Non-energy-consumption high efficiency notebook heat radiation pad computer

Abstract

The invention discloses a high efficiency notebook computer heat sink without energy consumption. The high efficiency notebook computer heat sink is characterized by comprising a main gasket, a secondary gasket, a liquid inlet conduit and a liquid outlet conduit. The inner cavity of the main gasket is respectively communicated with a liquid outlet unidirectional valve and a liquid inlet unidirectional valve. The secondary gasket comprises a radiating water cavity. One end of the liquid outlet conduit is communicated with the liquid outlet unidirectional valve, and the other end is connected with the radiating water cavity. One end of the liquid outlet conduit is communicated with the liquid outlet unidirectional valve, and the other end is communicated with the radiating water cavity. The inner cavity of the main gasket, the radiating cavity of the secondary gasket, the liquid inlet conduit and the liquid outlet conduit are filled with liquid. When being used, a notebook computer is arranged on the main gasket. The high efficiency notebook computer heat sink solves the radiating problem of circulating water absorbing the heat of the notebook computer and the power problem for the circulating water of the notebook computer to flow in a radiating gasket of the notebook computer. The high efficiency notebook computer heat sink not only has low manufacturing cost, is convenient for use and can process circulating water cooling without using electrical energy, but improves the radiation protection effect of the notebook computer greatly.

Description

technical field [0001] The invention relates to the field of computer peripheral equipment, in particular to a cooling pad for notebook computers with no energy consumption and high efficiency. Background technique [0002] Laptops are smaller and more compact than PCs with complex structures. As the main frequency of the CPU continues to increase, its power and heat dissipation also increase. How to discharge tens of watts of heat out of the chassis has become a difficult problem for the further improvement of the performance and cost of the notebook computer. At present, there are the following types of cooling pads (bases) for notebook computers: the first type: a simple base made of plastic or metal, placed at the bottom of the notebook computer, and the legs of the base can raise the rear end of the notebook computer by a few centimeters, which can To speed up the air circulation around the notebook computer; the second category: the base equipped with a cooling fan, g...

AI Technical Summary

Problems solved by technology

The above-mentioned existing notebook computer cooling pad (base) mainly has the following defects: 1, adopting the bottom of an overhead notebook to carry out natural air cooling has a poor heat dissipation effect, and the cooling pad cannot be used when the notebook computer is placed on the lap; 2. . For the forced air-cooled base equipped with a fan, an external power supply is required, which affects the standby time of the notebook computer; in addition, the fan installation position is fixed, and the heat dissipation effect is only good for the local area; 3. For the existing heat dissipation pad, if the water If there is no circulation or flow, the effective heat dissipation time is limited, and the overall heat dissipation effect is not ideal; if the water circulation also consumes additional power, it will affect the standby time of the laptop, and at the same time requires a large heat dissipation device for circulating water, which is inconvenient to carry; 4. Mandatory Air-cooled or water-cooled cooling pads not only consume power, but also cost more to manufacture

For example, the application number is 200520139533.4 Chinese patent discloses a heat sink for laptop computers, its volume is too large to carry, and it is inconvenient to use on the lap, and the water in its heat-absorbing tank cannot flow, the heat dissipation effect is poor, and it can be used for a period of time. It is also troublesome to change the water through the valve plug

For another example, the application number is 200710073081.8 Chinese patent discloses a silicon rubber nano pad, not only the effect of natural air cooling through the heat dissipation holes is not good, but also its production cost is relatively high

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