319 results about "Thermally conductive pad" patented technology

The invention relates to the technical field of industrial camera calibration, in particular to a visual calibration positioning method and a workpiece heat conduction pad automatic mounting method and system.The method comprises the steps that a camera is moved in the x-y direction, and an affine transformation matrix between calibration pixel coordinates corresponding to calibration positions and calibration mechanical coordinates is obtained based on nine-point calibration; obtaining a target shooting position, and establishing a translation relation matrix between the target shooting position and the calibration position; and obtaining a target pixel coordinate, and calculating a target mechanical coordinate representing the to-be-mounted position based on the affine transformation matrix and the translation relation matrix. According to the invention, the mounting positioning effect of the portal frame can be improved.

The invention discloses a high-heat-conductivity leakproof liquid metal phase change heat-conducting gasket and a preparation method thereof, and relates to the technical field of heat-conducting gaskets. The preparation method comprises the following steps: alloying high-heat-conductivity low-melting-point liquid metal gallium with high-heat-conductivity metal silver and copper, mixing with a polymer containing a specific functional group, adding a modified heat-conducting filler, and carrying out UV curing to form the heat-conducting gasket. Liquid metal is easily alloyed to form eutectic alloy, the melting point can be increased, a chemical cross-linked network formed by the modified heat conduction filler and UV curing can make up heat conduction loss, a heat conduction path is established, the interface thermal resistance is reduced, and the heat conduction efficiency is remarkably improved. The surface oxide layer interacts with the polar group of the polymer, and the steric hindrance effect of the cross-linked network is combined to synergistically realize the leak-proof effect. The high-heat-conductivity leakproof liquid metal phase change heat-conducting gasket prepared by the invention has the effects of high heat conductivity and leakproof.

A thermal pad and an electronic device are disclosed for effectively dissipate heat of an electronic component. The thermal pad includes a first cover, a second cover, an elastic shell, and liquid metal. The elastic shell is bent and closed into a tubular structure. The first cover and the second cover are respectively mounted at two ends of the tubular structure to form a closed cavity. The closed cavity is configured to accommodate the liquid metal. Filling the liquid metal into the elastic shell implements good heat conduction effect by using high thermal conductivity of the liquid metal, and implements compression on the thermal pad during assembly of the thermal pad by using compressibility of the elastic shell, to reduce a thickness of the thermal pad.

The invention relates to the technical field of advanced thermal interface materials, in particular to a high-thermal-conductivity boron nitride insulating heat-conducting gasket and a preparation method and application thereof. The heat-conducting gasket is prepared from the following raw materials in parts by weight: 1000 parts of organic silica gel, 50 to 500 parts of modified boron nitride, 50 to 200 parts of diluent and 150 to 1500 parts of auxiliary heat-conducting filler, according to the heat-conducting gasket, the sheet-shaped boron nitride is oriented in a plane parallel to the horizontal plane through a rolling-hot pressing synergistic orientation technology. Vacuum plasma treatment, in-situ silanization modification and ultrasonic dispersion are integrated, and continuous and automatic production of BN surface treatment is achieved. Meanwhile, by optimizing a rolling-hot pressing synergistic process, directional arrangement and tight stacking of the BN sheet layers are promoted, an efficient three-dimensional heat conduction network is formed, and the heat conduction performance of the composite gasket is remarkably improved.

The invention discloses a quick release structure for a rail traffic communication module and a heat dissipation assembly thereof and a use method. The quick release structure comprises a bottom plate, a mainboard, a communication module, a heat conduction pad and a heat dissipation plate. The bottom plate is fixedly connected with the mainboard through a pressing rivet stud, the communication module is installed on the mainboard, the heat dissipation plate is arranged on the outer side of the communication module, one end of the heat dissipation plate is detachably clamped with a bottom plate hook hole through a hook, the other end of the heat dissipation plate is screwed and locked with a mainboard module mortise column through a captive screw, and a heat conduction pad is arranged between the communication module and the heat dissipation plate and used for heat conduction. During installation, the heat dissipation plate is rotationally attached to the heat conduction pad and then locked, and during disassembly, the heat dissipation plate can be taken down by loosening the screws and rotating reversely. The structure realizes quick disassembly and assembly of the heat dissipation assembly, is simple and convenient to operate, does not need tools, has excellent heat dissipation performance, is suitable for various rail transit communication modules, and has the advantages of compact structure, high universality, high maintenance efficiency and the like.

