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24 results about "Thermal relief" patented technology
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A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with copper "spokes" connecting it to the surrounding copper.
Server System Storage System Storage Module Thermal Pad Alignment System
A bottom system of storage system. The bottom system includes a bottom component; and a storage module thermal pad alignment system for attaching to the bottom component, the storage module thermal pad alignment system including an alignment component, the alignment component comprising an alignment panel, the alignment panel including an outside wall and an inside wall; and, a thermal pad, the thermal pad being affixed to the inside wall of the alignment panel in a preconfigured position, the alignment panel and the thermal pad being configured as a single part.
Owner:DELL PROD LP
Insulating heat dissipation pad and electronic equipment comprising same
PendingCN121463377ANon-macromolecular adhesive additivesLayered productsAdhesive cementThermal relief
The invention discloses an insulating heat dissipation pad and electronic equipment comprising the same. The insulation heat dissipation pad comprises a heat conduction insulation film and a thermosetting adhesive layer. Wherein the thermosetting adhesive layer is pre-bonded to the heat-conducting insulating film, and the thermosetting adhesive layer is used for being bonded to a heating part of a first component or a metal part of a second component so as to insulatively isolate the heating part from the metal part. According to the invention, the proper heat-conducting insulating film and thermosetting adhesive are selected, so that the thermosetting adhesive with relatively small thickness can also have good adhesion. Furthermore, by selecting a proper heating temperature, the thermosetting adhesive layer can be firmly adhered between the heat-conducting insulating film and the heating part or the metal part under the condition that the heat-conducting insulating film is prevented from being damaged by high temperature, so that the performance of the electronic equipment comprising the insulating heat dissipation pad is safer and more reliable.
Owner:ILLINOIS TOOL WORKS INC
Pressure regulation and overpressure protection process method for oil product receiving terminal
The invention discloses a pressure regulation and overpressure protection process method for an oil product receiving terminal, and relates to the technical field of medium and long distance oil pipelines. A pressure regulation and overpressure protection process method of an oil product receiving terminal divides a pressure protection gradient into five levels, the pressure protection gradient is based on a pressure cascade protection principle, a basic process control system, an ESD emergency shutdown system and mechanical protection measures are integrated, and accurate pressure regulation and comprehensive overpressure protection of a pipeline and an equipment system are achieved. The process flow is simple and practical and easy to understand and implement, the functions of split-range pressure adjustment, thermal release mechanical protection, safety interlocking and water attack release protection are achieved, and skid-mounted design, production and manufacturing are easy to achieve.
Owner:曹毅
Transmitting module and laser radar
This application discloses a transmitting module and a lidar. The lidar includes a transmitting lens barrel, a transmitting circuit board, a bracket, a heat sink housing, and a heat sink pad. The transmitting circuit board is located between the transmitting lens barrel and the bracket, and the bracket is located between the transmitting circuit board and the heat sink housing. The bracket includes a first through hole, and the heat sink housing includes a first boss. The first boss passes through the first through hole and abuts against the heat sink pad, which is located between the first boss and the transmitting circuit board. This effectively improves the structural stability and heat dissipation performance of the transmitting module, thereby improving the operational stability of the lidar.
Owner:SUTENG INNOVATION TECHNOLOGY CO LTD
Electrical component cooling device
ActiveCN224111543USupport structure mountingCooling/ventilation/heating modificationsCold airThermodynamics
The utility model relates to the technical field of electrical cooling equipment, in particular to an electrical component cooling device, which comprises a cooling box, a cooling tank arranged at the top of the cooling box, an air hole arranged at the bottom of the cooling tank, a placing seat arranged on the air hole and capable of adjusting the position according to the size of a circuit board, and an air vent arranged on the inner wall of the cooling tank. A cold air heat dissipation assembly for uniformly dissipating heat of the circuit board is arranged in the ventilation opening, and heat dissipation holes are formed in the two sides of the cooling groove. According to the utility model, the circuit board can be placed on the placement seat and separated from the heat dissipation pad through the arrangement of the cooling groove, the air holes and the placement seat, so that the direct contact between moisture and the circuit board is avoided, the damage to the circuit board caused by moisture contact is prevented, the safety of the circuit board is improved, and the service life of the circuit board is prolonged; and the position of the placement seat can be flexibly adjusted according to the size of the circuit board, so that the cooling device can adapt to circuit boards of different sizes, and the universality and practicability of the device are improved.
