167 results about "Thermal relief" patented technology

Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.

There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.

An endshield assembly for an electronically commutated motor includes an endshield, a control assembly, and a power assembly. The endshield includes a plurality of recessed fins on an outer surface, and a substantially flat raised portion on an internal surface. The raised portion is in contact with a thermal pad. The control assembly includes the thermal pad and a control board on which is located a plurality of power transistors. The thermal pad provides thermal contact between the transistors and the endshield to enable the endshield to dissipate heat from the transistors. The transistors include a plurality of leads that extend substantially parallel to the control board which enable the leads to be coated for protection against harsh external environments. The power assembly includes a power board having an insulator positioned between the power board and the control board.

Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.

An article of headwear (1) for covering the head and neck of a wearer has a hood section (17) and neck section (20). The neck section may contain a fluid reservoir (2) with an inlet (6) to provide hydration for a wearer as well as thermal relief and sun protection in hot or cold conditions. Handles (3) with removably attachable fastening means (10), (11) and (13), (14) allow the headwear (1) to be held by a wearer's hands or secured around the wearer's head. Preferably, the headwear has an inner layer (10) made of moisture-absorbent cloth to absorb moisture. Optionally, the neck section may contain a storage compartment (18) for folding down and storing the hood section as discussed.

The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board.

A heat dissipating pad structure of a notebook computer includes a retaining unit, a baffle wall and at least two air guide units (fans). Air can be entered from the bottom of the notebook computer. The external periphery of a ventilation hole is disposed on the baffle wall for enclosing a space area, such that the air guide unit keeps guiding air into the space area to increase the volume of air and produce a positive air pressure, and a fan installed in the notebook computer produces a negative air pressure suction, such that cold air is compressed, sucked and guided simultaneously into the computer for a heat exchange and a discharge of hot air from the interior of the computer, so as to achieve a better heat dissipating effect.

The present invention relates to a sidelight type backlight module, including a light-conducting plate, at least a light source generator placed at side of said light-conducting plate and used for providing a light source and making said light source be entered into said light-conducting plate, at least a reflector placed around said light source generator relatively to the outside of said light-conducting plate and used for reflecting the light produced by said light source generator onto said light-conducting plate, a frame placed in the lower portion of said light-conducting plate and said reflector and used for covering outside of said reflector and a heat-dissipative pad placed between said reflector and said frame.

Disclosed is a heat dissipation structure, which includes a housing that houses a circuit board having active components, a heat sink formed integral with one side of the housing for supporting the circuit board and having radiation fins on the outside, a plurality of heat pads provided at the inside wall of the heat sink corresponding to the active components, and heat conducting bonding layers bonded between the heat pads and the active components for quick dissipation of heat from the active components into the outside open air through the heat pads and the heat sink.

A chip-on-board LED structure having multiple of LED dies, includes a flexible heat spreading pad for spreading heat and having a planar area; a top flexible foil on the flexible heat spreading pad; a dielectric layer on the first flexible foil; a flexible metal film on the dielectric layer; and an LED die array mounted on and covering a first area of the flexible metal film, wherein the planar area of the flexible heat spreading pad is at least four times larger than the first area of the flexible metal film.

A pressure washer device is provided that employs an unloader bypass valve that directs a selective amount of fluid via a small diameter bypass line back to a water storage tank. The small amount of fluid allows for the pump to remain working and introduces cooler water into a bypass circuit, thereby allowing the thermal relief valve to be omitted. The diameter of the bypass line is of such a diameter to prevent siphonage of the detergent associated with the pressure washer system into the water storage tank as well.

Described is an electronic device, including a top frame, a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, a heat sink associated with the thermal pad and a plurality of springs for providing a biasing force that retains the heat sink against the thermal pad, the heat sink including a planar portion surrounding a central depression, wherein the plurality of springs secure the thermal pad of the circuit board between the central depression portion of the heat sink and the circuit board.