The application discloses an integrated double-color-temperature lamp box light source, and belongs to the technical field of illumination light sources.The integrated double-color-temperature lamp box light source comprises a shell and a control module, the shell is a hollow cylindrical structure, an installation cavity is arranged in the shell, and the inner wall of the shell is provided with annularly arranged heat dissipation fins; the annularly arranged heat dissipation fins and heat dissipation through holes form a high-efficiency heat dissipation channel, the heat dissipation channel is matched with a heat-conducting pad to quickly conduct the heat of a substrate, and the working stability and service life of LED lamp beads are significantly improved; warm-color-temperature and cold-color-temperature LED lamp beads are alternately and uniformly arranged in an annular manner, light mixing is more uniform and soft, there are no obvious color-temperature partition and dark area, and the color rendering effect is better; the color temperature and brightness can be flexibly adjusted by cooperating a light-adjusting knob with a wiring rear seat, different illumination scene requirements can be adapted, the sealing property of a wiring position is improved by a waterproof sealing pad, the overall structure is compact, installation and positioning are accurate, integrated design is realized, the assembly efficiency is high, and the integrated double-color-temperature lamp box light source has the advantages of excellent heat dissipation, accurate control, safety in use, wide applicability and the like.

This invention discloses a power terminal, a power terminal assembly, and a charging dock. The power terminal includes: a cylindrical portion for mating with a matching power terminal; and a welding portion connected to the rear end of the cylindrical portion for welding to a high-voltage cable. The welding portion is flat and has a first side and a second side opposite each other in its thickness direction. The first side of the welding portion is used for welding to the high-voltage cable, and a partial protrusion is formed on the second side of the welding portion. The partial protrusion is used for thermal contact with the thermal pad of the charging dock, so that the heat of the power terminal can be transferred to the temperature sensor of the charging dock via the thermal pad. In this invention, the axial length of the power terminal of the charging dock is relatively short, reducing the volume and manufacturing cost of the power terminal.

The application provides a heat dissipation structure with a high-thermal-resistance material as a shell and an electronic device with the same. The electronic device comprises a printed circuit board, a high-thermal-resistance shell, a heat-conducting pad and a metal mounting rack. The heat-conducting pad exchanges heat with electronic components on the printed circuit board; the high-thermal-resistance shell contains the printed circuit board, forms a columnar space in the shell so that a first end of the columnar space is exposed outside the high-thermal-resistance shell and a second end of the columnar space is closed in the high-thermal-resistance shell, and an outer side of the columnar space is provided with a metal layer to contact the heat-conducting pad, wherein the heat transfer coefficient of the high-thermal-resistance shell is not greater than 1; the metal mounting rack is arranged on opposite sides of the high-thermal-resistance shell with the printed circuit board, and the metal mounting rack contacts the metal layer by penetrating the metal mounting rack with a fixing member and penetrating the first end of the columnar space.

The invention discloses a photovoltaic module installation method based on building surface characteristics, and belongs to the technical field of new energy and building integration. According to the method, a comprehensive characteristic model including curvature, material and thermal performance is constructed by fusing three-dimensional laser scanning and infrared thermal imaging data; based on a model, designing a mounting base adaptive to a curved surface or a plane, optimizing component layout by using a building information modeling technology, and monitoring mounting stress in real time through a distributed sensor network; during fixing, a heat-conducting gasket is laid, an adjustable bolt is used, and a seam is sealed; a flexible conductive band and a modular junction box are adopted for electrical connection; and finally carrying out illumination response, wind resistance and thermal stability tests. According to the invention, comprehensive perception and self-adaptive installation of building surface characteristics are realized, and the installation precision, the structural safety and the energy conversion efficiency are improved.

