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52 results about "Thermal relief" patented technology
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A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with copper "spokes" connecting it to the surrounding copper.
HEAT DISSIPATION STRUCTURE FOR A HEATING ELEMENT AND HOUSING STRUCTURE FOR A BRAKE SYSTEM THEREOF
PendingDE102024127602A1Semiconductor/solid-state device detailsSolid-state devicesThermal reliefBraking system
A heat dissipation structure is provided. The heat dissipation structure according to one aspect of the present disclosure includes a PCB substrate having a first heat dissipation pad with a predetermined area on one surface; a heating element coupled to the heat dissipation pad through a coupling member, one surface of the heating element being disposed adjacent to the heat dissipation pad and the other surface being opposite to the one surface; a heat sink having a surface disposed in contact with the heating element; and a heat transfer material comprising a first region portion disposed between the other surface of the heating element and a surface of the heat sink.
Owner:HL MANDO CORP
Server System Storage System Storage Module Thermal Pad Alignment System
A bottom system of storage system. The bottom system includes a bottom component; and a storage module thermal pad alignment system for attaching to the bottom component, the storage module thermal pad alignment system including an alignment component, the alignment component comprising an alignment panel, the alignment panel including an outside wall and an inside wall; and, a thermal pad, the thermal pad being affixed to the inside wall of the alignment panel in a preconfigured position, the alignment panel and the thermal pad being configured as a single part.
Owner:DELL PROD LP
Insulating heat dissipation pad and electronic equipment comprising same
PendingCN121463377ANon-macromolecular adhesive additivesLayered productsAdhesive cementThermal relief
The invention discloses an insulating heat dissipation pad and electronic equipment comprising the same. The insulation heat dissipation pad comprises a heat conduction insulation film and a thermosetting adhesive layer. Wherein the thermosetting adhesive layer is pre-bonded to the heat-conducting insulating film, and the thermosetting adhesive layer is used for being bonded to a heating part of a first component or a metal part of a second component so as to insulatively isolate the heating part from the metal part. According to the invention, the proper heat-conducting insulating film and thermosetting adhesive are selected, so that the thermosetting adhesive with relatively small thickness can also have good adhesion. Furthermore, by selecting a proper heating temperature, the thermosetting adhesive layer can be firmly adhered between the heat-conducting insulating film and the heating part or the metal part under the condition that the heat-conducting insulating film is prevented from being damaged by high temperature, so that the performance of the electronic equipment comprising the insulating heat dissipation pad is safer and more reliable.
Owner:ILLINOIS TOOL WORKS INC
A heat dissipation gasket for an electrical component, its preparation method and application
ActiveCN119952425BCooling/ventilation/heating modificationsMetal layered productsMetal foilThermal relief
The present invention belongs to the technical field of electrical components. The present invention discloses a preparation method of a heat dissipation gasket for an electrical component, comprising: machining a grid on the surface of a substrate; then coating a liquid metal melted into a superheated state in the grid of the substrate, and obtaining a composite gasket through cooling and solidification; then wrapping a layer of high thermal conductivity metal foil with uniform pores around the composite gasket, and obtaining a heat dissipation gasket through rolling and flattening. The heat dissipation gasket prepared by this method has good thermal conductivity and anti-leakage performance, solves the problems of too strong fluidity and easy leakage of liquid metal in the heat dissipation application of actual chips, and realizes the balance between high-efficiency heat transfer and safety of liquid metal.
Owner:TIANJIN TIER TECHNOLOGY CO LTD
Pressure regulation and overpressure protection process method for oil product receiving terminal
The invention discloses a pressure regulation and overpressure protection process method for an oil product receiving terminal, and relates to the technical field of medium and long distance oil pipelines. A pressure regulation and overpressure protection process method of an oil product receiving terminal divides a pressure protection gradient into five levels, the pressure protection gradient is based on a pressure cascade protection principle, a basic process control system, an ESD emergency shutdown system and mechanical protection measures are integrated, and accurate pressure regulation and comprehensive overpressure protection of a pipeline and an equipment system are achieved. The process flow is simple and practical and easy to understand and implement, the functions of split-range pressure adjustment, thermal release mechanical protection, safety interlocking and water attack release protection are achieved, and skid-mounted design, production and manufacturing are easy to achieve.