A method for manufacturing a semiconductor device includes: a step of producing a semiconductor package intermediate by injecting a resin into a forming die in which electrodes, a heat dissipating pad, and a semiconductor element are disposed, providing a peel-off film on one side of the resin in the form of a still-uncured resin body opposite from the other side facing the heat dissipating pad and a rigid material on one side of the peel-off film, and curing the uncured resin body to form a sealant resin body; a step of forming a solder layer by reflow soldering between a substrate and the intermediate; and a step of removing the rigid material from the peel-off film, wherein the rigid material is integrated into the intermediate so as to make the thermal expansion coefficient and rigidity of the intermediate approximately equal to those of the substrate.

A pressure washer device is provided that employs an unloader bypass valve that directs a selective amount of fluid via a small diameter bypass line back to a water storage tank. The small amount of fluid allows for the pump to remain working and introduces cooler water into a bypass circuit, thereby allowing the thermal relief valve to be omitted. The diameter of the bypass line is of such a diameter to prevent siphonage of the detergent associated with the pressure washer system into the water storage tank as well.

A cylinder valve for use with a cylinder containing fluid under pressure includes a valve body configured for releasable connection to the cylinder. The valve body has a flow passage extending through the valve body for fluid communication with an interior of the cylinder when the valve body is connected to the cylinder. A valve in the flow passage is movable between open and closed positions. A vent passage is in the valve body and is separate from the flow passage. A temperature relief insert is in the vent passage. The insert includes an insert body, a bore through the insert body, and a thermal relief material in the bore blocking flow through the bore until a predetermined venting temperature is reached. The valve body does not contain brass and the insert body is brass covered by a metal plating not containing brass.

The invention discloses a high efficiency notebook computer heat sink without energy consumption. The high efficiency notebook computer heat sink is characterized by comprising a main gasket, a secondary gasket, a liquid inlet conduit and a liquid outlet conduit. The inner cavity of the main gasket is respectively communicated with a liquid outlet unidirectional valve and a liquid inlet unidirectional valve. The secondary gasket comprises a radiating water cavity. One end of the liquid outlet conduit is communicated with the liquid outlet unidirectional valve, and the other end is connected with the radiating water cavity. One end of the liquid outlet conduit is communicated with the liquid outlet unidirectional valve, and the other end is communicated with the radiating water cavity. The inner cavity of the main gasket, the radiating cavity of the secondary gasket, the liquid inlet conduit and the liquid outlet conduit are filled with liquid. When being used, a notebook computer is arranged on the main gasket. The high efficiency notebook computer heat sink solves the radiating problem of circulating water absorbing the heat of the notebook computer and the power problem for the circulating water of the notebook computer to flow in a radiating gasket of the notebook computer. The high efficiency notebook computer heat sink not only has low manufacturing cost, is convenient for use and can process circulating water cooling without using electrical energy, but improves the radiation protection effect of the notebook computer greatly.

This invention provides a LCD module with high heat dissipation effect, which mainly comprises a display panel, an aphototropism module, a control chip, a shell and a dissipation pad; and the aphototropism module has a metal frame and a shell. The heat dissipation pad is used to transmit the heat generated by the control chip out of the LCD module through shell, metal frame to lower the inner temperature of the LCD module.

The invention relates to a high heat radiation LED (Light Emitting Diode) nonmetal substrate and a high heat radiation LED element as well as a making method thereof. The making method mainly comprises the following steps: at least one through hole is pre-molded in a crystal bonding region of a nonmetal plate body; in coordination with the copper layer electroplating step, an electroplating copper layer is coated on the external surface of the nonmetal plate body; a solid heat conducting copper column is formed in the at least one through hole; the metal layer is patterned by using an etching technology; a crystal bonding pad and a wire bonding pad are formed on the upper surface of the ceramic plate body; a heat radiation pad is formed on the lower surface of the ceramic plate body corresponding to the crystal bonding pad so that the crystal bonding pad and the heat radiation pad are integrally molded with the heat conducting copper column; and the high heat can be rapidly conducted to the heat radiation pad of the lower surface through the heat conducting copper column while the crystal bonding pad reaches the high heat.

