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246results about How to "Cost of manufacture" patented technology

Polyceramic e-chuck

The present invention discloses an electrostatic chuck for clamping work substrates, said chuck comprising three layers, where the dielectric constant of included non-conductive layers is selected to provide overall lower capacitance to the chuck. In the chuck assembly of the present invention, the top dielectric layer that is in contact with a substrate, such as, for example, a wafer, has a dielectric constant that is preferably greater than about 5, with a resistivity that is preferably greater than about 1E6 ohm.m, whereas the bottom dielectric layer has a dielectric constant that is preferably less than about 5 and a resistivity that is preferably greater than about 1E10 ohm.m. The intermediate layer preferably has a conductive layer where the resistivity is less than about 1 ohm.m. The electrostatic chuck may be bonded to heat sinks coated with anti-arc dielectrics. The heat sink can also be used as an RF electrode. The heat sink may have provisions for coolants and gas channels to feed a cooling gas to the backside of a wafer. The heat sink may have feed thrus to power the segmented electrodes in the electrostatic chuck. The passages for the feed thrus, gas feed holes and lift pins may be lined with ceramics or polymers to prevent any discharge to the heat sink. The electrostatic chuck is for clamping work substrates like Si, GaAs, SiO2, etc. used in semiconductor tools.
Owner:FM INDS

INTEGRATED PROPULSION & STEERING For Battery Electric Vehicles (BEV), Hybrid Electric Vehicles (HEV), Fuel Cell Electric Vehicles (FCEV), AV (Autonomous Vehicles); Electric Trucks, Buses and Semi-Trailers

A vehicle, integrated all-wheel propulsion and steering system with plurality of propulsion and steering power sources, designed with enumerate specifications are coupled to, and de-coupled from a final drive of the vehicle propulsion system. A controller receives input-signals from the driver steering-wheel sensor; computes a set of reactions to the plurality of steering-actuators, wherein feedback-mechanism with each wheel-position sensor, the controller secures each wheel in its computed angle. In different speed and load conditions, the controller is programmed to compute a desired power demand then couple to the final drive[s] the propulsion power source[s] that is designed to do-the-job with the least energy consumption. When the vehicle changes speed and load, the controller couples a different power source[s], and de-couples the previous power source[s] to meet the power demand. In turning-modes, whilst positioning every wheel in its computed position, the controller computes the different distances the left and the right wheels of the vehicle have to travel, wherein the controller moves-up the propulsion power sources velocity to the wheels opposite to the turn to make a perfect turn without EPS assistance.
Owner:BEN ARI JACOB

Dual mode capacitive touch panel

A dual mode capacitive touch panel includes a sensor substrate, an electrode layer comprising an array of sensor electrodes arranged over the sensor substrate, the array of sensor electrodes including a plurality of drive electrodes and a plurality of sense electrodes, each sensor electrode corresponding to a location on the sensor substrate, and a shield layer arranged over and spaced apart from the electrode layer. The shield layer includes a predetermined resistance that permits transmission of an electric field at a first frequency and prevents transmission of an electric field at a second frequency, wherein a spacing between the shield layer and the electrode layer is deformable as a result of a force applied to the shield layer due to a user touch, wherein the deformation alters a capacitance between the shield layer and a sensor electrode of the array. A controller is operatively coupled to the array of sensor electrodes, the controller configured to drive the shield layer and at least some sensor electrodes of the sensor electrode array at the first frequency in a first mode to measure a location of an object relative to the sensor substrate, and drive the shield and the at least some sensor electrodes at a second frequency in a second mode different from the first mode to measure a force applied toward the sensor substrate.
Owner:SHARP KK

Advanced wafer planarizing

An apparatus for planarizing is disclosed. A method of planarizing is disclosed. Methods of planarizing using frictional planarizing, chemical planarizing, tribochemical planarizing, CVD planarizing, and electrochemical planarizing and combinations thereof are disclosed. A planarizing chamber can be used. New methods of control are planarizing disclosed. The new planarizing methods and apparatus, can help improve yield and lower the cost of manufacture for planarizing of workpieces having extremely close tolerances such as semiconductor wafers. Cost of manufacture parameters are used for control. Methods to determine preferred changes to process control parameters are disclosed. Cost of manufacture models can be used and are disclosed. Process models can be used and are disclosed. A method to use business calculations combined with physical measurements to improve control is discussed. Use of business calculations to change the cost of finishing semiconductor wafers is discussed. The method can help cost of manufacture forecasting for pre-ramp-up, ramp-up, and commercial manufacture. Activity based accounting can be preferred for some applications. Planarizing fluids are preferred. Reactive planarizing aids are preferred. Electro-planarizing for adding and removing material is disclosed. New methods and new apparatus for non-steady state planarizing control are disclosed.
Owner:SEMCON TECH
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