Product
Patsnap Eureka
For R&D, Patsnap Eureka makes reading and utilizing patents & technical documents easy.
Patsnap Eureka AIR
Designed for self-driven R&D workflows. Generate viable solutions, solve complex R&D challenges, empower your innovation with AI.
Patsnap Eureka Materials
Designed for material experts only. Revolutionize your material R&D, from search, analyze, to developing new materials.
Feature
TechResearch
Generate reliable direction feasibility study reports for your R&D in just a few steps.
TechSeek
Discover and master advanced knowledge NOW. Basics, ideas, possibilities, all at once.
TechMind
As an expert in R&D Theories, TechMind can generates customized viable solutions instantly.
TechRisk
Analyze your overall solution with one click, know your potential R&D risks in advance.
TechMonitor
Get weekly tech updates, stay abreast of the latest tech innovations and key insights.
Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
456 results about "Thermally conductive pad" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are a pre-formed square or rectangle of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact; they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and well able to fill gaps at higher temperatures.
DC-DC converter implemented in a land grid array package
InactiveUS6940724B2Improve heat dissipation characteristicsHigh densityEfficient power electronics conversionSemiconductor/solid-state device detailsMOSFETSemiconductor chip
A semiconductor chip package that includes a DC—DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC—DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC—DC converter provided on the substrate. The DC—DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC—DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area. Heat generated by the DC—DC converter is conducted out of the LGA package through the plurality of pads.
Owner:PWER BRIDGE
Heat-conducting pad, method for manufacturing heat-conducting pad, radiating device and electronic device
ActiveCN102917574AEasy to compressImprove cooling effectDigital data processing detailsSemiconductor/solid-state device detailsHeat conductingOrganic compound
The embodiment of the invention discloses a heat-conducting pad, a method for manufacturing the heat-conducting pad, a radiating device and an electronic device. The heat-conducting pad comprises a heat-conducting sheet base material, and a heat-conducting coating layer; the sheet base material has a compressible porous reticular structure in a thickness direction; the coating layer is formed by a flexible organic compound; the organic compound is filled inside the sheet base material or covered on the surface of the sheet base material, or the organic compound is covered on the surface of the sheet base material when being filled inside the sheet base material. According to the heat-conducting pad, the method for manufacturing the heat-conducting pad, the radiating device and the electronic device, by adopting the flexible heat-conducting organic compound, or the heat-conducting sheet base material with the compressible porous reticular structure filled or covered in the thickness direction, the formed heat-conducting pad has good heat-conducting property and also has a good compression performance. Thus, the heat transfer performance of the electronic device can be improved.
Owner:HUAWEI TECH CO LTD
Temperature controlled liquid dispenser, containers therefore, and bag-in-box container construction
InactiveUS20080277417A1Improve thermal conductivityThermal energy is effectively and efficiently transferredDomestic cooling apparatusLiquid flow controllersTemperature controlThermal energy
A dispenser for relative rapid cooling or heating of the contents of a liquid storage container provides a receptacle for receiving the liquid storage container therein and positioning a thermal transfer portion of the liquid storage container in thermal conductive relationship with a thermal conduction pad associated with the receptacle. Thermal energy is effectively and efficiently transferred from the thermal conduction pad to the liquid in the liquid storage container. The thermal conduction pad is controlled to provide and maintain the desired temperature to the liquid. The liquid is dispensed directly from the container. Various types of containers can be used in the dispenser, with a special bag-in-box container having a inner container and outer box with thermal conduction windows in the box to provide good heat transfer between the thermal conduction pads and the inner container constituting an aspect of the invention. A special rigid container can also be used.
