The present invention discloses an
ultraviolet LED device, which comprises a
ceramic base, a groove arranged on the
ceramic base, a table-shaped stepped structure arranged on the
ceramic base and positioned on the groove, a
quartz glass cover plate arranged at the table-shaped stepped structure, and an
ultraviolet LED
chip welded to the bottom surface of the groove in the eutectic flip-
chip manner. At least two
metal layers, good in heat
conductivity and electrical
conductivity, are arranged between the positive and negative electrodes of the
ultraviolet LED
chip and the bottom surface of the groove. In this way, the eutectic flip
welding of the ultraviolet LED chip is realized. According to the invention, through the
metal layers good in heat
conductivity and electrical conductivity, the ultraviolet LED chip is welded inside the ultraviolet LED device in the eutectic flip-chip manner. Therefore, the application of the traditional
solid crystal organic glue is avoided. Meanwhile, on the premise that the
electrical connection of the ultraviolet LED chip is ensured, the heat is conducted to the ceramic base. The heat conductivity of the device is improved, so that the stability and the service life of the device are increased. As a result, according to the technical scheme of the invention, the heat dissipation performance of the ultraviolet LED device is improved.