Owner:ANHUI MAIN ENERGY TECH CO LTD
Insulation and heat-dissipation pad and electronic device including same
PendingUS20260040495A1Non-macromolecular adhesive additivesLayered productsThermal reliefElectronic equipment
The present disclosure disclosed an insulation and heat-dissipation pad and an electronic device including same, the insulation and heat-dissipation pad comprises: a thermally conductive insulation film; and a thermosetting adhesive layer. The thermosetting adhesive layer is pre-bonded to the thermally conductive insulation film, and the thermosetting adhesive layer is configured to bond to a heat generating portion of a first component or a metal portion of a second component, so as to isolate the heat generating portion from the metal portion in an insulated manner.
Owner:ILLINOIS TOOL WORKS INC
Circuit board module
A circuit board module according to an embodiment of the present invention comprises: a circuit board; at least one condenser disposed on the circuit board; a case disposed to face the circuit board; and at least one heat dissipation pad disposed on the case, wherein the condenser has at least two layers stacked in a direction parallel to the circuit board, and the heat dissipation pad is disposed between the case and the condenser and / or between the case and the circuit board.
Owner:LG INNOTEK CO LTD
Embedded component circuit board and method of manufacturing the same
ActiveCN117500142BIncrease lateral heat dissipation efficiencyIncrease vertical heat dissipation efficiencyMultilayer circuit manufactureConductive pattern layout detailsThermal reliefConductive materials
The present application provides a circuit board with embedded components and enhanced heat dissipation capacity, comprising at least two stacked heat dissipation substrates, a bonding layer between two adjacent heat dissipation substrates, an insulating layer covering the surface of the outermost heat dissipation substrate, and a plurality of heat dissipation columns embedded in the insulating layer. Each heat dissipation substrate comprises a heat dissipation insulating layer, a first circuit layer, a second circuit layer, a conductive structure, an embedded structure, and a plurality of heat dissipation columns. The embedded structure includes an electronic component electrically connected to the conductive structure, a conductive material connected to the conductive structure, and an insulating and heat-conductive material connecting the electronic component and the heat dissipation insulating layer. The first circuit layer includes a plurality of heat dissipation pads, and each heat dissipation column is connected to the heat dissipation pad. The present application also provides a manufacturing method for a circuit board with embedded components.
Owner:AVARY HLDG (SHENZHEN) CO LTD +1
Semiconductor device including a thermal relief layer
PendingUS20250379112A1Semiconductor/solid-state device detailsSolid-state devicesDevice materialThermal relief
A semiconductor device includes a stack of semiconductor dies mounted on a substrate. The stack may be offset to allow wire bonding of the dies to each other and the substrate. The stack may further include a thermal relief layer mounted between semiconductor dies at or near the middle of the stack to withdraw heat from semiconductor dies at and / or near the middle of in the stack.
Owner:SANDISK TECHNOLOGIES LLC
Storage device
ActiveCN224096390UApparatus modification to store record carriersReducing physical parameters of carriersThermal reliefHeat spreader
Owner:BEIJING STARBLAZE TECH CO LTD
Electromagnetic compatibility EMC filter, circuit device, and power management system
PendingCN121077227ASupport structure mountingCooling/ventilation/heating modificationsBusbarThermal relief
The invention relates to an electromagnetic compatibility (EMC) filter, a circuit device and a power management system. Provided is an electromagnetic compatibility (EMC) filter (1000), comprising an EMC filter body (1); an EMC filter includes an EMC filter body (1), a busbar (2) serving as a carrier carrying a current passing through the EMC filter body (1), a heat dissipation pad (3) having a first surface (31) for contacting the busbar (2), and a holder (4) attached to the EMC filter body (1) and configured to support the heat dissipation pad (3). In an EMC filter, a holder is used to hold contact between a busbar and a heat dissipation pad so that the heat dissipation pad may be integrated with the EMC filter and improve heat dissipation performance. In addition, the retainer disclosed by the invention can also be used for meeting a creepage distance requirement so as to improve electrical protection.