Owner:曹毅
Transmitting module and laser radar
This application discloses a transmitting module and a lidar. The lidar includes a transmitting lens barrel, a transmitting circuit board, a bracket, a heat sink housing, and a heat sink pad. The transmitting circuit board is located between the transmitting lens barrel and the bracket, and the bracket is located between the transmitting circuit board and the heat sink housing. The bracket includes a first through hole, and the heat sink housing includes a first boss. The first boss passes through the first through hole and abuts against the heat sink pad, which is located between the first boss and the transmitting circuit board. This effectively improves the structural stability and heat dissipation performance of the transmitting module, thereby improving the operational stability of the lidar.
Owner:SUTENG INNOVATION TECHNOLOGY CO LTD
Electrical component cooling device
ActiveCN224111543USupport structure mountingCooling/ventilation/heating modificationsCold airThermodynamics
The utility model relates to the technical field of electrical cooling equipment, in particular to an electrical component cooling device, which comprises a cooling box, a cooling tank arranged at the top of the cooling box, an air hole arranged at the bottom of the cooling tank, a placing seat arranged on the air hole and capable of adjusting the position according to the size of a circuit board, and an air vent arranged on the inner wall of the cooling tank. A cold air heat dissipation assembly for uniformly dissipating heat of the circuit board is arranged in the ventilation opening, and heat dissipation holes are formed in the two sides of the cooling groove. According to the utility model, the circuit board can be placed on the placement seat and separated from the heat dissipation pad through the arrangement of the cooling groove, the air holes and the placement seat, so that the direct contact between moisture and the circuit board is avoided, the damage to the circuit board caused by moisture contact is prevented, the safety of the circuit board is improved, and the service life of the circuit board is prolonged; and the position of the placement seat can be flexibly adjusted according to the size of the circuit board, so that the cooling device can adapt to circuit boards of different sizes, and the universality and practicability of the device are improved.
Owner:ANHUI MAIN ENERGY TECH CO LTD
Insulation and heat-dissipation pad and electronic device including same
PendingUS20260040495A1Non-macromolecular adhesive additivesLayered productsThermal reliefElectronic equipment
The present disclosure disclosed an insulation and heat-dissipation pad and an electronic device including same, the insulation and heat-dissipation pad comprises: a thermally conductive insulation film; and a thermosetting adhesive layer. The thermosetting adhesive layer is pre-bonded to the thermally conductive insulation film, and the thermosetting adhesive layer is configured to bond to a heat generating portion of a first component or a metal portion of a second component, so as to isolate the heat generating portion from the metal portion in an insulated manner.
Owner:ILLINOIS TOOL WORKS INC
Circuit board module
A circuit board module according to an embodiment of the present invention comprises: a circuit board; at least one condenser disposed on the circuit board; a case disposed to face the circuit board; and at least one heat dissipation pad disposed on the case, wherein the condenser has at least two layers stacked in a direction parallel to the circuit board, and the heat dissipation pad is disposed between the case and the condenser and / or between the case and the circuit board.
Owner:LG INNOTEK CO LTD
Guide rail spotlight with efficient heat dissipation and impact resistance
ActiveCN223153523ULighting heating/cooling arrangementsProtective devices for lightingThermal reliefThermal shock
The guide rail spotlight comprises a guide rail head, a power source box, a direction adjusting supporting rod and a lamp body outer shell, a light source assembly and a lens assembly are arranged in the lamp body outer shell, the lamp body outer shell comprises a shell body, a plurality of supporting rib plates are arranged on the inner wall of the shell body in the circumferential direction of the shell body, and a mounting disc is fixedly connected into the supporting rib plates; a heat dissipation surface and / or a thermal expansion structure for converting heat into self deformation are / is arranged on the plurality of supporting rib plates; a heat dissipation cushion layer is arranged on the side, facing the top wall of the shell, of the installation disc, a heat insulation cushion layer is arranged on the side, facing the opening of the shell, of the installation disc, and heat dissipation holes are formed in the top wall and the side wall of the shell. The light source assembly is installed on the installation disc, and the lens assembly is located between the installation disc and an opening of the lamp body shell. Heat generated by the light source assembly can be conducted to the heat dissipation cushion layer and the supporting rib plate, then heat dissipation is conducted through the heat dissipation cushion layer and the heat dissipation face of the supporting rib plate, the thermal shock resistance of the whole lamp body shell and the supporting rib plate is improved by arranging the thermal expansion structure, and the lighting effect is guaranteed.
