452 results about "Thermally conductive pad" patented technology

A semiconductor chip package that includes a DC—DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC—DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC—DC converter provided on the substrate. The DC—DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC—DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area. Heat generated by the DC—DC converter is conducted out of the LGA package through the plurality of pads.

A dispenser for relative rapid cooling or heating of the contents of a liquid storage container provides a receptacle for receiving the liquid storage container therein and positioning a thermal transfer portion of the liquid storage container in thermal conductive relationship with a thermal conduction pad associated with the receptacle. Thermal energy is effectively and efficiently transferred from the thermal conduction pad to the liquid in the liquid storage container. The thermal conduction pad is controlled to provide and maintain the desired temperature to the liquid. The liquid is dispensed directly from the container. Various types of containers can be used in the dispenser, with a special bag-in-box container having a inner container and outer box with thermal conduction windows in the box to provide good heat transfer between the thermal conduction pads and the inner container constituting an aspect of the invention. A special rigid container can also be used.

A package structure of light-emitting diode with an electrostatic protective diode is disclosed. The structure has a light-emitting diode, an electrostatic protective diode, an electrical & heat conductive pad, and an electrical & heat conductive base substrate. The light-emitting diode is flipped and with its p-electrode and n-electrode, respectively, mounted on the n-electrode of the electrostatic protective diode and the electrical & heat conductive pad by conductive bumps. The latter two are separated themselves by a gap or an insulation layer and both of them are mounted on and electrically connected to the electrical & heat conductive base substrate. The structure is then through a bonding wire bonding to a bonding pad and the electrical & heat conductive base structure, respectively, connected to a positive and a negative terminal of a DC power to implement the electrical connection. The foregoing bonding pad is located on the exposed portion of n-electrode of the electrostatic protective diode.

Thermal pads, including free-standing examples, are provided for dissipating heat from a heat source like a semiconductor die to a heat management aid such as a heat sink. The thermal pads include a sheet of vertically aligned carbon nanotubes and a surface layer. One such surface layer has a thickness of less than 500 microns. Another includes a metal layer having a thickness of less than 500 microns and an intermediate layer attaching the metal layer to the sheet of carbon nanotubes.

Methods and devices provide for remote management of a local computer utilizing a compact, portable interaction device for external connection to a local computer and a network. The interaction device includes a thermally conductive housing with circuit boards disposed within. At least one heat-generating component is disposed on an outer surface of each circuit board with at least one thermally conductive pad for each circuit boards abutting the at least one heat generating component and the inner surface of the housing. The device also includes ventilation means for allowing ambient air to flow through the interior of the housing.

At least one thermoelectric assembly controlled by a microprocessor and disposed on a thermal conduction pad configured to conduct energy to and from the thermoelectric assembly and adjacent the treatment area positioned with removable electronics and a breathable liner. The hot intensity, cold intensity and time delay between sequences can also be selected as well as alternating temperature sequences with both vibration and tension monitoring to promote blood flow and speed up healing.

A rear-loading LED module for a rear combination lamp is disclosed. One or more LEDs are mounted on a printed circuit board that mechanically holds them at the focus of a faceted, parabolic reflector. Light from the LEDs diverges transversely and horizontally, and is collimated by the reflector, and the reflected collimated light is directed in a generally longitudinal direction out of the rear combination lamp, toward the viewer. The LED module itself is generally longitudinally oriented, and is insertable longitudinally into the interior of the reflector from a hole at the vertex of the reflector. The printed circuit board, an optional thermal pad adjacent to the printed circuit board, and a thermally conductive layer adjacent to the optional thermal pad are all generally planar layers, are all generally parallel to each other, and may optionally all have the same footprint. Together, the printed circuit board, the thermal pad and the thermally conductive layer may all form a generally planar ledge.

Methods for forming thermal pads including arrays of vertically aligned carbon nanotubes are provided. The thermal pads are formed on various substrates, including foils, thin self-supporting polished metals, semiconductor dies, heat management aids, and lead frames. The arrays are growth from a catalyst layer disposed on the substrate. Forming the array can include leaving the ends of the nanotubes unfinished, attaching a foil thereto, or coating the ends with a metal layer. The metal layer coating can then be polished to a desired smoothness. The array can be filled with a matrix material, only partially filled, or left unfilled. Where the substrate is a foil, the method can be a continuous process where foil is taken from a roll and fed through a series of formation steps. Where the substrate is a lead frame, heating can be generated by applying an current to a pad of the lead frame.

An apparatus and method is disclosed for an improved absorbent pad and thermal pack for absorbing a liquid discharged from a patient. The absorbent pad and thermal pad comprises an outer sheet made of a liquid impermeable material and an inner sheet of a liquid permeable material. An absorbent sheet is disposed between the inner sheet and the outer sheet. A flexible liquid impermeable container having a chemical mixture which undergoes an thermal reaction upon activation thereof is interposed between the outer and inner sheets to enable the thermal source to be applied to the patient and to enable any liquid from the patient to permeate through the inner sheet to be absorbed by the absorbent sheet. The inner sheet of a liquid permeable material provides a moderate insulation barrier whereas the absorbent pad provides a substantial insulation barrier for directing the thermal source to the patient.

