39results about How to "The electrical connection is firm and reliable" patented technology

The present invention relates to an electronic cigarette case, includes a case body, a charging device disposed in the case body for charging electronic cigarettes. The charging device includes a charging base, a rechargeable battery, and a control circuit board integrated with a circuit processing unit. The charging base has an electrode support where first and second electrode elements, and a trigger element spaced apart from the second electrode element are all disposed on the electrode support. The second electrode element is flexibly deformable when one of the electronic cigarettes is inserted into the case body to create a charging circuit. The circuit processing unit automatically controls the rechargeable battery for charging the electronic cigarette being inserted until it is full of power, whereby the electronic cigarette case is readily to be assembled and to sue, and has a reliable electrical connection with an outer power source.

An electronic cigarette comprises a main body. A smoking end, an atomization assembly for atomizing tobacco oil, and a battery assembly for powering the atomization assembly are arranged on the main body. A bottle for storing the tobacco oil is arranged at one end of the main body, away from the smoking end. The atomization assembly is arranged between the smoking end and the bottle. The bottle and the battery assembly are in parallel. An electrical connection component is arranged between the battery assembly and the atomization assembly. One end of the electrical connection component is connected to the battery assembly while the other end of the electrical connection component is resiliently abutted against a side wall of the atomization assembly. Easy assembly, stable and reliable electrical connection, and a great reduction to the possibility that the user sucks the tobacco oil are realized in the electronic cigarette.

An electrical connector (1) is provided for connecting a flexible printed circuit or a flexible flat cable. The connector comprises a housing (10), a number of electrical contacts (30) received in the housing and an actuator (40). The housing has a pair of concave portions (117) formed on opposite lateral ends thereof and opening upwardly to exterior. Each electrical contact comprises a support arm (35) defining a pivot portion (351) at an end thereof. The actuator has a pair of turning shafts (42) received in the corresponding concave portions and a plurality of turning pintles (411) therein for engaging with the pivot portions of the electrical contacts.

A receptacle contact for receipt of a mating contact and a method therefore. The receptacle contact has side walls, each of the side walls has an opening provide therein. A resilient contact arm extends between the side walls. Projections extend from the resilient contact arm and extend through the openings of the side walls. A weak area is provided on the resilient contact arm, the weak area positioned between the fixed end and the projections. The projections engage a wall of the opening as the mating contact is inserted into the receptacle contact, causing the at least one contact area to become fixed and allowing the weak area to move into engagement with the mating contact, thereby providing multiple areas of contact between the resilient contact arm and the mating contact.

Disclosed is an angular velocity sensor, which comprises a receiving member receiving therein a case containing a vibration element and an IC, and having a hole usable in soldering one end of a terminal strip to a case electrode, whereby, after the soldering operation, the condition of a soldered region in a mounting portion can be checked through the hole. This prevents deficiency in solder amount required for soldering between the case and the receiving member to ensure accuracy in an output signal of the angular velocity sensor.

An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.

The invention discloses a CMOS driver wafer level package and a manufacturing method thereof, and relates to the technical field of apparatuses or systems manufactured or processed in a substrate or on the substrate. The package comprises a driver wafer, a driver wafer pad is formed on parts of the area of the upper surface of the wafer, a passivation layer is formed on the upper surface of the wafer outside the pad area, and a first resin layer is formed on the upper surface of the passivation layer; a re-wiring layer is formed on parts of the upper surface of the first resin layer; a second resin layer is formed on the upper surface of the re-wiring layer and the upper surface of the first resin layer uncovered with the re-wiring layer; a direct under bump metal layer is formed on parts of the upper surface of the second resin layer; and metal bumps are formed on the surface of the direct under bump metal layer. The method disclosed in the invention is compatible with traditional semiconductor technologies, is suitable for batch production, effectively reduces the dimensions of driver chip packages, reduces the parasitic effect and improves the performances of the driver chip.

The invention discloses a chip packaging structure and a chip packaging method. The chip packaging structure comprises a substrate, a component region and a bonding pad arranged on the first side of the substrate. The bonding pad is located on the outside of the component region and is electrically connected with the component in the component region. An insulating layer covering a second surfaceof the substrate and a side wall, wherein a first via hole is formed on the insulating layer to expose a part of the back surface of the solder pad; a rewiring layer located on the insulating layer and extending from the second side along the sidewall into the first via of the insulating layer and extending outwardly to the side of the solder pad to electrically connect with a back surface of a portion of the solder pad exposed by the first via and a side surface of the solder pad; a solder bump is formed on the second surface of the substrate and is electrically connected to the rewiring layer. By adopting the technical proposal, the contact area between the rewiring layer and the bonding pad can be increased, the connection reliability between the rewiring layer and the bonding pad can be improved, and the good packaging effect of the chip packaging structure can be ensured.

A rotatable plug includes a casing unit having a first casing part and a second casing part with a pair of receiving spaces, a pair of conductive terminals respectively having conductive sections, and a rotatable unit including a pivot shaft, a pair of conductive prongs connected transversely to the pivot shaft, and a pair of conductive protrusions protruding out from the pivot shaft. The rotatable unit is rotatable relative to the casing unit between non-use and use positions, where the conductive prongs are accommodated in and extend out of the receiving spaces, respectively. Each conductive protrusion has at least two points of contact with the conductive section of a respective conductive terminal.

The invention discloses an automatic batch test device for chip capacitors and a use method, the device comprises a console, the middle part of the console surface is longitudinally provided with a slide rail I, a slide rail II is transversely arranged above the slide rail I, the slide rail I is in sliding connection with a tray for placing a capacitor test board, and the slide rail II is in sliding connection with a slide block. A third sliding rail is arranged on the outer side of the sliding block and slidably connected with a testing end, the testing end is connected with a testing instrument through a wire, and the testing instrument is electrically connected with a computer. The tray, the sliding block and the test end are respectively driven by a motor to move longitudinally, transversely and vertically, and the motor is connected with a computer. During use, a stacking declaration is set through a computer, an arch-shaped triggering position is formulated, a test contact is operated to reach a stacking starting point and sends an in-place signal, test is started, and the test is completed by running a stacking point according to stacking setting. According to the invention, the detection efficiency of the small-size chip capacitor is improved, and automatic and batch testing of the chip capacitor is realized.

The embodiment of the invention provides a wiring terminal which comprises a clamping part, a tightening part and a wire, wherein the clamping part is provided with a first clamping piece and a second clamping piece. A first end of the tightening part is electrically connected with each of the first clamping piece and the second clamping piece, one part of the wire is wrapped by the tightening part, the other part of the wire extends out of the second end of the tightening part, and the wire is electrically connected with the tightening part. The clamping part is used for clamping the bipolar plate, the tightening part is used for tightening the wire to tightly wrap the part of the wire in the tightening part, the electric connection relation between the wire and the clamping part in the wiring terminal is simple and reliable, and problems that due to the welding connection mode, the wire is often loosened, and connection is not firm are solved; structural stability of the wiring terminal is improved, and conductivity of the wiring terminal is ensured.