High heat radiation LED (Light Emitting Diode) nonmetal substrate and high heat radiation LED element as well as making method thereof

A non-metallic plate and non-metallic technology, which is applied in the field of LED non-metallic substrate manufacturing method, can solve the problems of inability to apply LED chip packaging, reduced area of ​​bonding die pad, small precision, etc.
CN102237482AInactive Publication Date: 2011-11-09陈 一璋
4 Cites 14 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
陈 一璋
Publication Date
2011-11-09
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to a high heat radiation LED (Light Emitting Diode) nonmetal substrate and a high heat radiation LED element as well as a making method thereof. The making method mainly comprises the following steps: at least one through hole is pre-molded in a crystal bonding region of a nonmetal plate body; in coordination with the copper layer electroplating step, an electroplating copper layer is coated on the external surface of the nonmetal plate body; a solid heat conducting copper column is formed in the at least one through hole; the metal layer is patterned by using an etching technology; a crystal bonding pad and a wire bonding pad are formed on the upper surface of the ceramic plate body; a heat radiation pad is formed on the lower surface of the ceramic plate body corresponding to the crystal bonding pad so that the crystal bonding pad and the heat radiation pad are integrally molded with the heat conducting copper column; and the high heat can be rapidly conducted to the heat radiation pad of the lower surface through the heat conducting copper column while the crystal bonding pad reaches the high heat.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a method for manufacturing an LED non-metallic substrate, in particular to a high-radiation-radiation LED non-metal substrate and a method thereof, and a high-radiation-radiation LED component and a method thereof. Background technique

[0002] Substrates used in LED chip packaging can be roughly divided into metal or non-metallic substrates such as ceramic substrates or silicon substrates. In terms of manufacturing methods for ceramic boards, there are currently four manufacturing methods, which are low-temperature co-fired multilayer ceramic boards ( LTCC) or a high-temperature co-fired multilayer ceramic board (HTCC), a direct bonded copper substrate (DBC) and a direct copper-plated substrate (DPC); among them, the thermal conductivity of the DBC and DPC substrates directly using ceramic boards is The best, but because the DBC substrate synthesizes the copper plate on the ceramic plate body, it must be completed in a high te...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More