Owner:ROBERT BOSCH GMBH
Thermal pad, handling device, handling system, method for manufacturing an electronic component by handling thermal pads and electronic component
The invention relates to a thermal pad, a handling device, a handling system, a method for manufacturing an electronic component by handling thermal pads, and an electronic component. The thermal pad (1) serves for heat conduction and / or electrical insulation on an electronic component (80) and comprises a substantially two-dimensional body (2) with at least two side surfaces (11, 12) bounding the body (2) and facing away from each other, and in the body (2) at least one incision (13) penetrating the body (2), which is designed to be penetrated at least partially by a volume element (86) on the contact surface (85) when the thermal pad (1) is positioned on a contact surface (85) of the electronic component (80), with material (14) of the body (2) bounding the incision being inverted (15). The thermal pad, handling device, handling system, method for manufacturing an electronic component by handling thermal pads, and electronic component proposed here provide solutions to reduce the effort required to mount thermal pads while simultaneously ensuring the necessary positional accuracy and reliability of the connection made between a thermal pad and a respective mounting surface.
Owner:SCHAEFFLER TECHNOLOGIES AG & CO KG
Elastic wave devices
To provide an elastic wave device with improved heat dissipation. [Solution] The elastic wave device comprises a package substrate having a mounting surface, a first inner layer, a second inner layer, and an external connection surface in this order, a device chip, and a plurality of resonators, and includes a heat dissipation bump arranged to be surrounded by the plurality of resonators and located in the central region on the device chip, the mounting surface has a plurality of metal patterns MP including a heat dissipation pad HDP, the first inner layer has a plurality of metal patterns including a first metal pattern MP1 electrically connected to the heat dissipation pad via via V, the second inner layer has a plurality of metal patterns including a second metal pattern MP2 electrically connected to the first metal pattern via via, the first metal pattern having the largest area in the first inner layer, and the second metal pattern having the largest area in the second inner layer.
Owner:SANAN JAPAN TECH CORP
Large-current small-size overhead inductor structure
ActiveCN224052984UTransformers/reacts mounting/support/suspensionTransformers/inductances coolingCapacitanceConverters
The utility model relates to a large-current small-size overhead inductor structure which comprises a magnetic core, a coil and a supporting artificial foot. The magnetic core is made of an EE type or ER type distributed air gap alloy material and has excellent anti-saturation performance; the coil is of a spiral structure formed by winding a flat wire and is embedded in a center groove of the magnetic core. The supporting artificial feet are located below the magnetic core, the magnetic core and the coil are lifted to be overhead, the overhead height is larger than 1.5 mm, a cavity is formed between the magnetic core and the PCB substrate, and components such as resistors and capacitors can be arranged at the bottom conveniently. According to the utility model, through the overhead design, the space utilization rate of the PCB is obviously improved, the board distribution area is reduced, the large-current flow capacity and the high saturation resistance are realized, the overall height is less than 10mm, and the antenna is suitable for a power supply module, a high-frequency filter and a DC-DC converter in a high-density circuit design. According to the utility model, an automatic chip mounting technology is supported, a heat radiation pad can be installed on the top to optimize heat management performance, and the LED chip is suitable for small-size and high-power-density electronic products.
Owner:CHENGDU HAOYU NENGCHUANG ELECTRONIC TECHNOLOGY CO LTD
Laser radar and automatic driving equipment
PendingCN121645764ACasings/cabinets/drawers detailsModifications by conduction heat transferAcute angleThermal relief
The embodiment of the invention discloses a laser radar and automatic driving equipment. The laser radar comprises a shell, a receiving module and a heat dissipation module, the receiving module comprises a receiving chip, a receiving circuit board and a heat dissipation shell which are sequentially arranged in the first direction, and the first direction is the direction perpendicular to the photosensitive surface of the receiving chip; the shell comprises a first boss formed by extending in the first direction, the heat dissipation module comprises a first heat dissipation pad and a second heat dissipation pad, the first heat dissipation pad is located between the first boss and the heat dissipation shell, and the second heat dissipation pad is located between the receiving circuit board and the heat dissipation shell; the plane where the contact face of the heat dissipation shell and the first heat dissipation pad is located is a first plane, the plane where the contact face of the first boss and the first heat dissipation pad is located is a second plane, the included angle between the normal of the first plane and the first direction is an acute angle, and the first plane is parallel to the second plane. And the heat generated by the receiving circuit board is conducted to the shell, so that the heat dissipation performance of the whole machine is improved.