Owner:SHANGHAI RUN CHAN OPTICAL TECH
Pyrolysis paint removal furnace
The utility model relates to the technical field of paint removal furnaces, in particular to a pyrolysis paint removal furnace. In order to solve the problem that high-temperature objects in the paint removing furnace may be scalded when being manually taken out, the technical scheme is that the paint removing furnace comprises a furnace body and a furnace door hinged to one side of the furnace body, and a bottom frame is arranged at the bottom of the furnace body; a plurality of groups of moving wheels for moving the placing rack are mounted at the bottom of the placing rack; the supporting mechanism is arranged on one side of the furnace door of the furnace body and is used for driving the placing rack to lift; the pushing assembly is installed on the supporting mechanism and used for driving the containing frame to enter the furnace body from the top of the supporting mechanism. According to the utility model, an object which is still in a high-temperature state after pyrolysis can be conveniently taken out, and a coating can be conveniently dropped after the cooling speed is increased, so that the working efficiency is improved, and meanwhile, scald accidents are prevented.
Owner:BAODING BAONAN MASCH EQUIP MFG CO LTD
Compressed solid-state storage hard disk module testing device based on PCIe-64P interface
The utility model discloses a PCIe-64P interface-based compressed solid-state storage hard disk module testing device. The PCIe-64P interface-based compressed solid-state storage hard disk module testing device comprises a circuit board, an adjusting and fixing assembly, a board-to-board connector and a heat dissipation part, the adjusting and fixing assembly, the board-to-board connector and the heat dissipation part are respectively arranged on the same surface of the circuit board; the board-to-board connector is screwed on the circuit board through a height adjusting screw, and a compressed solid-state storage hard disk module is positioned and mounted on the board-to-board connector; and the adjusting and fixing assembly is used for compressing and fixing the compressed solid-state storage hard disk module. Precise positioning of the compressed solid-state storage hard disk module is achieved through the board-to-board connector, pressing and fixing are achieved in cooperation with the adjusting and fixing assembly, the structural stability in the testing process is improved, meanwhile, the safety in the testing process is improved through the configured heat dissipation pad, and the testing efficiency is improved. The adjustable effect of the adjusting and fixing assembly can meet the test requirements of compressed solid-state storage hard disk modules of different specifications, and the applicability is improved.
Owner:SHENZHEN CITY TECHWIN SEMICONDUCTOR COMPANY LIMITED
Embedded component circuit board and method of manufacturing the same
ActiveCN117500142BIncrease lateral heat dissipation efficiencyIncrease vertical heat dissipation efficiencyMultilayer circuit manufactureConductive pattern layout detailsThermal reliefConductive materials
The present application provides a circuit board with embedded components and enhanced heat dissipation capacity, comprising at least two stacked heat dissipation substrates, a bonding layer between two adjacent heat dissipation substrates, an insulating layer covering the surface of the outermost heat dissipation substrate, and a plurality of heat dissipation columns embedded in the insulating layer. Each heat dissipation substrate comprises a heat dissipation insulating layer, a first circuit layer, a second circuit layer, a conductive structure, an embedded structure, and a plurality of heat dissipation columns. The embedded structure includes an electronic component electrically connected to the conductive structure, a conductive material connected to the conductive structure, and an insulating and heat-conductive material connecting the electronic component and the heat dissipation insulating layer. The first circuit layer includes a plurality of heat dissipation pads, and each heat dissipation column is connected to the heat dissipation pad. The present application also provides a manufacturing method for a circuit board with embedded components.
Owner:AVARY HLDG (SHENZHEN) CO LTD +1
Protection circuit for an electric motor with a single-phase winding, an electric centrifugal pump and an oil mist separator with such a protection circuit
A protection circuit for an electric motor with a single phase winding, consisting of two coil sections with central tapping, wherein the two coil ends of the coil sections are each connected to ground via a switching element. The task of the invention is for an electric motor of this type to ensure a thermal relief for the switching elements, improved and smoother running, reduced warming of the printed circuit board, improved EMC characteristics, a more robust design of the overall switching, a focused conduction of the losses and an extra protection against any surge impulses from a mains network.