An improved thermal relief vent for a fuel tank, and a method of manufacturing the same, includes a thermal relief ring that is used to create a mechanical seal within the vent. The thermal relief ring, at room temperature, is crimped in place by use of the vent cap itself. The crimped thermal relief ring creates a mechanical seal between the vent and the vent cap, up until a predetermined thermal relief point, at which time the thermal relief ring will soften and / or yield and release the vent cap from the vent body.

A method for manufacturing a semiconductor device includes: a step of producing a semiconductor package intermediate by injecting a resin into a forming die in which electrodes, a heat dissipating pad, and a semiconductor element are disposed, providing a peel-off film on one side of the resin in the form of a still-uncured resin body opposite from the other side facing the heat dissipating pad and a rigid material on one side of the peel-off film, and curing the uncured resin body to form a sealant resin body; a step of forming a solder layer by reflow soldering between a substrate and the intermediate; and a step of removing the rigid material from the peel-off film, wherein the rigid material is integrated into the intermediate so as to make the thermal expansion coefficient and rigidity of the intermediate approximately equal to those of the substrate.

The invention relates to a high toughness self-cooling refrigerating gel pad and an application of the high toughness self-cooling refrigerating gel pad. The gel pad consists of inside gel and an outside gasket. The inside gel is formed by injecting a polymerizable functional monomer, biomacromolecules, a chemical cross-linking agent, a physical cross-linking agent, a filler, a preservative and a water-retaining agent dissolved in water into a mould under an oxidative-reductive initiating system. The outside gasket is a PVC (Polyvinyl Chloride) film or an aluminum foil film. The high toughness self-cooling refrigerating gel pad is characterized in that a physical and chemical compound cross-linking system is adopted so that the high toughness self-cooling refrigerating gel pad has the functions of cooling, refreshing and radiating. The gel pad provided by the invention can partially replace air conditioners, water-pillows, ice crystal gaskets, jade pads, bamboo and grass summer sleeping mats and the like. The gel pad can be applied to the fields of cooling mats for bed, afternoon nap pillows in office, cushions of automobiles, sofa or the like, mattresses, cup pads, radiating pads for notebook computers, cooling pads for pets and the like.

A handheld device comprises a housing, a motor, and a thermally conductive pad disposed in a space between the motor and the housing. Heat generated by the motor can be conducted by the thermal pad to the housing or to an internal fluid passage generally extending the length of the motor. In some embodiments, the thermal pad is configured to maintain the temperature of the housing in accordance with industry guidelines.

A laptop cooling pad having one or more heat-dissipating fans adjustable in position is disclosed. The laptop cooling pad is provided with a ventilation portion so that a heat-dissipating fan can be mounted on the ventilation portion through a fan support. The ventilation portion has a groove for receiving pushing nodes of the fan support so that a user can push the pushing nodes to move the heat-dissipating fan inside the laptop cooling pad and make the heat-dissipating fan close to a heat source, thereby ensuring the heat-dissipating effect of the laptop cooling pad.

An improved thermal relief vent for a fuel tank, and a method of manufacturing the same, includes a thermal relief ring that is used to create a mechanical seal within the vent. The thermal relief ring, at room temperature, is crimped in place by use of the vent cap itself. The crimped thermal relief ring creates a mechanical seal between the vent and the vent cap, up until a predetermined thermal relief point, at which time the thermal relief ring will soften and / or yield and release the vent cap from the vent body.

A light emitting device, comprising a flexible substrate (2) with a single, structured conductive layer (5), and a plurality of LEDs (3) arranged on said substrate (2), said structured conductive layer (5) forming electrodes for driving said LEDs (3). The structured conductive layer comprises a plurality of heat dissipating pads (8), each having an area significantly larger than the area of each LED (3), and each LED (3a) is thermally connected to at least one of said pads (8a), and electrically connected in series between two pads (8a, 8b). Through this design, each LED is thermally connected to a relatively large heat dissipating area, and the thermal energy built up in the LED will be distributed over this area, and then dissipated upwards and downwards from this area. As the addressing can be handled by a single conducting layer, the flexibility of the substrate is improved compared to multilayer substrates. By connecting each LED in series between two pads, a very large portion of the conducting layer can be used for the pads, and very little area needs to be occupied by conducting tracks, which otherwise may be a problem with single layer designs.