Owner:SUTENG INNOVATION TECHNOLOGY CO LTD
Self-adjustable water-blocking outdoor power distribution cabinet
PendingCN121863195ASubstation/switching arrangement cooling/ventilationSubstation/switching arrangement casingsThermal reliefWater treatment
The invention discloses a self-adjustable water-blocking outdoor power distribution cabinet, which is provided with a cabinet body convenient for bearing devices, and ventilation holes are formed in the left end and the right end of the outer surface of the cabinet body; comprising storage assemblies installed at the upper end and the lower end of the inner surface of the cabinet body, sealing shells are installed at the middle ends of the outer surfaces of the storage assemblies, exhaust holes are formed in the outer surfaces of the sealing shells, and meanwhile guide columns are connected to the inner surfaces of the sealing shells in a penetrating mode. According to the self-adjustable water-blocking outdoor power distribution cabinet, the storage assembly and the sealing shell are matched with each other, heat dissipation and sealing are matched with each other for use through alternate rotation of the assembled heat dissipation pad and the sealing pad in cooperation with heat dissipation holes, ventilation is carried out for use under normal conditions, and when water is accumulated and the water level rises, the water-blocking outdoor power distribution cabinet is convenient to adjust. And a first sealing ring and a second sealing ring are arranged to be matched with each other, so that sealing and water blocking treatment is formed.
Owner:蒲林瀚
Thermal management for building-integrated photovoltaics
A wall system for a building (such as an exterior façade for a building) may include a plurality of structural members, a plurality of vent openings in the structural members, and a photovoltaic panel attached to the structural members. The vent openings facilitate providing airflow from an exterior of the building to a thermal relief region between the photovoltaic panel and the building, to cool the photovoltaic panel for improved efficiency and lifespan of the photovoltaic panel. In some embodiments, the photovoltaic panel may be supported in a cassette for attachment to a frame of a wall system, and the vent openings may be in a frame of the cassette or the frame of the wall system. The vent openings may further be configured to pass moisture therethrough, to release moisture from within the wall system.
Owner:ENERGY FACADE SYST LLC
Energy storage power supply with good heat dissipation effect
ActiveCN223858217UBatteries circuit arrangementsCurrent conducting connectionsElectrical batteryThermal relief
The utility model belongs to the field of energy storage power supplies, and particularly relates to an energy storage power supply with a good heat dissipation effect, which comprises an outer frame. Heat dissipation pads are distributed on the upper portion and the lower portion of the inner wall of the outer frame in a rectangular shape respectively, a battery body is fixedly installed among the eight heat dissipation pads, a plurality of insertion ports are fixedly installed on one side of the battery body, a protection device is installed on the side, close to the insertion ports, of the outer frame, and two balancing devices are installed on the two sides of the two outer walls of the outer frame respectively. When the device is used, the push-pull block is pulled to drive the baffles to move, the baffles extrude the springs in the moving process, the plugging port closed behind the two baffles is exposed for plugging use, when the device is not used, after the plug is pulled out of the plugging port, the symmetrical baffles move towards the middle under the action of the springs to protect the plugging port, and the device is convenient to use. And the function of quickly protecting the interface after the device is used is realized.
Owner:SHENZHEN TENGFEI INFORMATION SYST INTEGRATION CO LTD
Cleaner with heat dissipation structure
A cleaner includes a battery which is detachable from a main body, a printed circuit board (PCB) provided in the main body, a first connector provided on the PCB and including a first terminal portion, a second connector provided in the battery and including a second terminal portion coupled to the first terminal portion when the battery is mounted onto a battery mounting portion, and a heat dissipation structure provided on the PCB and configured to dissipate heat from the first terminal portion. The heat dissipation structure including a heat dissipation pad provided on the PCB and a plurality of heat dissipation patterns arranged two-dimensionally on the heat dissipation pad.
Owner:SAMSUNG ELECTRONICS CO LTD
Adjustable circuit board automatic burning tool
The invention relates to the technical field of electronic manufacturing equipment, in particular to an adjustable circuit board automatic burning tool which comprises a positioning seat, a guide plate assembly, a pressure stopping assembly and a heat dissipation base plate. The guide plate assembly comprises a first sliding plate, a second sliding plate and a driver, and the two sliding plates relatively slide along a sliding groove in the surface of the positioning base and are used for adjusting the clamping distance. The pressure stopping assembly comprises a sliding sleeve seat, a rotating sleeve seat, a driving rod, a pressure head block and a linkage plate, the pressure head block is driven by the driving rod to realize multi-point pressure equalizing and stopping, and the pressure stopping assembly can adapt to circuit boards with different thicknesses; a liquid cooling coil is arranged in the heat dissipation base plate, and a soaking plate is installed on the surface of the heat dissipation base plate and used for achieving rapid heat conduction and constant-temperature heat dissipation in the burning process. According to the tool, the clamping and pressing positions can be automatically adjusted according to the length, width and thickness of the circuit board, stable fixation and efficient heat dissipation of the circuit board in the burning process are ensured, and the burning precision, the production efficiency and the thermal control stability are remarkably improved.