A connecting device includes a compressively deformable heat-conductive pad, a connector assembly, and a protection structure. The connector assembly includes a shield. The shield defines a first insertion channel and has a bottom wall and a pressing structure. The first insertion channel has a first channel opening for insertion of a pluggable module. The bottom wall forms a bottom aperture for the heat-conductive pad to pass into the first insertion channel. The protection structure includes a first elastic protection member disposed on the bottom wall between the first channel opening and the bottom aperture. During insertion of the pluggable module into the first insertion channel, the pluggable module is supported by the first elastic protection member to maintain a gap between a heat-generating surface of the pluggable module and the heat-conductive pad. Then, a back surface of the pluggable module is pressed by the pressing structure to elastically deform the first elastic protection member and to cause the heat-generating surface to abut against the heat-conductive pad. Thus, the surface of the heat-conductive pad can abut against the heat-generating surface of the pluggable module without a gap, thereby improving heat dissipation.

The utility model discloses a split type heat dissipation device of an electromagnetic valve, which relates to the technical field of heat dissipation devices and comprises two combined type heat dissipation frames which are symmetrically arranged, and the inner wall of each combined type heat dissipation frame is provided with a coating cavity matched with the outer contour of the electromagnetic valve. A plurality of heat dissipation fins are evenly distributed on the outer surface of each combined type heat dissipation frame, the two combined type heat dissipation frames are detachably connected, and a flexible heat conduction pad is arranged in a wrapping cavity of each combined type heat dissipation frame in an attached mode. The combined heat dissipation frame is easier to install and maintain and higher in use flexibility, the wrapping cavity can be matched with the outer contour of the electromagnetic valve, the flexible heat conduction pad is matched, the wrapping cavity can be tightly attached to the valve body, the heat conduction efficiency is improved, heat is rapidly conducted, and therefore the heat dissipation effect can be improved.

The invention provides a high-thermal-conductivity low-modulus graphene fiber heat-conducting gasket and a preparation method thereof. Graphene fibers are directionally wound and impregnated to prepare a prepreg, the prepreg is laminated and bonded to form a high-orientation fiber plate, and then the high-orientation fiber plate is directionally cut in the direction perpendicular to the fibers to obtain the heat-conducting gasket composed of continuous vertical fibers and organic silicon. The fiber is of an X-shaped crossed network structure, and is combined with an elastic silica gel matrix to form a hinge-like structure which can be highly deformed under the orientation of 0.5-10 degrees and-10--0.5 degrees, so that the compression resilience and durability are remarkably improved, and meanwhile, efficient heat conduction is kept. According to the structure, the problems of buckling, fracture and stress concentration which are easily caused by traditional vertical or random arrangement are avoided. A one-way felt impregnation lamination cutting method is adopted, the processing problem caused by high filler is solved, the fiber content can reach 85.1 wt%, and the array density is 2.4-195.9 mg / cm. The gasket has high thermal conductivity, low modulus and excellent rebound resilience, and is suitable for thermal management of high-power electronic equipment such as electronic base stations, communication radars, new energy automobiles, aerospace and the like.