Owner:GROESBECK R CLAY
Package of lightemitting diode with protective element
InactiveUS6861677B2Increase light intensityDissipate quicklySolid-state devicesSemiconductor devicesInsulation layerElectrical connection
A package structure of light-emitting diode with an electrostatic protective diode is disclosed. The structure has a light-emitting diode, an electrostatic protective diode, an electrical & heat conductive pad, and an electrical & heat conductive base substrate. The light-emitting diode is flipped and with its p-electrode and n-electrode, respectively, mounted on the n-electrode of the electrostatic protective diode and the electrical & heat conductive pad by conductive bumps. The latter two are separated themselves by a gap or an insulation layer and both of them are mounted on and electrically connected to the electrical & heat conductive base substrate. The structure is then through a bonding wire bonding to a bonding pad and the electrical & heat conductive base structure, respectively, connected to a positive and a negative terminal of a DC power to implement the electrical connection. The foregoing bonding pad is located on the exposed portion of n-electrode of the electrostatic protective diode.
Owner:EPISTAR CORP
Flexible circuit temperature sensor assembly for flanged mounted electronic devices
ActiveUS20070248142A1Thermometer detailsSemiconductor/solid-state device detailsThermal energyFlexible circuits
A temperature sensing system for a flange mounted device is provided. The temperature sensing system 100 can be comprised of a flexible wiring board 102. The temperature sensing system can be further comprised of a temperature sensing device 122 mounted to the flexible wiring board. The flexible wiring board can have one or more conductive traces 114a, 114b, 114c disposed thereon. The conductive traces can form an electrical connection with the temperature sensing device. The temperature sensing system can also comprise a thermal pad directly connected to the temperature sensing device. The thermal pad can be formed of a thermal conductor. The thermal pad can also have a thermal contact surface. The thermal contact surface can be sized and shaped for direct physical contact with a portion of the device 302, wherein thermal energy is communicated directly from the thermal pad to the temperature sensing device. A method for sensing a temperature of a flange mounted device is also provided.
Owner:HARRIS GLOBAL COMM INC
Carbon nanotube thermal pads
InactiveUS20070116957A1Layered productsSemiconductor/solid-state device detailsSurface layerHeat management
Thermal pads, including free-standing examples, are provided for dissipating heat from a heat source like a semiconductor die to a heat management aid such as a heat sink. The thermal pads include a sheet of vertically aligned carbon nanotubes and a surface layer. One such surface layer has a thickness of less than 500 microns. Another includes a metal layer having a thickness of less than 500 microns and an intermediate layer attaching the metal layer to the sheet of carbon nanotubes.
Owner:MOLECULAR NANOSYST +1
Housing for in-line video, keyboard and mouse remote management unit
InactiveUS6894906B2Circuit arrangements on support structuresRack/frame constructionManagement unitInteraction device
Methods and devices provide for remote management of a local computer utilizing a compact, portable interaction device for external connection to a local computer and a network. The interaction device includes a thermally conductive housing with circuit boards disposed within. At least one heat-generating component is disposed on an outer surface of each circuit board with at least one thermally conductive pad for each circuit boards abutting the at least one heat generating component and the inner surface of the housing. The device also includes ventilation means for allowing ambient air to flow through the interior of the housing.
Owner:AMZETTA TECH LLC
Apparatus for therapeutic cooling and warming of a body portion of a human or mammal
ActiveUS20130085552A1Relieve itchingReduce sweatingTherapeutic coolingTherapeutic heatingTime delaysTherapeutic Area
At least one thermoelectric assembly controlled by a microprocessor and disposed on a thermal conduction pad configured to conduct energy to and from the thermoelectric assembly and adjacent the treatment area positioned with removable electronics and a breathable liner. The hot intensity, cold intensity and time delay between sequences can also be selected as well as alternating temperature sequences with both vibration and tension monitoring to promote blood flow and speed up healing.
Owner:OASIS MEDICAL SOLUTIONS
Rear-loaded light emitting diode module for automotive rear combination lamps
A rear-loading LED module for a rear combination lamp is disclosed. One or more LEDs are mounted on a printed circuit board that mechanically holds them at the focus of a faceted, parabolic reflector. Light from the LEDs diverges transversely and horizontally, and is collimated by the reflector, and the reflected collimated light is directed in a generally longitudinal direction out of the rear combination lamp, toward the viewer. The LED module itself is generally longitudinally oriented, and is insertable longitudinally into the interior of the reflector from a hole at the vertex of the reflector. The printed circuit board, an optional thermal pad adjacent to the printed circuit board, and a thermally conductive layer adjacent to the optional thermal pad are all generally planar layers, are all generally parallel to each other, and may optionally all have the same footprint. Together, the printed circuit board, the thermal pad and the thermally conductive layer may all form a generally planar ledge.
