction that extends in a direction at an angle of about 45° to a line that is parallel with the axis of the body toward the outer surface of the body away from the face. The body can be configured such that its outer surface has a form factor resembling an incandescent light bulb or halogen reflector lamp.

An engine control circuit device which has higher heat resistance and can be installed in a place exposed to severe thermal environments. In an engine control circuit device comprising a circuit board on which a plurality of packaged electronic parts are mounted, and a connector mounted on the circuit board for connection to an external circuit, the device further comprises a resin portion formed of a thermo-setting resin and covering the connector except for a connecting portion thereof and the circuit board, and a cooling pipe integrally molded in the resin portion and allowing a coolant to flow through it, thereby cooling the resin portion.

In order to provide a semiconductor apparatus in which both semiconductor chips and interposers are provided on a carrier tape, electrical properties can be improved using short wiring in a wiring pattern substantially symmetric with respect to the semiconductor chips, production can become easier, and compactness and heat radiation can be improved. Semiconductor chips electrically connected to wiring formed on the carrier tape, and interposers on the carrier tape and surrounding the semiconductor chips, are provided next to each other.

An FPC includes: a base film including a first metal sheet; a first adhesive layer laminated on one of surfaces of the base film; and a conductor pattern bonded by the first adhesive layer; wherein a plurality of planar portions held in a planar shape and bending portions to be bent provided between the planar portions are arranged in a longitudinal direction, and the conductor pattern is covered by a metal support cover film including a second metal sheet and a second adhesive layer at the planar portions and is covered by a solder resist at the bending portions.

The invention relates to heat insulating and energy saving coating used for the vehicle, and the preparation method thereof. The invention takes organic resin film forming material as the main material, the coating at least includes infrared reflection pigment, hollow ceramic micro-spheres and silicon dioxide aerogel, an organic resin film having low sunlight absorption rate is formed in the coating through the organic resin film forming material with high transparency, the visible light and the near infrared ray in the sunlight are reflected through the infrared reflection pigment, the rutile type titanium dioxide and the hollow ceramic micro-spheres, and simultaneously a compact vacuum layer and an inert gas layer are formed on the surface of a coated object through the hollow ceramic micro-spheres and the silicon dioxide aerogel, so as to effectively isolate the radiant heat of the sun, and to reduce the heat conduction of air, and finally the heat insulating and energy saving coating used for the vehicle is formed, which not only can effectively reflect the energy in the sunlight, but also can effectively isolate the radiant heat of the sun and reduce the heat conduction of air, and simultaneously has good weather resistant performance, chemicals resistant performance, mechanical property and decorative property.

A lighting apparatus including a base with a coupling rim and a supporting plate and a housing coupled to the coupling rim such that the supporting plate is covered. The housing includes a channel part to guide air in and an air introduction hole to introduce the guided air into an inner space of the housing. A cooling fan is included and is disposed on an upper surface of the supporting plate covered by the housing, wherein the cooling fan draws air introduced through the air introduction hole into the inner space of the housing, and discharges the in-drawn air outside through an air discharging hole in the base. A light source module is included and mounted on a lower surface of the supporting plate, wherein the channel part provides a region depressed in a stepped manner along an outer surface of the housing.

Provided is a non-pneumatic wheel (100) for a vehicle, and a wheel (100), suspension (200; 200-1), and tire (300) used therein that are capable of ensuring driving stability because there is no air chamber between a wheel (100) and a tire (300) to blowout. They are also capable of ensuring good road holding, preventing standing waves, reducing brake fade and cornering force, providing good handling and ride comfort, staying quiet when rolling, and are economical and environmentally friendly. The non-pneumatic wheel (100) includes a wheel (100), a shock absorbing member (220; 220-1) coupled to an outer periphery of the wheel (100) and absorbing or attenuating noise and vibration due to external shock, a plurality of resilient members (230; 230-1; 230-2) arranged around and coupled to an outer periphery of the shock absorbing member (220; 220-1) in a radial direction and having a plurality of resilient rings (230-1a) that are resiliently deformed in response to an external force, resilient links (240) respectively coupled to the resilient rings (230-1a) to evenly transmit external shock to the resilient rings (230-1a), rail plates (270) to which sliders (261) formed at both ends of the resilient links (240) are slidably coupled, and a tire (300) having a plurality of coupling grooves (321) formed along an inner periphery such that the rail plates (270) are inserted into the coupling grooves (321).

A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

A member (12A) for use in an electronic circuit has a thermally conductive layer (22) mounted on a heat sink (20). The thermally conductive layer (22) comprises an insulating substrate (24), a first joint member (26) joining the insulating substrate (24) to the heat sink (20) and containing an active element, a second joint member (28) disposed on the insulating substrate (24), and an electrode (30) disposed on the second joint member (28). The insulating substrate (24) comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members (26, 28) is made of a hard brazing material containing an active element. The heat sink (20) is made of an SiC/Cu composite material or a C/Cu composite material.

An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.