The invention discloses a weather-resistant cold-resistant flame-retardant low-voltage power cable applied to the field of low-voltage power cables, which comprises a plurality of sections of protection tubes, wire cores are arranged in the protection tubes in a penetrating manner, two ends of the protection tubes are connected with partition rings, and the adjacent protection tubes are clamped through positioning sleeves; a protection wire harness is connected between the partition rings at the two ends of the protection pipe, the protection pipe is sleeved with auxiliary heating rings distributed at equal intervals, each auxiliary heating ring is composed of a fixing ring and a clamping ring and is used for fixing and clamping a heat preservation film through a fixing nail, and an electric heating unit is arranged on each clamping ring; a detection line with a temperature monitoring unit is arranged in the pipe in a penetrating mode, a heat conduction cushion block is arranged between every two adjacent auxiliary heating rings, sensing of the temperature of all sections of the cable is achieved, a tight auxiliary heating system is formed through the auxiliary heating rings and the heat preservation film, and the low-temperature sections of the cable are locally heated. And multi-section temperature monitoring and self-adaptive heating control of the cable in a cold environment are realized.

The utility model provides a totally-enclosed liquid crystal display adopting conduction heat dissipation, which belongs to the technical field of liquid crystal displays and comprises an aluminum alloy display screen main body, a power supply module, a liquid crystal display control mainboard, a display module and a display rear shell, according to the aluminum alloy display screen body, an aluminum alloy frame and a back plate are bonded through heat conduction silica gel to wrap a display module, and a metal shell of the display module is bonded with a display screen back plate through heat conduction silica gel. According to the utility model, based on a conduction heat dissipation principle, that is, heat is spontaneously transferred from a high-temperature object to a low-temperature object, in a high-power totally-enclosed module, heat generated by a heating element is rapidly transferred to a casing back plate and a frame through a heat-conducting medium (such as heat-conducting silicone grease and a heat-conducting pad), and the casing back plate and the frame are made of metal materials with high heat conductivity coefficients, so that the heat dissipation efficiency is greatly improved. And the heat dissipation area is large, so that the heat can be quickly dissipated into the air, and a good heat dissipation effect is realized.

The utility model discloses a heat-conducting gasket die cutting device, which relates to the field of heat-conducting gasket processing, and comprises a rotating rod, a bearing fixedly sleeved on the top of the side wall of the rotating rod, a top plate arranged above the rotating rod, and a plurality of support rods uniformly and fixedly arranged between the outer ring wall of the bearing and the bottom of the top plate, a motor is fixedly installed on the top of the top plate, the output end of the motor penetrates through the top plate to be fixedly connected with the top of a rotating rod, the rotating rod is movably sleeved with a lantern ring, transverse rods are fixedly installed on the two sides of the rotating rod, and the two transverse rods are movably sleeved with moving rods. And linkage rods are movably connected between the tops of the two moving rods and the two sides of the lantern ring. According to the gasket cutting device, the hydraulic rod is controlled to push the lantern ring to move, the moving rod can be driven to move in the direction of the transverse rod, the position of the cutting assembly at the bottom end of the moving rod can be adjusted, and finally the motor is controlled to drive the rotating rod to rotate so that the cutting assembly can cut gaskets of different sizes.

This utility model relates to the field of circuit board technology, specifically a circuit board with a moisture-proof structure, including a circuit board body, a mounting frame that fits into the inner wall of a sealed box, a fixed connection between the circuit board body and the mounting frame, fins fixedly connected to the side of the mounting frame facing away from the circuit board body, a thermally conductive pad fixedly connected to the fins, and an insulating pad fixedly connected to the side of the circuit board body near the fins. First, a layer of thermally conductive pad is pasted on the upper surface of the fins, and then the fins are fixed to the outer wall of the mounting frame with screws. An insulating pad is pasted on the back of the circuit board body. The insulating pad can electrically isolate the fins from the circuit board body, ensuring safe and stable circuit operation, and at the same time, the insulating pad can block moisture, thus achieving a moisture-proof effect.

A gas detector is provided. The gas detector has a housing defining a cavity and a display module is disposed within the cavity. The display module has a first PCB, a base plate, a metal enclosure, and a thermal gap pad. The metal enclosure is positioned on top of the base plate, and the thermal gap pad is disposed in between the metal enclosure and the second PCB. The second PCB is disposed on top of the thermal gap pad.