Owner:BUHLER MOTOR GMBH
Storage hard disk with heat dissipation structure
The utility model discloses a storage hard disk with a heat dissipation structure, relates to the technical field of hard disks, and aims to solve the technical problem that the heat dissipation effect of the current hard disk is affected by dust after long-time use, the storage hard disk comprises a hard disk body and a fixing piece arranged at the bottom end of the hard disk body, and a heat dissipation gasket is attached to the top end of the hard disk body. A heat dissipation lower waistcoat is attached to the top end of the heat dissipation gasket, the heat dissipation lower waistcoat is detachably connected with the fixing piece, an insertion groove is formed in the top end of the heat dissipation lower waistcoat and is of a U-shaped structure, and one supporting arm of the U-shaped structure penetrates out of the heat dissipation lower waistcoat. According to the utility model, through the arrangement of the slots, the insertion blocks, the anti-slip strips and the anti-slip grooves, the upper heat dissipation waistcoat can be detached for maintenance under the condition that the fixed sheet, the heat dissipation gasket and the lower heat dissipation waistcoat are not detached. According to the heat dissipation waistcoat, the heat dissipation waistcoat can be quickly maintained through the arrangement of the quick release structure, and therefore the heat dissipation waistcoat can keep a good heat dissipation function for a long time.
Owner:SHENZHEN REECAM TECH
Multi-chip 3D stacked packaging structure
The invention relates to a multi-chip 3D stacked packaging structure, which comprises a stacked chip set, a plastic package layer and a substrate, and is characterized in that the stacked chip set comprises n layers of stacked chips, the back surfaces of the first chip to the (n-1) th chip are sequentially stacked on the substrate, and part of the front surface of the nth chip is stacked on the (n-1) th chip; the front surfaces of the first chip to the (n-1) th chip are bonded on the substrate through leads; the nth chip is bonded to the substrate through flip-chip bonding. And the part, which is not stacked on the (n-2) th chip, of the back surface of the (n-1) th chip is welded with the heat dissipation cushion block through the heat dissipation welding layer. Heat of the stacked chips is conducted to the heat dissipation cushion block through the heat dissipation welding layer, the heat of the stacked chips is conducted to the radiator through the heat dissipation cushion block, and heat of the stacked chip set, especially the upper layer chips, is reduced. Meanwhile, as the plastic packaging layer does not cover the back surface of the nth chip, heat generated by the nth chip can be directly dissipated through the back surface. And the failure risk caused by overhigh junction temperature of the stacked upper-layer chips is reduced.
Owner:TIANXIN ELECTRONIC TECH (JIANGYIN) CO LTD
Semiconductor device including a thermal relief layer
PendingUS20250379112A1Semiconductor/solid-state device detailsSolid-state devicesDevice materialThermal relief
A semiconductor device includes a stack of semiconductor dies mounted on a substrate. The stack may be offset to allow wire bonding of the dies to each other and the substrate. The stack may further include a thermal relief layer mounted between semiconductor dies at or near the middle of the stack to withdraw heat from semiconductor dies at and / or near the middle of in the stack.
Owner:SANDISK TECHNOLOGIES LLC
Storage device
ActiveCN224096390UApparatus modification to store record carriersReducing physical parameters of carriersThermal reliefHeat spreader
Owner:BEIJING STARBLAZE TECH CO LTD
Electromagnetic compatibility EMC filter, circuit device, and power management system
PendingCN121077227ASupport structure mountingCooling/ventilation/heating modificationsBusbarThermal relief
The invention relates to an electromagnetic compatibility (EMC) filter, a circuit device and a power management system. Provided is an electromagnetic compatibility (EMC) filter (1000), comprising an EMC filter body (1); an EMC filter includes an EMC filter body (1), a busbar (2) serving as a carrier carrying a current passing through the EMC filter body (1), a heat dissipation pad (3) having a first surface (31) for contacting the busbar (2), and a holder (4) attached to the EMC filter body (1) and configured to support the heat dissipation pad (3). In an EMC filter, a holder is used to hold contact between a busbar and a heat dissipation pad so that the heat dissipation pad may be integrated with the EMC filter and improve heat dissipation performance. In addition, the retainer disclosed by the invention can also be used for meeting a creepage distance requirement so as to improve electrical protection.