Owner:OSRAM SYLVANIA INC
Discrete electronic component arrangement including anchoring, thermally conductive pad
ActiveUS7148554B2Reduce fatigueReduce expansionFinal product manufacturePrinted electric component incorporationElectricityElectrical conductor
An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.
Owner:DELPHI TECH IP LTD
Methods for forming carbon nanotube thermal pads
InactiveUS20070116626A1Protection from damageSemiconductor/solid-state device detailsSolid-state devicesHeat managementLead frame
Methods for forming thermal pads including arrays of vertically aligned carbon nanotubes are provided. The thermal pads are formed on various substrates, including foils, thin self-supporting polished metals, semiconductor dies, heat management aids, and lead frames. The arrays are growth from a catalyst layer disposed on the substrate. Forming the array can include leaving the ends of the nanotubes unfinished, attaching a foil thereto, or coating the ends with a metal layer. The metal layer coating can then be polished to a desired smoothness. The array can be filled with a matrix material, only partially filled, or left unfilled. Where the substrate is a foil, the method can be a continuous process where foil is taken from a roll and fed through a series of formation steps. Where the substrate is a lead frame, heating can be generated by applying an current to a pad of the lead frame.
Owner:MOLECULAR NANOSYST
Device and method for temperature management of heating pad systems
According to some embodiments, an apparatus for warming a patient on a thermal pad includes a heating element to heat a surface of the thermal pad. A power unit is operable to provide power to the heating element. Respective ones of a plurality of sensors are coupled to detect temperature at select portions of the surface of the thermal pad, while a heating element sensor is coupled to detect a temperature of the heating element. A temperature control circuit board is embedded within the thermal pad and is electrically coupled to the plurality of sensors and the heating element sensor. The temperature control circuit board is operable to limit a temperature at the surface of the thermal pad to a safe temperature based on the temperature detected by the plurality of sensors and the heating element sensor.
Owner:MEDLINE INDUSTRIES
Absorbent pad and thermal pack
InactiveUS6265631B1Eliminate the problemCost of manufactureNon-surgical orthopedic devicesBaby linensChemical mixturesEngineering
An apparatus and method is disclosed for an improved absorbent pad and thermal pack for absorbing a liquid discharged from a patient. The absorbent pad and thermal pad comprises an outer sheet made of a liquid impermeable material and an inner sheet of a liquid permeable material. An absorbent sheet is disposed between the inner sheet and the outer sheet. A flexible liquid impermeable container having a chemical mixture which undergoes an thermal reaction upon activation thereof is interposed between the outer and inner sheets to enable the thermal source to be applied to the patient and to enable any liquid from the patient to permeate through the inner sheet to be absorbed by the absorbent sheet. The inner sheet of a liquid permeable material provides a moderate insulation barrier whereas the absorbent pad provides a substantial insulation barrier for directing the thermal source to the patient.
Owner:COVIDIEN AG
Systems and methods providing thermal spreading for an LED module
A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.
Owner:EPISTAR CORP
Temperature controlled liquid dispenser, containers therefore, and bag-in-box container construction
ActiveUS8459503B2Improve thermal conductivityThermal energy is effectively and efficiently transferredDomestic cooling apparatusLighting and heating apparatusLiquid liquid partitionThermal energy
A dispenser for relative rapid cooling or heating of the contents of a liquid storage container provides a receptacle for receiving the liquid storage container therein and positioning a thermal transfer portion of the liquid storage container in thermal conductive relationship with a thermal conduction pad associated with the receptacle. Thermal energy is effectively and efficiently transferred from the thermal conduction pad to the liquid in the liquid storage container. The thermal conduction pad is controlled to provide and maintain the desired temperature to the liquid. The liquid is dispensed directly from the container. Various types of containers can be used in the dispenser, with a special bag-in-box container having a inner container and outer box with thermal conduction windows in the box to provide good heat transfer between the thermal conduction pads and the inner container constituting an aspect of the invention. A special rigid container can also be used.
