412results about How to "Ensure electrical connection" patented technology

An electrically powered tool having a dust collection unit powered by a motor, which unit can be releasably fitted to the tool includes a plug arrangement and a cooperating socket arrangement, one of which is formed on the tool and the other of which is formed on the unit. A first mechanical fixing arrangement is provided comprising a first projection and a first cooperating recess, one of which is formed on the tool and the other of which is formed on the unit. A second mechanical fixing arrangement is provided and comprises a manually actuable releasable latch arrangement and a second cooperating recess, one of which is formed on the tool and the other of which is formed on the unit. The first and second mechanical fixing arrangements cooperate to secure the dust collection unit to the tool in such a way that the plug and socket arrangements form an electrical connection.

The present invention relates to a connecting adapter 500 for connecting an earphone 600 with a body part 200 of a writs type of music player. In a casing 501, an earphone jack 504, and a circuit board 505 having a continuity with the earphone jack 504 are provided. A connection terminal 506 having a continuity with an earphone connector 205 of the body art 200 is provided so as to penetrate the inside and the outside of the casing 501 and have a continuity with the circuit board 505. On the outer surface of the casing 501, a fixed hook 507 for engaging with a concavity 200a of the body part 200 and a movable hook 508 for engaging with a concavity 200b of the body part 200, which is incorporated so as to be rotatable and to be biased toward the body part 200, are provided.

A microactuator element is disposed on a gimbal portion of a flexure. A first end of the element is secured to a first supporting portion by a first insulating adhesive. A second end is secured to a second supporting portion by a second insulating adhesive. A first conductor is disposed on the first supporting portion. A second conductor on the ground side is disposed on the second supporting portion. A first electrode is disposed on a first end of the element. A first electrically conductive paste is provided between the first electrode and the first conductor. A second electrode is disposed on a second end of the element. A second electrically conductive paste is provided between the second electrode and the second conductor.

[Problem] To be able to reliably fix a solar battery module in an appropriate position on a roof, to have light weight and few components, and to be able to reliably prevent slipping and perform grounding during temporary placement when the fixing position of the solar battery module is adjusted. [Solution] The present invention comprises: a base metal fitting fixed to a rooftop surface; a height-adjusting metal fitting capable of sliding in a vertical direction relative to the base metal fitting; a position-adjusting metal fitting capable of sliding in a horizontal direction relative to the height-adjusting metal fitting; and a fixing metal fitting for sandwiching and fixing the solar battery module between the fixing metal fitting and the position-adjusting metal fitting from the top and bottom, the fixing metal fitting being attached relative to the position-adjusting metal fitting. The position-adjusting metal fitting has: a mounting board part for mounting the solar battery module; a stopper capable of making contact with the edge of a frame provided to the periphery of the solar battery module when the solar battery module is mounted on the mounting board part; and a protrusion for making contact with a conductor part of the frame when the solar battery module is fixed to ensure electrical conductance.

The invention disclosure relates to a manufacturing method comprising the formation of elemental LED or photovoltaic structures on a first substrate, each comprising at least one p-type layer, an active zone and an n-type layer, formation of a first planar metal layer on the elemental structures, provision of a transfer substrate comprising a second planar metal layer, assembly of the elemental structures with the transfer substrate by bonding of the first and second metal layers by molecular adhesion at room temperature, and removal of the first substrate.

A conductor pin placed between one member and another member and contacting the both members to electrically connect the members to each other. The conductor pin includes a tubular outer pin portion formed by folding a conductive plate material for the outer pin portion, a tubular inner pin portion formed by folding a conductive plate material for the inner pin portion and inserted in the outer pin portion slidably in the axial direction of the outer pin portion, and a conductive spring disposed in the outer pin portion and inserted in the inner pin portion to urge the inner pin portion in a direction in which the inner pin portion projects from the outer pin portion.

The present invention discloses an ultraviolet LED device, which comprises a ceramic base, a groove arranged on the ceramic base, a table-shaped stepped structure arranged on the ceramic base and positioned on the groove, a quartz glass cover plate arranged at the table-shaped stepped structure, and an ultraviolet LED chip welded to the bottom surface of the groove in the eutectic flip-chip manner. At least two metal layers, good in heat conductivity and electrical conductivity, are arranged between the positive and negative electrodes of the ultraviolet LED chip and the bottom surface of the groove. In this way, the eutectic flip welding of the ultraviolet LED chip is realized. According to the invention, through the metal layers good in heat conductivity and electrical conductivity, the ultraviolet LED chip is welded inside the ultraviolet LED device in the eutectic flip-chip manner. Therefore, the application of the traditional solid crystal organic glue is avoided. Meanwhile, on the premise that the electrical connection of the ultraviolet LED chip is ensured, the heat is conducted to the ceramic base. The heat conductivity of the device is improved, so that the stability and the service life of the device are increased. As a result, according to the technical scheme of the invention, the heat dissipation performance of the ultraviolet LED device is improved.

The invention provides a connector. Reinforced metal fittings of the connector can be reliably connected to reinforced metal fittings of another connector, electrical connections between the reinforced metal fittings are maintained, and the connector can be connected to another connector end to end. A connector body includes butt-joint guide portions and reinforced metal fittings. The butt-joint guide portions are formed on two vertical ends of the connector body so that the connector body is butt joint with a connector body of another connector. Each reinforced metal fitting includes a body portion, a side plate portion, and a contact arm portion, wherein the body portion extends transversely along the connector body, the side plate portion is connected to the body portion and extends vertically along the connector body, and the contact arm portion is connected to the side plate portion. The reinforced metal fittings are arranged to the left and to the right of the butt-joint guide portions. Each contact arm portion includes a first contact part and a second contact port that face each other. When the connector body is butt joint with the connector body of another connector, the reinforced metal fittings arranged on another connector body are inserted between the first and second contact parts, and the reinforced metal fittings are maintained by the first and second contact parts on two sides and contact the first and second contact parts.