The application discloses a mainboard heat dissipation simulation test platform and belongs to the technical field of communication equipment. The application comprises a case shell, a cover plate, a simulation heat source, a supporting plate, a heat dissipation plate and a heat conduction pad; the simulation heat source is arranged on the supporting plate, the heat conduction pad covers the simulation heat source and is in contact with the heat dissipation plate or the cover plate, the two sides of a ventilation hole are provided with clamping grooves, the clamping grooves are provided with ventilation hole baffles, the case simulates the shell of a communication equipment and protects the heat source and the supporting plate; the simulation heat source is consistent with the parameters of a main heat source in an electronic equipment and generates heat in the test; the cover plate and the heat dissipation plate provide heat dissipation for the heat source; the heat conduction pad reduces the contact thermal resistance between the heat source and the cover plate and the heat dissipation plate and improves the heat conduction efficiency. The application can effectively simulate the heat dissipation system of the communication equipment, including the processes of heat generation of the heat source, heat conduction and shell heat dissipation; the application has the characteristics of simplicity, effectiveness and low cost and is particularly suitable for the heat dissipation simulation test of the communication equipment in the heat dissipation design stage.

The utility model relates to the field of graphene light wave blanket, disclose a kind of heating type graphene light wave blanket, including outer edge, the inner wall of outer edge is provided with heating component, the heating component includes heating layer, the inner wall of outer edge is arranged in heating layer, the right end of heating layer is equipped with charging wire, the charging wire is passed through and installed in the outer wall of outer edge, the top end of heating layer is provided with heat-conducting pad and quantity is multiple groups, the inner wall of outer edge is close to top end position and is provided with upper cover layer, the bottom end of heating layer is fixedly connected with substrate, the lower surface of heat-conducting pad is set as wave shape, multiple groups heat-conducting pad are staggered and symmetrically arranged. In the utility model, by being set as wave shape three-dimensional structure to heat-conducting pad, better supporting effect can be reached when using, and when bending light wave blanket, the contact position of upper and lower two groups of heat-conducting pads will interact, compared with plane structure, three-dimensional structure has better wrinkle resistance effect.

This utility model relates to a multifunctional thermally conductive coating. The thermally conductive coating includes, from bottom to top, a base layer for adhesion, a thermally conductive layer forming a thermally conductive network structure, an insulating layer that increases dielectric breakdown voltage, and a heat dissipation layer that accelerates heat dissipation and reduces interfacial thermal resistance. This multifunctional thermally conductive coating, through the adhesion of the base layer, enables effective connection between the coating and thermally conductive pads. Simultaneously, the thermally conductive layer, insulating layer, and heat dissipation layer contribute to high thermal conductivity, thus achieving a balance between thermal conductivity and adhesion, improving the functionality of the thermally conductive coating. Furthermore, the heat dissipation layer can be connected to heat dissipation devices, further enhancing the balance between thermal conductivity and adhesion.

The invention discloses a temperature adjusting system for a sky-direction accelerometer. The temperature adjusting system comprises a temperature equalizing shell, a heat conduction pad and a heating film. The heat conduction pad is laid on the inner bottom face of the temperature equalizing shell, and the heating film is arranged on the outer bottom face of the temperature equalizing shell. The bottom surface of the sky accelerometer is placed on the heat conducting pad; and the sky accelerometer and the upper edge of the temperature equalizing shell are connected with the gauge adding seat. The invention also discloses an acceleration sensor. The temperature adjusting system has the beneficial effects that the temperature of the sky-oriented accelerometer is adjusted through heating of the heating film, so that the sky-oriented accelerometer is located in a stable temperature field, the interference of external environment temperature change on the sky-oriented accelerometer is reduced, the sensitivity of the sky-oriented accelerometer to the external environment temperature is reduced, and the sensitivity of the sky-oriented accelerometer to the external environment temperature is improved. And the performance of the sky-direction accelerometer is improved.