Owner:GROESBECK R CLAY
Temperature controlled liquid dispenser, containers therefore, and bag-in-box container construction
InactiveUS7975879B2Improve thermal conductivityThermal energy is effectively and efficiently transferredDomestic cooling apparatusLiquid flow controllersTemperature controlThermal energy
Owner:GROESBECK R CLAY
Motor endshield assembly for an electronically commutated motor
InactiveUS6949849B1Improve thermal performanceDissipate power deviceAssociation with control/drive circuitsMagnetic circuit rotating partsThermal reliefEngineering
An endshield assembly for an electronically commutated motor includes an endshield, a control assembly, and a power assembly. The endshield includes a plurality of recessed fins on an outer surface, and a substantially flat raised portion on an internal surface. The raised portion is in contact with a thermal pad. The control assembly includes the thermal pad and a control board on which is located a plurality of power transistors. The thermal pad provides thermal contact between the transistors and the endshield to enable the endshield to dissipate heat from the transistors. The transistors include a plurality of leads that extend substantially parallel to the control board which enable the leads to be coated for protection against harsh external environments. The power assembly includes a power board having an insulator positioned between the power board and the control board.
Owner:GENERAL ELECTRIC CO
LED (Light Emitting Diode) fluorescent lamp
InactiveCN101576208AImprove cooling effectAvoid Electric Shock AccidentsPoint-like light sourceElectric circuit arrangementsBiochemical engineeringHeat conducting
The invention discloses an LED fluorescent lamp which comprises a body, a heat-conducting pad, an insulating pad, a lampshade, a plurality of LEDs and a substrate used for fixing the LEDs. One side of the body is provided with a radiator while the opposite side is provided with a first groove, two opposite upper groove rims of the first groove of the body are respectively provided with expansion parts, an opening edge of the lampshade is provided with clamping parts respectively clamped with the expansion parts of the two rims, the insulating pad is placed in the first groove of the body, the insulating pad is provided with a second groove, and the heat-conducting pad and the substrate are orderly fixed in the second groove of the insulating pad. Heat energy emitted from the LEDs is rapidly conducted to the body by orderly arranging the heat-conducting pad and the insulating pad under the substrate, thus greatly improving the radiation effect.
Owner:SHENZHEN MASON TECH
Discrete electronic component arrangement including anchoring, thermally conductive pad
ActiveUS20060131732A1Reduce fatigueReduce expansionFinal product manufacturePrinted electric component incorporationElectrical conductorEngineering
An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.
Owner:DELPHI TECH IP LTD
Temperature Controlled Liquid Dispenser, Containers Therefore, and Bag-In-Box Container Construction
ActiveUS20110266287A1Improve thermal conductivityThermal energy is effectively and efficiently transferredDomestic cooling apparatusLighting and heating apparatusThermal energyTemperature control
A dispenser for relative rapid cooling or heating of the contents of a liquid storage container provides a receptacle for receiving the liquid storage container therein and positioning a thermal transfer portion of the liquid storage container in thermal conductive relationship with a thermal conduction pad associated with the receptacle. Thermal energy is effectively and efficiently transferred from the thermal conduction pad to the liquid in the liquid storage container. The thermal conduction pad is controlled to provide and maintain the desired temperature to the liquid. The liquid is dispensed directly from the container. Various types of containers can be used in the dispenser, with a special bag-in-box container having a inner container and outer box with thermal conduction windows in the box to provide good heat transfer between the thermal conduction pads and the inner container constituting an aspect of the invention. A special rigid container can also be used.