Owner:CHANGZHOU HUIQIN POWER TECHNOLOGY CO LTD
Loudspeaker assembly
PendingCN122002189ASimple structurecompact structureMicrophonesSingle transducer incorporationElectrical batteryThermal relief
The invention relates to a loudspeaker assembly. The loudspeaker assembly comprises a protection net device; the peripheral surface of the main machine is surrounded by the protective net device; and a battery. According to the main machine, the main machine comprises a base body with a battery compartment and a cover device covering the battery compartment, the battery compartment is formed in the circumferential face of the base body and can contain the battery, a heat dissipation pad is arranged on the side, facing the battery compartment, of the cover device, and the heat dissipation pad is arranged on the side, facing the battery compartment, of the cover device. The heat dissipation pad is in contact with a battery housed in the battery compartment to conduct heat from the battery to the cover device. The battery compartment is preferably configured as a die casting made of an aluminum alloy.
Owner:HARMAN INT IND INC
Heat dissipation gasket, preparation method thereof and chip packaging structure
The invention provides a heat dissipation gasket, a preparation method thereof and a chip packaging structure, and relates to the technical field of microelectronic packaging. The preparation method of the heat dissipation gasket comprises the following steps: providing a porous base material; soaking the porous base material in molten indium in an inert atmosphere; after the porous base material is fully infiltrated, the porous base material infiltrated with indium is taken out and cooled, and an initial heat dissipation gasket is obtained; and carrying out rolling treatment on the initial heat dissipation gasket to obtain the heat dissipation gasket. According to the heat dissipation gasket, through the capillary constraint effect of the porous base material on indium, the situation that air enters the molten indium metal to form bubbles in the follow-up backflow technological process can be reduced, the heat dissipation effect is prevented from being deteriorated, and the probability of corrosion and short circuit caused by the fact that indium leaks to other positions due to the pumping-out effect caused by temperature changes can be reduced.
Owner:QI MOORE (SHANGHAI) SEMICONDUCTOR TECHNOLOGY CO LTD
Low-voltage new energy motor controller
The utility model discloses a kind of low-voltage new energy motor controllers, belong to new energy motor controller technical field, including bottom shell and top cover, the bottom shell is fixedly connected with top cover by bolt, power board and capacitor board are respectively equipped in the bottom shell, control board is installed on the power board, the capacitor board bottom is equipped with multiple capacitors, wherein, the power board and capacitor board are fixedly connected by bolt, the bottom shell is attached with control board, electrolytic capacitor module is separated from control board in the utility model, constructs independent capacitor board and is cooled through heat dissipation pad and aluminum shell, while capacitor board is connected with main control board through standardized interface, to effectively solve the problem of capacitor heat dissipation, improve production efficiency and product cost, at the same time, the utility model reduces after-sales maintenance cost, supports capacitor board individual maintenance replacement, reduces maintenance loss, and capacitor board and capacitor thereon can fully utilize space, effectively reduce the space of controller.
Owner:AFT (XUZHOU) ELECTRONICS CO LTD
High-voltage junction box
PCT designated stageWO2026049503A1Cooling bus-bar installationsMetal casingsMetallic enclosureBusbar
Disclosed is a high-voltage junction box comprising: a housing body formed from a metallic material and receiving therein components of the junction box including a busbar; an upper cover coupled to the housing body so as to cover the upper surface of the housing body; a busbar support protrusion portion protruding from the housing body so as to support the busbar; and an insulating thermal pad positioned between the busbar support protrusion portion and the busbar. Thus, heat in the high-voltage junction box may be effectively managed by enabling heat generated from the internal components to be easily discharged through the busbar and the metallic housing body to which the busbar is connected.
Owner:YURA CORP CO LTD