The utility model discloses a heat dissipation structure for a control machine, which comprises a heat dissipation shell, the middle part of the heat dissipation shell is provided with a through hole penetrating through the front end and the rear end of the heat dissipation shell, and the outer surface of the heat dissipation shell is provided with a plurality of first heat dissipation fins positioned in the area of the through hole; a mounting frame surrounding the through opening is connected into the heat dissipation shell, a first heat dissipation boss is arranged on the mounting frame, and a first heat conduction pad is mounted at the tail end of the first heat dissipation boss. According to the utility model, through the arrangement of the first heat conduction pad, the first heat dissipation boss and the first heat dissipation fins, heat generated by the heating element in the middle area of the heat dissipation shell can be quickly transmitted to the through hole, and then the heat is released and volatilized into air through air convection at the through hole. Therefore, on the premise of forbidding to expose the through hole and the energy consumption part, the heat dissipation efficiency of the heating element in the control machine is ensured, and the heat dissipation quality is more reliable, safer and more stable.

This invention proposes a PCBA motherboard for a wireless charger, comprising a board body, a main chip module, a driver module, a power device module, a communication chip, and positioning holes. The main chip module, driver module, and power device module are mounted on the top of the board body. The advantages of this invention are: the gaps between the thermal pads allow airflow, further improving heat dissipation; the large heat dissipation surface allows heat to be conducted to the upper thermal layer; and the presence of several circular holes in certain areas significantly increases the heat dissipation area, enabling heat to dissipate more quickly into the surrounding environment. This effectively improves the heat dissipation performance of the wireless charger's PCBA. This design not only extends the lifespan of the motherboard and various electronic components but also improves the overall stability and reliability of the wireless charger.

The invention discloses a battery module with bidirectional thermal runaway protection, which comprises a bottom bracket, a plurality of battery cell monomers are uniformly mounted in the bottom bracket, and a top bracket for fixing the positions of the battery cell monomers is mounted at the top of the bottom bracket. According to the invention, the thickened and patterned heat conduction pad is creatively utilized, and two seemingly contradictory functions of heat conduction and pressure relief are perfectly integrated into a single component. The pressure relief valve serves as a heat conduction medium and also serves as a guarantee of a pressure relief space and a guide of a pressure relief path, and the contradiction of space competition is fundamentally solved. By means of the radial first pressure relief communication grooves in the heat conduction pad, huge energy and substances erupted at a single point can be instantly divided into multiple paths, and local pressure and temperature are reduced. A pressure relief path is designed to be in the mode that one path is directly discharged outwards and the other path is turned out upwards, and high-temperature harmful substances are actively guided to a preset safety area.

This invention belongs to the field of mechanical device technology and discloses a cutting device for producing notebook insulating thermal pads. It includes a frame, on which a clamping mechanism and a stamping mechanism are mounted. A cutting mechanism is mounted at the output end of the stamping mechanism. The clamping mechanism includes a U-shaped groove and a first connecting column. The first connecting column is connected to a lower mounting plate, and the lower mounting plate is equipped with a first telescopic cylinder. The output end of the first telescopic cylinder is connected to a lifting plate. Two sets of second connecting columns are mounted on the upper side of the lifting plate. Each of the second connecting columns has a mounting seat at its upper end, and the mounting seat is equipped with a fastener. The transverse cutting fixture includes a sliding mounting plate with a cutting groove. A guide rod and a special lead screw are mounted in the cutting groove. A cutting seat is mounted on the guide rod and the special lead screw. A cutting blade is mounted on the cutting seat. A support rod is mounted on the cutting seat. A guide block is mounted on the support rod. A displacement rod is mounted on the guide block.