Owner:GROESBECK R CLAY
Cooling device for pluggable module, assembly of the cooling device and the pluggable module
InactiveUS8879262B2Improve cooling effectDigital data processing detailsIndirect heat exchangersEngineeringThermal contact
Provides a cooling device (100) for cooling at least one pluggable module (200) each having a pluggable component (20) and a frame (32) for accommodating the pluggable component, the frame having an opening (33) on a top wall thereof. The cooling device comprises at least one thermal conductive block (40), a heat radiator (70) and a resilient thermal conductive pad (60). The resilient thermal conductive pad being adapted to be in a substantially released position when the pluggable component is decoupled from the frame and substantially biased when the pluggable component is inserted into the frame thus exerting a biasing force on the thermal conductive block and the heat radiator whereby the thermal conductive block is pressed through the opening of the frame into direct thermal contact with the pluggable element of the pluggable module for conducting the heat generated by the pluggable component to the heat radiator through the thermal conductive block and the resilient thermal conductive pad. The main advantage of the cooling device is that the pluggable module has a reinforced and compact cooling structure that improves the heat dissipation efficiency.
Owner:TELEFON AB LM ERICSSON (PUBL)
Devices incorporating carbon nanotube thermal pads
InactiveUS20060255450A1Semiconductor/solid-state device detailsSolid-state devicesSurface layerCarbon nanotube
Devices and methods for their manufacture are provided. The devices, such as packaged semiconductors, include thermal pads of vertically aligned carbon nanotubes to transport heat from a heat source such as a semiconductor die, to or between thermal management aids such as a heat spreader or heat sink. Some devices include spacers between the heat spreader and the heat sink to protect the thermal pad during assembly. Other devices include thermal pads that have surface layers matched by composition to the surfaces of the opposing surfaces, thus silicon on one side and a metal on the other. In some devices, the ends of the carbon nanotubes extend into the surface of the thermal management aid. Methods for bonding the thermal pads include bonding surface layers, as well as exposed carbon nanotubes, to opposing surfaces.
Owner:MOLECULAR NANOSYST
Semiconductor device
ActiveUS20080179737A1Accurate operationEffective coolingSemiconductor/solid-state device detailsSolid-state devicesResistEngineering
A semiconductor device according to the present invention includes an island provided on one surface of a resin substrate, an external terminal provided on the other surface of the substrate, a thermal pad provided on the other surface of the substrate in opposed relation to the island, a heat conduction portion extending through the substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner, and a solder resist portion provided on the other surface of the substrate and having a heat dissipation opening which defines a gap with respect to an outer periphery of the thermal pad and a terminal opening which exposes the external terminal.
Owner:ROHM CO LTD
Stackable semiconductor chip with edge features and methods of fabricating and processing same
InactiveUS20120133381A1Semiconductor/solid-state device testing/measurementSemiconductor/solid-state device detailsMetrologySemiconductor chip
A method of performing a function on a three-dimensional semiconductor chip package as well as on individual chips in the package is disclosed. That method involves the creation of an operative relationship between a function performer and an edge feature on the chip or chips wherein the edge feature consists of one or more of an electrically conductive pad, thermally conductive pad, a probe pad, a fuse, a resistor, a capacitor, an inductor, an optical emitter, an optical receiver, a test pad, a bond pad, a contact pin, a heat dissipator, an alignment marker, a metrology feature and a function performer may be any one or more of a test probe, the laser, a programming device, an interrogation device, a loading device or a tuning device. In addition, a chip per se with edge features is disclosed along with a three-dimensional stack of such chips in either of several different configurations. The disclosure provides information regarding the formation of edge feature, the singulation of dice having incipient edge features, the stacking of dice and the handling or dice with edge features.
Owner:ELECTRO SCI IND INC
Method and apparatus for heat dispersion from the bottom side of integrated circuit packages on printed circuit boards
The present invention relates to a method and apparatus of heat dispersion from the bottom side of an integrated circuit package mounted on a printed circuit board ("PCB"). In operation, a heat slug is thermally coupled to the underside of an integrated circuit ("IC") package. In one embodiment, the heat slug comprises a disc made of copper or other thermally conductive material in between two layers of elastomeric, conductive material such as silicone imbedded with aluminum particles. The thermal pad extends through each layer of the PCB, including the ground layer. In this way, the ground layer of the PCB is utilized for heat dispersion.
