LED module

A technology of light-emitting diodes and modules, applied in electrical components, electric solid-state devices, circuits, etc., can solve the problems of inconvenience, no heat dissipation path, and shortened service life, so as to reduce steps and time, ensure luminous quality, and prolong service life Effect

Inactive Publication Date: 2008-01-09
GIGNO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the temperature of the LED element 20 is not immediately assisted, it will affect the luminous efficiency of the LED grain 22, and even shorten its service life.
In the prior art, the heat energy generated by each LED chip 22 can only be conducted from the bump 221 to the carrier board S through the lead frame 23 in the same way as the electrical connection, and there is no other heat dissipation path. , so it obviously cannot meet the requirement of having LED module 10
[0009] It can be seen that the a

Method used

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Example

[0088] The first embodiment

[0089] First, please refer to FIGS. 3 to 10 to illustrate the first embodiment of the light-emitting diode module of the present invention.

[0090] Please refer to FIG. 3, which is a perspective view of the light emitting diode module according to the first embodiment of the present invention. The light-emitting diode module 30 includes a circuit substrate 31 and a plurality of light-emitting diode dies 32. It should be noted that the number and arrangement of the LED dies 32 of the LED module 30 are not limited. In this embodiment, the LED dies 32 are arranged in an array as an example for description. Of course, each LED dies 32 can also be arranged in a straight line.

[0091] Please refer to FIGS. 3 and 4 at the same time. FIG. 4 is a schematic cross-sectional view of the light-emitting diode module according to the first embodiment of the present invention along the BB section line in FIG. 3 to illustrate the configuration of each light-emitti...

Example

[0103] Second embodiment

[0104] Next, please refer to FIGS. 11 to 16 to illustrate the second embodiment of the light emitting diode module of the present invention.

[0105] Please refer to FIG. 11, which is a schematic diagram of a light emitting diode module according to a second embodiment of the present invention. The light emitting diode module 40 includes a circuit board 41 and a plurality of light emitting diode elements 42. Among them, the circuit substrate 41 has the same technical features and functions as the circuit substrate 31 in the first embodiment, so it will not be repeated here.

[0106] The light emitting diode module 40 may further include a driving circuit 44 disposed on the circuit substrate 41 and electrically connected to the light emitting diode elements 42 to drive the light emitting diode elements 42. Among them, the driving circuit 44 has the same technical features and functions as the driving circuit 34 in the first embodiment, so it will not be ...

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Abstract

The invention is concerned with the light-emitting diode module group, includes the metal circuit board and the complex number of light-emitting diode grain. The metal circuit board includes the metal plate, the first dielectric layer and the circuitry layer orderly; the first dielectric layer is with the complex number of hatch; where the light - emitting diode grain set on and they connects with the circuitry layer by electricity. The invention resolves the problem of thermolysis prolongs the light-emitting diode module group life-cycle and ensures the quality of the production by reinsuring the heat energy generated by the light-emitting diode grain can be transmitted to the metal plate through the base board directly, which can reduce the temperature of the light-emitting diode component.The complex number of hatch can use as the enveloping outskirts of the packaging process and the setting up of the light-emitting is just simple set on the metal basal board, both can reduce the making step of the packaging process and the module forming and their time consuming.

Description

technical field [0001] The invention relates to a light-emitting module, in particular to a method for quickly transferring heat energy generated by light-emitting diode crystal grains, assisting light-emitting diode grains to dissipate heat, prolonging the service life of light-emitting diode modules, ensuring luminous quality, and reducing packaging process and assembly Process steps and time for LED modules. Background technique [0002] A light-emitting diode is a light-emitting element made of semiconductor materials. The element has two electrode terminals. A voltage is applied between the terminals, and a very small voltage is passed through. Through the combination of electron holes, the remaining energy can be excited in the form of light. released. [0003] Different from ordinary incandescent light bulbs, light-emitting diodes are cold-emitting, which have the advantages of low power consumption, long life of components, no need for warm-up time, and fast respons...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L25/00H01L23/36H01L23/498H01L33/00H01L33/62
CPCH01L2224/16225H01L2224/48091H01L2224/48247H01L2224/49107H01L2224/73265H01L2924/00014
Inventor 林峰立
Owner GIGNO TECH CO LTD
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