The application provides a
ceramic substrate structure and an integrated packaging structure thereof, and belongs to the technical field of packaging. The
ceramic substrate structure comprises a substrate plate body, a large
chip and a small
chip. The upper surface of the substrate plate body is provided with a first groove and a plurality of pads, and the lower surface is provided with a second groove. The first groove is communicated with the groove bottom surface of the second groove. A plurality of
metal wires are arranged in the second groove. The
metal wires are electrically connected with the pads through a via technology. The large
chip is fixedly connected to the top surface of the substrate plate body, and the small chip is fixedly connected in the second groove. The large chip, the small chip and the
metal wires are electrically connected through
wire bonding. Through the double-sided groove structure and the multi-level
electrical connection scheme, the double-sided packaging of the chip is realized, the
signal transmission path is effectively shortened, the packaging size is reduced, the heat dissipation efficiency and the
electrical performance are significantly improved, and the application is particularly suitable for high-performance chip packaging applications such as back incidence detectors and other double-sided
electrical connection applications.