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35results about How to "Assist in heat dissipation" patented technology

LED Based Lamp

A lamp comprises: a thermally conductive body; a plurality of LEDs configured as an array and mounted in thermal communication with the body and a light reflective hood located in front of the plane of light emitting diodes. The hood has at least two frustoconical light reflective surfaces that surround the array of LEDs and are configured such that in operation light emitted by the lamp is within a selected emission angle (beam spread). The hood is configured such that in operation a variation in illuminance (luminous flux per unit area incident on a surface) is 10% or less over approximately a third to one half of the selected emission angle.
Owner:INTEMATIX

Motor endshield assembly for an electronically commutated motor

An endshield assembly for an electronically commutated motor includes an endshield, a control assembly, and a power assembly. The endshield includes a plurality of recessed fins on an outer surface, and a substantially flat raised portion on an internal surface. The raised portion is in contact with a thermal pad. The control assembly includes the thermal pad and a control board on which is located a plurality of power transistors. The thermal pad provides thermal contact between the transistors and the endshield to enable the endshield to dissipate heat from the transistors. The transistors include a plurality of leads that extend substantially parallel to the control board which enable the leads to be coated for protection against harsh external environments. The power assembly includes a power board having an insulator positioned between the power board and the control board.
Owner:GENERAL ELECTRIC CO

Shielded and insulated heat removing system

Various embodiments disclose a shielded or isolated heat dissipating system comprising a case, a heat sink base, and a circuit board comprising at least one electronic device for which heat dissipation is desired. The heat sink base is attached to the case and together with the shielding case defines an enclosed space within which electromagnetic interference is reduced. Both heat-dissipation function and electromagnetic shielding function may be achieved by the combination of the heatsink base and the case while maintain electrical isolation with one or more specially treated components. The space required for mounting the system may also be reduced without adversely affecting normal and stable operation of the electronic device.
Owner:SHENZHEN MINDRAY BIO MEDICAL ELECTRONICS CO LTD

Optical device and system for solid-state lighting

An optical device for transforming an input light distribution from an LED light source to provide an omni-directional output light distribution for solid-state lighting is disclosed. The optical device has a conical form, comprising first and second coaxial cones of different refractive index, defined by coaxial inner and outer cone surfaces, which converge from a cone base to a rounded tip at the apex. Preferably, each of the inner and outer cone surfaces comprises a plurality of conical facets defining a grating structure. The inner cone, i.e. air cavity, is directly coupled to an LED emitter area. Cone angles and spacings of conical facets, defining inner and outer gratings, are tailored to reshape a predetermined input light distribution. Apertures assist in heat dissipation. A lightweight, compact device with high transmission efficiency can be manufactured at low cost by one-step injection molding from an optical-grade polymer, such as PMMA.
Owner:1947796 ONTARIO INC

3-D Integrated Circuit Lateral Heat Dissipation

By filling an air gap between tiers of a stacked IC device with a thermally conductive material, heat generated at one or more locations within one of the tiers can be laterally displaced. The lateral displacement of the heat can be along the full length of the tier and the thermal material can be electrically insulating. Through silicon-vias (TSVs) can be constructed at certain locations to assist in heat dissipation away from thermally troubled locations.
Owner:QUALCOMM INC

Indefectible cable and manufacturing process thereof

An indefectible cable comprises a cable jacket with cable cores arranged in an inner cavity thereof and a metal ring sleeved on an outer wall thereof. Both ends of the cable jacket are fixedly connected with an anti-extrusion device respectively, through which the cable cores are led out from through-holes. The anti-extrusion device has a metal housing with plastic lining. With the arrangement of a buffer device, the externally applied pressure on the cable is relieved to reduce the damage thereof.
Owner:YUFENG TECH CO LTD

Electronic device with a heat insulating structure

An electronic device includes a circuit board and a heat insulating structure. The heat insulating structure includes a heat source, an enclosure for covering the heat source, and a heat insulating plate disposed on a side of the enclosure facing to the heat source for preventing heat generated by the heat source from directly transmitting toward the enclosure, and a space being formed between the heat insulating plate and the enclosure. The heat insulating structure further includes a thermal conductive layer disposed on a side of the heat insulating plate facing to the heat source. The heat insulating structure further includes the thermal conductive layer disposed on a side of the heat insulating plate facing to the enclosure. Therefore, the heat insulating plate can be for altering heat current generated by the heat source so as to dissipate the heat current via holes on the enclosure uniformly.
Owner:GEMTEK TECH CO LTD