Owner:ROBERT BOSCH GMBH
On-chip hybrid electromagnetic interference (EMI) shielding with thermal mitigation
PendingCN119856285AAntenna arraysSemiconductor/solid-state device detailsThermal reliefElectromagnetic interference
Techniques for on-chip electromagnetic interference (EMI) shielding are disclosed. In one aspect, an integrated circuit includes a noise-sensitive device, a first metallization layer disposed on a first side of the noise-sensitive device, where the first metallization layer includes a plurality of conductive wiring layers, and where the first metallization layer is disposed on a second side of the noise-sensitive device. The conductive wirings within the plurality of conductive wiring layers are configured as a first side of on-chip electromagnetic interference (EMI) shielding around a first side of the noise sensitive device; and a second metallization layer disposed on a second side of the noise-sensitive device opposite the first side of the noise-sensitive device, where the second metallization layer comprises one or more conductive wiring layers, and where the second metallization layer comprises one or more conductive wiring layers. The conductive wiring within the one or more conductive wiring layers is configured as a second side of on-chip EMI shielding around the second side of the noise sensitive device.
Owner:QUALCOMM INC
Thermal pad, handling device, handling system, method for manufacturing an electronic component by handling thermal pads and electronic component
The invention relates to a thermal pad, a handling device, a handling system, a method for manufacturing an electronic component by handling thermal pads, and an electronic component. The thermal pad (1) serves for heat conduction and / or electrical insulation on an electronic component (80) and comprises a substantially two-dimensional body (2) with at least two side surfaces (11, 12) bounding the body (2) and facing away from each other, and in the body (2) at least one incision (13) penetrating the body (2), which is designed to be penetrated at least partially by a volume element (86) on the contact surface (85) when the thermal pad (1) is positioned on a contact surface (85) of the electronic component (80), with material (14) of the body (2) bounding the incision being inverted (15). The thermal pad, handling device, handling system, method for manufacturing an electronic component by handling thermal pads, and electronic component proposed here provide solutions to reduce the effort required to mount thermal pads while simultaneously ensuring the necessary positional accuracy and reliability of the connection made between a thermal pad and a respective mounting surface.
Owner:SCHAEFFLER TECHNOLOGIES AG & CO KG
Elastic wave devices
To provide an elastic wave device with improved heat dissipation. [Solution] The elastic wave device comprises a package substrate having a mounting surface, a first inner layer, a second inner layer, and an external connection surface in this order, a device chip, and a plurality of resonators, and includes a heat dissipation bump arranged to be surrounded by the plurality of resonators and located in the central region on the device chip, the mounting surface has a plurality of metal patterns MP including a heat dissipation pad HDP, the first inner layer has a plurality of metal patterns including a first metal pattern MP1 electrically connected to the heat dissipation pad via via V, the second inner layer has a plurality of metal patterns including a second metal pattern MP2 electrically connected to the first metal pattern via via, the first metal pattern having the largest area in the first inner layer, and the second metal pattern having the largest area in the second inner layer.
Owner:SANAN JAPAN TECH CORP
Alumina ceramic circuit board
ActiveCN222869112UPrinted circuit detailsCooling/ventilation/heating modificationsThermal reliefElectronic component
The utility model discloses an aluminum oxide ceramic circuit board, which comprises a main board, an electronic component board is arranged above the main board, the aluminum oxide ceramic circuit board also comprises a dismounting mechanism, the dismounting mechanism comprises mounting plates which are arranged above the main board and are positioned on two sides of the electronic component board, spring blocks are connected in the mounting plates in a sliding manner, and the spring blocks are connected with the mounting plates in a sliding manner. Clamping holes are formed in the outer surface of the mounting plate, and limiting assemblies are arranged on the two sides of the outer wall of the electronic element plate; the heat dissipation mechanism is arranged in the mainboard, the heat dissipation mechanism is used for conducting heat for the circuit board, the heat dissipation mechanism comprises a heat dissipation groove formed in the mainboard, a heat conduction block is fixedly connected to the interior of the heat dissipation groove, a conduction rod is fixedly connected to the top end of the heat conduction block, and the heat conduction rod is fixedly connected to the top end of the heat conduction block. The bottom end of the heat conduction block is fixedly connected with a heat dissipation pad. The aluminum oxide ceramic circuit board provided by the utility model has the technical effects of being convenient to disassemble, assemble and clean and good in heat dissipation effect.