To improve the productivity of manufacturing semiconductor devices having a heat sink, the semiconductor device manufacturing method includes: (a) setting an integral heat radiation body set 30 of multiple heat radiation bodies 32 in a mold 40 cavity 42; (b) setting a substrate 10 on which multiple semiconductor chips 20 are mounted in a planar arrangement in the mold 40 so that the multiple semiconductor chips 20 are located inside the cavity 42; and (c) sealing the multiple semiconductor chips 20 and affixing the heat radiation body set 30 by filling the cavity 42 with a sealant.

A bearing for supporting rotation of either of a rotor and a planetary gear is supported by a wall disposed between a motor housing and a gear case room. The wall is provided with an opening allowing lubricating oil splashed by a gear to be splashed onto an upper portion of a stator. Some of the lubricating oil passes through an oil passage placed at a central portion of a shaft and through an oil passage provided at a planetary carrier, and is then splashed through the opening onto an outer periphery of a stator coil. Furthermore, the lubricating oil is also splashed by a pinion gear, and is similarly splashed through the opening onto the stator coil and an inner peripheral wall of the motor housing. Accordingly, the stator coil and the stator core are cooled.

A spread illuminating apparatus includes: a light conductor plate; at least one LED disposed at a side surface of the light conductor plate; an FPC including a substrate and first and second conductive patterns formed respectively at the front ad rear surfaces of the substrate; and a heat radiating plate to hold the FPC. The LED is mounted on electrode pads formed at the first conductive pattern of the FPC, and all the side faces of the LED are covered with an individual thermal conductor enclosure which is connected to the second conductive pattern via an opening formed at the substrate of the FPC. Thus, a heat radiation system is established from the side faces of the LED through to the heat radiating plate which is affixed to the rear surface of the FPC.

A semiconductor light emitting device can include a base having a cavity provided for housing an LED chip and a resin spacer therein. The resin spacer can be composed of at least two layers of spacers including a transparent resin spacer and a wavelength conversion spacer mixed with a fluorescent material and formed to have an almost constant thickness. The wavelength conversion spacer can include a metallic radiation mesh or radiation wire disposed therein.

An evaporation source and method for depositing a thin film, including a crucible having a predetermined space for placing a deposition material and at least one baffle, the baffle positioned inside the crucible and parallel to the predetermined space to divide the crucible into a plurality of channels, a heating unit, and at least one spray nozzle in fluid communication with the crucible, the spray nozzle having a plurality of spray orifices.

In a pulley assembly, an annular joint member made of a high polymer material is disposed between an outer ring of a bearing and a light metal pulley. The joint member has a coefficient of thermal expansion larger than that of the pulley. The outer ring has a coefficient of thermal expansion smaller than that of the pulley. The pulley has an annular boss, an annular rim, and a plurality of spokes which have side faces each consisting of a surface parallel to an axial direction of the pulley. Front faces of the spokes are positioned on one identical imaginary surface of revolution, and rear faces of the spokes are also positioned on one identical imaginary surface of revolution.

A cooling system is equipped with a circulation flow path arranged to flow a coolant into an engine, a motor drive system flow path branched off from the circulation flow path and arranged to flow the coolant into a motor drive system, a flow rate distribution regulator provided at a junction of the circulation flow path and the motor drive system flow path, and an electric pump configured to pressure-feed the coolant through the circulation flow path. In the cooling system, the procedure of flow rate control sets an engine flow rate demand Vwe based on a rotation speed Ne and a torque te of the engine and a coolant temperature Te (step S110), while setting a motor flow rate demand Vwm based on an inverter current Iinv of the motor drive system and the coolant temperature Te (step S120). The flow rate distribution regulator and the electric pump are then controlled to make a flow rate of the coolant flowed into the engine and a flow rate of the coolant flowed into motors and inverters included in the motor drive system respectively equal to the set engine flow rate demand Vwe and the set motor flow rate demand Vwm (steps S130 and S140).

A resin-sealed type semiconductor device has a mount stage, a semiconductor chip mounted on the stage such that a rear surface of the chip is in contact with the stage, a heat spreader associated with the stage and the chip, and a molded resin package encapsulating the stage, chip, and heat spreader. The stage is configured such that the rear surface of the chip is partially covered with the stage, whereby uncovered areas are defined on the rear surface of the electronic component. The heat spreader is complementarily configured with respect to the stage so as to be in direct contact with the uncovered areas of the rear surface of the electronic component, whereby an entire thickness of both the mount stage and the heat spreader is smaller than a total of a thickness of the mount stage and a thickness of the heat spreader.

A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.

The present invention relates to a production method of foundry shaped coke and its equipment system for producing said foundry shaped coke. Said method includes the procedures of preparing material,pulverizing, cold stirring, hot stirring, forming and carbonization and coking, and its equipment system includes material-preparing chamber, pulverizing machine, cold stirring machine, hot stirring machine, forming machine and carbonizing furnace, etc.

An electronic control unit (ECU) includes onboard type electronic components and non-onboard type electronic components inside an aluminum case. The ECU has a circuit board for mounting the onboard type electronic component in a first portion of a bottom surface, and a concavity for installing the non-onboard type electronic components in a second portion of the bottom surface. A resinous frame is provided in the concavity to house and hold the non-onboard type electronic components.