Provided in the present application is a battery pack, comprising a cover plate, a case, and a battery module accommodated in the case, wherein the cover plate covers the case; the battery module comprises a plurality of battery cells, every two adjacent battery cells being electrically connected via an aluminum busbar; and the cover plate is provided with a boss on the inner surface facing the case, a thermally conductive pad being provided between the boss and the aluminum busbar. By means of the provision of the boss and the thermally conductive pad between the inner surface of the top cover of the battery pack and the aluminum busbar on the top surface of the battery module, natural heat dissipation of the battery pack is enhanced.

The utility model discloses an SSD heat dissipation assembly and a notebook computer, the SSD heat dissipation assembly comprises a heat dissipation plate, the heat dissipation plate comprises a mounting wall surface, the mounting wall surface is used for mounting a circuit board, and the mounting wall surface comprises a first bearing part and a second bearing part which are different in height; and a first clearance space is formed between the first bearing part and the second bearing part. The circuit board comprises a first power component, a second power component and a plurality of electronic components, and the first gap space is used for accommodating at least part of the electronic components. And heat-conducting paste is arranged between the first bearing part and the first power part. And a heat conduction pad is arranged between the second bearing part and the second power part, so that the heat dissipation performance of the SSD heat dissipation assembly is improved.

This invention belongs to the field of thermal conductive materials technology, specifically relating to a thermally conductive composite material, its preparation method, and its application. The thermally conductive composite material provided by this invention includes an organosilicon thermally conductive sheet and an alloy layer stacked sequentially. An alloy with a specific melting point is loaded into the thermally conductive sheet as the bottom layer. In actual use, the alloy layer, serving as the bottom layer, is in close contact with the heat-generating device. When the device heats up, causing the system temperature to rise and reach the alloy's melting point, the alloy melts from a solid to a liquid, rapidly filling the tiny gaps between the thermally conductive pad and the device. This effectively reduces interfacial thermal resistance, improves the heat flux density at the contact surface between the thermally conductive pad and the heat-generating device, and promotes rapid heat transfer. Simultaneously, it significantly improves the thermal conductivity, meeting the high-efficiency heat dissipation requirements of high-performance electronic equipment under extreme operating conditions, effectively ensuring the long-term stable operation of the equipment. This invention achieves a leap in the overall performance of thermally conductive pads, not only exhibiting excellent thermal conductivity but also high reliability and a wide range of applications.

The utility model discloses an NTC fixing support and temperature acquisition structure of a CCS, comprising a support base body, a profiling cavity used for placing a reinforcing FR4 plate is formed in a set area of the support base body, and the set area is provided with a plurality of first buckles and second buckles used for limiting the reinforcing FR4 plate; the support base body is provided with an open hole, the open hole is communicated with the profiling cavity, and the open hole is used for a heat conduction pad to pass through. The NTC fixing support is easy to install and reliable in fixation, the efficiency is high when the NTC fixing support is integrated with other components of a temperature acquisition structure, and integration of the temperature acquisition structure is facilitated.

The embodiment of the utility model provides a liquid cooling assembly, a liquid cooling system, a battery pack and a new energy automobile, and relates to the technical field of power batteries. The liquid cooling assembly comprises a liquid cooling plate, a first heat conduction pad, a first connector and a second connector, the two opposite sides of the liquid cooling plate are each provided with a flow channel part and an energy absorption part, the flow channel parts and the energy absorption parts are arranged at intervals, a first mounting groove is formed among the flow channel parts, the energy absorption parts and the side face of the liquid cooling plate, and the first heat conduction pad is arranged in the first mounting groove. The flow channel part is provided with a liquid cooling flow channel, the energy absorption part is provided with an energy absorption cavity and an exhaust hole, and the energy absorption cavity communicates with the exhaust hole; the first connector and the second connector penetrate through the liquid cooling plate and are located at the two ends of the flow channel part respectively, and the first connector and the second connector communicate with the liquid cooling flow channel. The problems of deformation and displacement of the liquid cooling plate caused by the expansion force of the battery cell can be solved, and the sealing performance and the heat conductivity of the liquid cooling plate are improved.