Owner:SHANDONG ZHIXIN PENGTE NEW MATERIALS TECHNOLOGY CO LTD
Large-current small-size overhead inductor structure
ActiveCN224052984UTransformers/reacts mounting/support/suspensionTransformers/inductances coolingCapacitanceConverters
The utility model relates to a large-current small-size overhead inductor structure which comprises a magnetic core, a coil and a supporting artificial foot. The magnetic core is made of an EE type or ER type distributed air gap alloy material and has excellent anti-saturation performance; the coil is of a spiral structure formed by winding a flat wire and is embedded in a center groove of the magnetic core. The supporting artificial feet are located below the magnetic core, the magnetic core and the coil are lifted to be overhead, the overhead height is larger than 1.5 mm, a cavity is formed between the magnetic core and the PCB substrate, and components such as resistors and capacitors can be arranged at the bottom conveniently. According to the utility model, through the overhead design, the space utilization rate of the PCB is obviously improved, the board distribution area is reduced, the large-current flow capacity and the high saturation resistance are realized, the overall height is less than 10mm, and the antenna is suitable for a power supply module, a high-frequency filter and a DC-DC converter in a high-density circuit design. According to the utility model, an automatic chip mounting technology is supported, a heat radiation pad can be installed on the top to optimize heat management performance, and the LED chip is suitable for small-size and high-power-density electronic products.
Owner:CHENGDU HAOYU NENGCHUANG ELECTRONIC TECHNOLOGY CO LTD
Fireproof power cable
ActiveCN222580828UGuaranteed long-term use effectExtended service lifeClimate change adaptationInsulated cablesThermodynamicsPower cable
The utility model belongs to the technical field of cables, in particular to a fire-resistant power cable, which comprises a cable core, an inner coating layer and an outer coating layer, a graphene layer which gathers heat and transmits the heat outwards is arranged in the inner coating layer, a heat dissipation pad which dissipates the heat outwards is arranged on the outer layer of the graphene layer, and the outer side of the heat dissipation pad is of a honeycomb structure so as to promote heat emission. The outer side of the cable core is provided with a clamping pad for installing a heat dissipation pad, the clamping pad, the graphene layer and the heat dissipation pad are assembled before extrusion production of the cable core, and the inner side of the outer coating layer forms an inner convex layer during extrusion production to separate the adjacent clamping pads and form reinforcement to prevent deformation of the clamping pads. According to the utility model, when heat is generated in the cable, the heat can be rapidly collected and discharged outwards, so that the long-time use performance of the cable is maintained, the condition that the coating assembly is affected by the heat and is aged is avoided, the service life of the cable is prolonged, and the adaptability of the cable to severe environments is improved.
Owner:ANHUI RUIZHIXING CABLE GRP CO LTD
Inductor and inductor heat dissipation assembly
ActiveCN223296620UTransformers/inductances coolingTransformers/inductances coils/windings/connectionsThermal reliefInductor
The utility model relates to the technical field of inductors, in particular to an inductor and an inductor heat dissipation assembly. According to the first aspect, one embodiment provides an inductor, the inductor comprises a coil, a magnetic core and an insulator, the insulator comprises a main body part and a fence structure, the main body part fixedly connects the coil and the magnetic core, the coil is provided with a heat dissipation surface exposed out of the main body part, the heat dissipation surface is located on the inner side of the fence structure, and the fence structure is arranged in the main body part. The fence structure protrudes out of the main body part and is used for extruding a heat conduction pad attached to the heat dissipation face. According to the inductor, the coil is provided with the heat dissipation face exposed out of the main body part, the heat dissipation face is located on the inner side of the fence structure, the fence structure protrudes out of the main body part, extrusion can be formed on the heat dissipation pad attached to the heat dissipation face, and the heat dissipation pad is not prone to moving relative to the inductor to cause abrasion.