A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.

An endshield assembly for an electronically commutated motor includes an endshield, a control assembly, and a power assembly. The endshield includes a plurality of recessed fins on an outer surface, and a substantially flat raised portion on an internal surface. The raised portion is in contact with a thermal pad. The control assembly includes the thermal pad and a control board on which is located a plurality of power transistors. The thermal pad provides thermal contact between the transistors and the endshield to enable the endshield to dissipate heat from the transistors. The transistors include a plurality of leads that extend substantially parallel to the control board which enable the leads to be coated for protection against harsh external environments. The power assembly includes a power board having an insulator positioned between the power board and the control board.

The invention discloses an LED fluorescent lamp which comprises a body, a heat-conducting pad, an insulating pad, a lampshade, a plurality of LEDs and a substrate used for fixing the LEDs. One side of the body is provided with a radiator while the opposite side is provided with a first groove, two opposite upper groove rims of the first groove of the body are respectively provided with expansion parts, an opening edge of the lampshade is provided with clamping parts respectively clamped with the expansion parts of the two rims, the insulating pad is placed in the first groove of the body, the insulating pad is provided with a second groove, and the heat-conducting pad and the substrate are orderly fixed in the second groove of the insulating pad. Heat energy emitted from the LEDs is rapidly conducted to the body by orderly arranging the heat-conducting pad and the insulating pad under the substrate, thus greatly improving the radiation effect.

A dispenser for relative rapid cooling or heating of the contents of a liquid storage container provides a receptacle for receiving the liquid storage container therein and positioning a thermal transfer portion of the liquid storage container in thermal conductive relationship with a thermal conduction pad associated with the receptacle. Thermal energy is effectively and efficiently transferred from the thermal conduction pad to the liquid in the liquid storage container. The thermal conduction pad is controlled to provide and maintain the desired temperature to the liquid. The liquid is dispensed directly from the container. Various types of containers can be used in the dispenser, with a special bag-in-box container having a inner container and outer box with thermal conduction windows in the box to provide good heat transfer between the thermal conduction pads and the inner container constituting an aspect of the invention. A special rigid container can also be used.

A semiconductor device according to the present invention includes an island provided on one surface of a resin substrate, an external terminal provided on the other surface of the substrate, a thermal pad provided on the other surface of the substrate in opposed relation to the island, a heat conduction portion extending through the substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner, and a solder resist portion provided on the other surface of the substrate and having a heat dissipation opening which defines a gap with respect to an outer periphery of the thermal pad and a terminal opening which exposes the external terminal.

A method of performing a function on a three-dimensional semiconductor chip package as well as on individual chips in the package is disclosed. That method involves the creation of an operative relationship between a function performer and an edge feature on the chip or chips wherein the edge feature consists of one or more of an electrically conductive pad, thermally conductive pad, a probe pad, a fuse, a resistor, a capacitor, an inductor, an optical emitter, an optical receiver, a test pad, a bond pad, a contact pin, a heat dissipator, an alignment marker, a metrology feature and a function performer may be any one or more of a test probe, the laser, a programming device, an interrogation device, a loading device or a tuning device. In addition, a chip per se with edge features is disclosed along with a three-dimensional stack of such chips in either of several different configurations. The disclosure provides information regarding the formation of edge feature, the singulation of dice having incipient edge features, the stacking of dice and the handling or dice with edge features.

The present invention relates to a method and apparatus of heat dispersion from the bottom side of an integrated circuit package mounted on a printed circuit board ("PCB"). In operation, a heat slug is thermally coupled to the underside of an integrated circuit ("IC") package. In one embodiment, the heat slug comprises a disc made of copper or other thermally conductive material in between two layers of elastomeric, conductive material such as silicone imbedded with aluminum particles. The thermal pad extends through each layer of the PCB, including the ground layer. In this way, the ground layer of the PCB is utilized for heat dispersion.

An LED light source is provided that is comprised of a heat sink assembly and at least one LED, where the heat sink assembly includes a hollow heat sink (e.g., a cylindrical heat sink) and an LED thermal pad that mechanically closes an opening in the heat sink via direct mechanical and thermal contact. The thermal pad or pads of the LED are in direct mechanical and thermal contact with an upper surface of the LED thermal pad.

A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes a circuit board comprising at least one device region, a plurality of electrode regions, at least one first thermal via exposed through upper and lower surfaces of the at least one device region, and a plurality of second thermal vias exposed through upper and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the first thermal via; at least one LED mounted on the at least one first thermal pad; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the second thermal vias; and a plurality of wires to connect the at least one LED with the plurality of first electrode pads.