Owner:RADISYS CORP
Flexible circuit temperature sensor assembly for flanged mounted electronic devices
ActiveUS7416332B2Thermometer detailsSemiconductor/solid-state device detailsThermal energyFlexible circuits
A temperature sensing system for a flange mounted device is provided. The temperature sensing system (100) can be comprised of a flexible wiring board (102). The temperature sensing system can be further comprised of a temperature sensing device (122) mounted to the flexible wiring board. The flexible wiring board can have one or more conductive traces (114a, 114b, 114c) disposed thereon. The conductive traces can form an electrical connection with the temperature sensing device. The temperature sensing system can also comprise a thermal pad directly connected to the temperature sensing device. The thermal pad can be formed of a thermal conductor. The thermal pad can also have a thermal contact surface. The thermal contact surface can be sized and shaped for direct physical contact with a portion of the device (302), wherein thermal energy is communicated directly from the thermal pad to the temperature sensing device. A method for sensing a temperature of a flange mounted device is also provided.
Owner:HARRIS GLOBAL COMM INC
LED Heat Sink Assembly
An LED light source is provided that is comprised of a heat sink assembly and at least one LED, where the heat sink assembly includes a hollow heat sink (e.g., a cylindrical heat sink) and an LED thermal pad that mechanically closes an opening in the heat sink via direct mechanical and thermal contact. The thermal pad or pads of the LED are in direct mechanical and thermal contact with an upper surface of the LED thermal pad.
Owner:SONI VIMAL J
Three-pack power battery cooling and heating system of new energy automobile
ActiveCN107768774AImprove performanceEnsure safetySecondary cellsCell component detailsExpansion tankNacelle
The invention discloses a three-pack power battery cooling and heating system of a new energy automobile. A first battery pack and a second battery pack are arranged at the lower part of a chassis ofa vehicle body and are located at the lowest positions of the vehicle. A third battery pack is arranged in a trunk of the vehicle and is located at the highest position of the vehicle. A water coolingstructure in the third battery pack is provided with a normally closed exhaust valve at the highest position of the vehicle. A scale line at the lowest liquid position of an expansion water tank is lower than the normally closed exhaust valve. The water cooling structure composed of water cooling plates connected in parallel is arranged in each one of the battery packs. The water cooling structures connected in parallel in each battery pack are connected to a high-pressure water heater, a plate heat exchanger, the expansion water tank and an electronic water pump in a front cabin to form a loop. A damping hole is arranged in a joint of the water cooling plate. A thermal conductive pad and a thermal insulation pad are respectively arranged above and below the water cooling plate. A proportional control water valve is arranged at a main inlet of the third battery pack. According to the cell temperature difference control water valve opening degree, uniform temperatures between cells arerealized, the driving range of the whole vehicle is increased and the exhaust problem of the system is solved.
Owner:CHINA FIRST AUTOMOBILE
Light emitting device package and manufacturing method thereof
InactiveUS20120236568A1Effective coolingImprove efficiencyPrinted circuit assemblingLighting heating/cooling arrangementsEngineeringLight-emitting diode
A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes a circuit board comprising at least one device region, a plurality of electrode regions, at least one first thermal via exposed through upper and lower surfaces of the at least one device region, and a plurality of second thermal vias exposed through upper and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the first thermal via; at least one LED mounted on the at least one first thermal pad; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the second thermal vias; and a plurality of wires to connect the at least one LED with the plurality of first electrode pads.
Owner:SAMSUNG ELECTRONICS CO LTD
Temperature adjustment device and method of focusing ring
ActiveCN106920725AOptimal treatment processRealize the function of grounding conductionParticle separator tubesSemiconductor/solid-state device manufacturingWorking temperatureEngineering
Owner:ADVANCED MICRO FAB EQUIP INC CHINA
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com