Owner:EAGLERISE INTELLIGENT DEVICE CORP LTD
Laser radar and automatic driving equipment
PendingCN121645764ACasings/cabinets/drawers detailsModifications by conduction heat transferAcute angleThermal relief
The embodiment of the invention discloses a laser radar and automatic driving equipment. The laser radar comprises a shell, a receiving module and a heat dissipation module, the receiving module comprises a receiving chip, a receiving circuit board and a heat dissipation shell which are sequentially arranged in the first direction, and the first direction is the direction perpendicular to the photosensitive surface of the receiving chip; the shell comprises a first boss formed by extending in the first direction, the heat dissipation module comprises a first heat dissipation pad and a second heat dissipation pad, the first heat dissipation pad is located between the first boss and the heat dissipation shell, and the second heat dissipation pad is located between the receiving circuit board and the heat dissipation shell; the plane where the contact face of the heat dissipation shell and the first heat dissipation pad is located is a first plane, the plane where the contact face of the first boss and the first heat dissipation pad is located is a second plane, the included angle between the normal of the first plane and the first direction is an acute angle, and the first plane is parallel to the second plane. And the heat generated by the receiving circuit board is conducted to the shell, so that the heat dissipation performance of the whole machine is improved.
Owner:SUTENG INNOVATION TECHNOLOGY CO LTD
Heat dissipation structure
PendingCN120603176AVehicle sub-unit featuresElectric/fluid circuitThermal reliefPrinted circuit board
A heat dissipation structure is provided. A heat dissipation structure according to one aspect of the present invention comprises: a printed circuit board on one surface of which a heat dissipation pad having a prescribed area is provided; the heating element is combined on the heat dissipation pad through a combination part and is provided with one surface adjacent to the heat dissipation pad and the other surface opposite to the one surface; the radiator is provided with a surface opposite to the other surface of the heating element; and a heat transfer material including a first region portion between the other surface of the heat generating element and one surface of the heat sink.
Owner:HL MANDO CORP
Self-adjustable water-blocking outdoor power distribution cabinet
PendingCN121863195ASubstation/switching arrangement cooling/ventilationSubstation/switching arrangement casingsThermal reliefWater treatment
The invention discloses a self-adjustable water-blocking outdoor power distribution cabinet, which is provided with a cabinet body convenient for bearing devices, and ventilation holes are formed in the left end and the right end of the outer surface of the cabinet body; comprising storage assemblies installed at the upper end and the lower end of the inner surface of the cabinet body, sealing shells are installed at the middle ends of the outer surfaces of the storage assemblies, exhaust holes are formed in the outer surfaces of the sealing shells, and meanwhile guide columns are connected to the inner surfaces of the sealing shells in a penetrating mode. According to the self-adjustable water-blocking outdoor power distribution cabinet, the storage assembly and the sealing shell are matched with each other, heat dissipation and sealing are matched with each other for use through alternate rotation of the assembled heat dissipation pad and the sealing pad in cooperation with heat dissipation holes, ventilation is carried out for use under normal conditions, and when water is accumulated and the water level rises, the water-blocking outdoor power distribution cabinet is convenient to adjust. And a first sealing ring and a second sealing ring are arranged to be matched with each other, so that sealing and water blocking treatment is formed.
Owner:蒲林瀚
Electronic assembly having thermal pad with polymer layer
An electronic assembly is provided. The electronic assembly includes a heat-spreader component and at least one spring. The electronic assembly further includes a thermal pad contacting the at least one spring, and at least one layer of polymer directly contacting at least one of an upper surface and a lower surface of the thermal pad. Further disclosed is a method of assembling the electronic assembly. The method includes adhering a heat-dissipating sheet on a surface of a metal heat-spreader component. The method also includes placing a thermal pad on at least one spring extending from the surface of the metal heat-spreader component, and placing at least one layer of polymer so as to directly contact at least one of an upper surface and a lower surface of the thermal pad.
Owner:DISH NETWORK LLC