LED module

The invention is concerned with the light-emitting diode module group, includes the metal circuit board and the complex number of light-emitting diode grain. The metal circuit board includes the metal plate, the first dielectric layer and the circuitry layer orderly; the first dielectric layer is with the complex number of hatch; where the light - emitting diode grain set on and they connects with the circuitry layer by electricity. The invention resolves the problem of thermolysis prolongs the light-emitting diode module group life-cycle and ensures the quality of the production by reinsuring the heat energy generated by the light-emitting diode grain can be transmitted to the metal plate through the base board directly, which can reduce the temperature of the light-emitting diode component.The complex number of hatch can use as the enveloping outskirts of the packaging process and the setting up of the light-emitting is just simple set on the metal basal board, both can reduce the making step of the packaging process and the module forming and their time consuming.
Owner:GIGNO TECH CO LTD

Chip scale package structure and fabrication method thereof

A chip scale package (CSP) structure and the packaging process thereof are described. By using a matrix of interlinked heat sink units compatible with the block substrate, the packaging process can be simplified and a plurality of packages units or chip scale packages with enhanced thermal performance can be obtained after singulation.
Owner:ADVANCED SEMICON ENG INC

LED module

The invention is concerned with the light-emitting diode module group, includes the metal circuit board and the complex number of light-emitting diode grain. The metal circuit board includes the metal plate, the first dielectric layer and the circuitry layer orderly; the first dielectric layer is with the complex number of hatch; where the light - emitting diode grain set on and they connects with the circuitry layer by electricity. The invention resolves the problem of thermolysis that prolongs the light-emitting diode module group life cycle and ensures the quality of the production by reinsuring the process of the heat energy generating of the light-emitting diode grain can be transmitted to the circuitry layer or the metal plate through the base board directly that reduces the temperature of the light-emitting diode component.
Owner:GIGNO TECH CO LTD

Heat dissipation assembly

A heat dissipation assembly includes a heat sink and a fan. The heat sink device has a base and a plurality of fins formed on the base, the fins are parallel with each other, one or more of the fins cooperatively form at least two concave engagement parts. The fan has at least two elastic arms extending from middle positions of two opposite sides of the fan, an engagement hook is formed at an end of the at least two arms. The at least two engagement hooks are engagable with the at least two engagement parts, for fastening the fan on the heat sink device.
Owner:CLOUD NETWORK TECH SINGAPORE PTE LTD

Ceiling mount lamp having a fixing structure capable of assisting heat dissipation

A ceiling mount lamp having a fixing structure capable of assisting heat dissipation is disclosed. The ceiling mount lamp includes a fixing unit including a frame body and a back plate, and a lighting unit installed between the frame body and the back plate. At least one side of the light guide plate is provided with a circuit board on which an LED unit is disposed, and at least one side between the frame body and the back plate of the fixing unit is mounted with a U-shaped fixing member. One outer surface of the U-shaped fixing member is fastened with the circuit board, and another outer surface of the U-shaped fixing member is provided with at least a hook part, which provides an elastic force to push against the circuit board and the LED unit, such that the LED unit is pressed close to the light guide plate.
Owner:ELSA OPTICAL TECH +1

LED illumination device

A light emitting diode (LED) illumination device includes a vapor chamber, a circuit board and at least one LED. At least one protrusion is formed on a surface of the vapor chamber, and a heat conducting tin layer is formed on the protrusion. The circuit board includes at least one through hole for passing the protrusion. The circuit board is formed by sequentially stacking an insulating layer and a heat conducting layer. The LEDs are installed on and contacted with the protrusions respectively, and each LED has two pins electrically connected to the circuit board. The LED device of the present invention is in a direct contact with the protrusion of the LED, such that the heat dissipated from the LED can be conducted to the vapor chamber, and then the vapor chamber carries away the heat quickly.
Owner:PYROSWIFT HOLDING CO LIMITED

Aluminum high bay design

The present invention relates to different embodiments of high bay lighting fixtures comprising many improved features, such as the ability to dissipate heat from a light source in a non-traditional manner. One such example is the elimination of a traditional heat sink by placing housings and / or a heat spreader plate in thermal contact with the light emitting elements. By doing so, the housings and / or heat spreader plate can dissipate heat from the light emitting elements and spread it throughout the lighting fixture. Different embodiments also help dissipate heat from the light source by spreading out the light emitting elements. Other embodiments improve heat dissipation by using air slots, so that heat can more easily escape from the lighting fixture. Still another example of dissipating heat from the light source can be to use heat fins.
Owner:IDEAL IND LIGHTING LLC

Battery pack

The invention provides a battery pack comprising a battery cell assembly and a heat dissipation assembly. The battery cell assembly comprises a battery cell array and a channel arranged in the battery cell array. The battery cell array is formed by arranging a plurality of cells in a certain form. The channel is enclosed by N cells, wherein N>2. The heat dissipation assembly comprises a heat-absorbing member arranged in the channel. The heat-absorbing member comprises N side walls, wherein the N side walls respectively abut against the side walls of the N battery cells. Compared with the prior art, the battery pack has the advantages that the battery pack assists the battery cell assembly in heat dissipation through the heat dissipation assembly, which can make the temperature of each area of the battery cell assembly more balanced.
Owner:GLOBE (JIANGSU) CO LTD
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