The invention discloses an embedded type touch screen and a display device. An insulating layer is provided with at least a first via through the insulating layer in each area where respective capacity electrodes and wires are overlapped, the respective capacity electrodes are electrically connected with corresponding wires through the corresponding first vias, positions, corresponding to the first vias, of the respective capacity electrodes are provided with second vias in areas where the respective capacity electrodes and wires except the corresponding wires are overlapped, the second vias are through the respective capacity electrodes, and an orthographic projection of the second vias on a lower substrate covers an orthographic projection of the first vias on the lower substrate. According to the embedded type touch screen, on the basis that the first vias in the insulating layer are evenly distributed, correction connection of the respective capacity electrodes and the wires is guaranteed, so that the problem of uneven display images caused by uneven distribution of the vias in the insulating layer in the prior art is solved.

A method and device for transferring a chip ( 18 ) situated on a transfer substrate ( 26 ) to a contact substrate ( 50 ), and for contacting the chip with the contact substrate, in which the chip, the back side ( 19 ) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts ( 59, 60 ) thereof that are arranged opposite a contact surface ( 58 ) of the contact substrate are brought into contact with substrate contacts ( 56, 57 ) arranged on the contact surface by means of a pressing device ( 45, 46 ) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.

An embodiment of the application discloses a three-dimensional memory and a manufacturing method thereof, and the manufacturing method comprises the following steps of firstly forming a first sacrificial layer between a substrate and a stacked structure, removing the first sacrificial layer after forming a channel structure and a gate line gap structure in the stacked structure, and filling the epitaxial structure such that the epitaxial structure forms a region where the first sacrificial layer is located, that is, no longer forming the epitaxial structure at the bottom of the channel hole, while forming the epitaxial structure at the surface of the substrate and a portion of the sidewall region of the first conductive layer in the channel structure facing the storage layer side, so as toreduce the technical difficulty of the epitaxial structure and improve the consistency of the epitaxial structure on the basis of ensuring that the epitaxial structure is electrically connected to the first conductive layer in the channel structure.

A plurality of N-type first impurity layers (111) are provided that form stripes in a main surface (110S) of a P-type semiconductor substrate (110). At least one N-type second impurity layer (112) overlaps (or touches) one of the first impurity layers (111). A plurality of gate electrodes are provided on a gate insulating film (121). A plurality of gate electrodes form stripes crossing the first impurity layers (111). A plurality of low-resistance wires (140) are provided on an interlayer insulating film (122). The plurality of low-resistance wires (140) form stripes extending in the same direction as that of the first impurity layers (111). An end (123T2) of each contact plug (123) is entirely in contact with the second impurity layer 112, and does not touch a P-type region of the semiconductor substrate (110).

An openable wire-mounting connector includes a body. A bottom of the body forms a welding face. A front of the body forms a wire entrance. Two sides of a rear of the body bend oppositely to form elastic clips which allow an insertion of a conducting wire and hold the wire in place. A top edge of each elastic clip forms a funnel-shaped mouth which opens upwards. A top end of the rear of the base bends firstly to form a curved limiting part and then bends upwards to form an elastic button. The curved limiting part presses down on the conducting wire to prevent the wire from escaping. The elastic button is located above the funnel-shaped mouth. The elastic clips can be opened by pressing the elastic button which activates the funnel-shaped mouth.

A spiral contactor is provided on a substrate. An electronic function part and the substrate are adhered with an anisotropic conductive paste while an electrode portion of the electronic function part is being contacted with the spiral contactor. Thus, the electronic function part and the substrate can be securely fixed together while an adequate electrical connection between the electrode portion of the electronic function part and the spiral contactor is ensured.

An electrical connector and a terminal thereof are disclosed. The base portion of the terminal extends upwards to form two flexible arms. Each of the two flexible arms extends towards each other to form a leaning portion. There is a gap between the two leaning portions. Two arm portions extend from two sides of the base portions. The two arm portions respectively have a contact portion. The two contact portions and the two leaning portions are disposed at a front location and a rear location. The two leaning portions and the two contact portions surround to form a receiving space. The present invention can prevent the pins of the chip module from being deformed, improve the usage life of the terminals, and assure that the chip module is electrically connected with the electrical connector.

The invention discloses a liquid-cooled cable connecting assembly and a connector. The liquid-cooled cable connecting assembly comprises liquid-cooled cable connectors. Each liquid-cooled cable connector comprises a cable tail terminal, a pin terminal and a cable, wherein the cable tail terminal is provided with a first accommodating cavity with one end opened and a first liquid flowing channel communicated with the first accommodating cavity; the pin terminal is provided with a second accommodating cavity with one end opened and a second liquid flowing channel communicated with the second accommodating cavity; the cable comprises an insulating pipe and a conductor located inside the insulating pipe, two ends of the insulating pipe are respectively in sealed connection with the opened endsof the first accommodating cavity and the second accommodating cavity, two ends of the conductor extend to be inserted in the first accommodating cavity and the second accommodating cavity and are contacted with the cable tail terminal and the pin terminal respectively, and liquid flowing gaps are formed among the conductor and the first accommodating cavity, the second accommodating cavity and the inner wall of the insulating pipe. The liquid-cooled cable connecting assembly is simple in structure and convenient in operation, conduction of a coolant can be realized while electric connectionis ensured, and temperature rise of a contact piece at a heat source place can thus be controlled.