370results about How to "Dissipate heat generated" patented technology

PV modules are provided that have a frame construction which permits the photovoltaic power-generating cells, DC / AC power conversion means, electrical wiring and other installation aspects to be merged into the module. The modules also are provided with means for coupling them to mounting stands whereby they can be mounted to a roof and also the frame construction is adapted to facilitate mechanically securing adjacent modules to one another.

A light emitting apparatus includes a substrate, at least one light emitting device and a protective layer. The substrate has a surface formed with a structure for increasing light emitting efficiency. The light emitting device is disposed on a predetermined position of the substrate. The light emitting device emits lights and the lights are reflected and concentrated to project out by the structure of the substrate. Thus, the light emitting efficiency is improved.

An LED lamp for lighting purpose includes a lamp base, a heat sink, a plurality of LED modules and a blower. The lamp base encloses an inner space and defines a plurality of vents therein. The vents communicate the inner space with a surrounding atmosphere. The heat sink comprises a cylinder at a centre thereof. The cylinder has a through hole therein, which communicates with the inner space and vents of the lamp base and cooperates therewith to form an air passage. The LED modules are attached to a periphery of the heat sink. The blower generates an airflow circulating through the air passage to thereby dissipate heat generated by the LED modules.

A light emitting diode (LED) lamp including a substrate, a plurality of wire units, a plurality of LED chips, a lamp cap, and a control circuit module is provided. The substrate has a carrying portion and a ring frame connected to the periphery thereof. The carrying portion has a plurality of openings. The wire units are respectively disposed inside the openings. Each wire unit has a wire and an insulating material covering the periphery of the wire, such that the wire is electrically isolated from the substrate. The LED chips are disposed on the carrying portion, and each LED chip is electrically connected to the corresponding wires. The lamp, cap is disposed on the bottom of the substrate and has two power contacts. The control circuit module is disposed between the substrate and the lamp cap and electrically connected to wires and power contacts, to control operations of LED chips.

An illumination apparatus of light emitting diodes and method of heat dissipation thereof are provided. The present illumination apparatus is associated with a loop heat pipe (LHP) device. The LHP device includes a condenser communicating with an evaporator. The illumination apparatus includes a base having a plurality of light emitting diodes disposed thereon and a cover with a light exit enclosing the base. The evaporator is associated with the base and the condenser is associated with the cover. The heat generated from the light emitting diodes is conducted to the cover, and thereby dissipated away.

There is provided headgear having a variety of components. In one form, the headgear includes a camera mounted to a brim thereof. Camera accessories that can be mounted to the headgear can include a switch, a control panel, a view finder, one or more lights. In another form, the headgear includes a heat sink mounted to the brim to dissipate heat generated by powered components of the headgear, such as the camera, a circuit board, one or more lights, or the like. In yet another form, the headgear includes a rotary switch for energizing the one or more lights and / or operating the camera.

A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.

A lighting system comprises at least one excitation source (5), preferably an LED, operable to generate and radiate excitation radiation of a first wavelength (λ1); a shade (4) configured to at least in part surround the at least one source (5) and remotely located thereto; and at least one phosphor (16) provided in or on at least a part of the shade (4), wherein the phosphor (16) emits radiation of a different wavelength in response to incident excitation radiation. The phosphor can be provided on a part of an outer or inner surface of the shade. Alternatively, or in addition, the phosphor is incorporated within the shade. The lighting system finds particular application as a hanging, a desk, a floor standing, a wall mountable, a spot, an outdoor or an accent lighting fixture.

A light device having a light source, lenses adjacent to the light source, a housing for securing the light source and the lenses, and a light fixture for securing the housing. The light source includes high efficiency light emitting diodes (LEDs), driver circuitry, and a heat sink mounted and integrated on a common board. The driver circuitry receives multiple input voltages, supplies an appropriate power signal, provides over-voltage protection and controls dimming for the LEDs. Lenses magnify and focus light emitting from the LEDs at a diffusion angle between 10° and 100°. The housing comprises a first and a second portion fittable together (e.g., threads, screws and openings). LEDs are operable between 250 mA to 1 A at 3.2 volts and produce at least 55 lumens per LED. The light fixture may be rotateable to adjust the direction of the light from the LED. The light fixture may be puck-shape.

An LED lamp includes a first heat sink, a second heat sink and a plurality of LED modules. The second heat sink is located at a lateral side of the first heat sink and pivotally connects with the first heat sink. The LED modules are evenly attached on bottoms of the first and second heat sinks. The second heat sink can be rotated relative to the first heat sink to be fixed at a required position, whereby an illumination angle of the LED lamp can be adjusted. Heat generated by the LED modules is dissipated by the first and second heat sinks.

A portable computer includes a motion detector providing input signals used for detecting movements indicating that the computer is held on the users lap or in his hands instead of on a desktop. When such movements are detected, the computer is operated in a first mode, with temperatures within the computer being controlled to maintain a surface of the housing at a temperature that is comfortable for the user. Otherwise, temperatures within the computer are allowed to rise to provide for faster processing or less fan noise.

An electronic apparatus having a structure for protecting a flexible printed circuit (FPC) and a chip thereon is described, including a metal backplate, a first circuit and a second circuit respectively on the front side and the back side of the backplate, a metal frame plate at the periphery of the backplate, at least one FPC with at least one chip thereon, a metal screen plate, and at least one insulating elastic ring disposed around the FPC. The FPC has a first end connected to the first circuit and a second end connected to the second circuit over the frame plate, and the screen plate is disposed on the frame plate screening the FPC and the chip. The inner periphery of the insulating elastic ring closely contacts with the chip, and the outer periphery of the ring closely contacts with the frame plate and the screen plate.

An LED lamp includes a monolithic housing made of metal extrusion and comprising a heat sink and a receiving portion integrally extending from a bottom of the heat sink, a plurality of LED modules attached to the heat sink, a cover covering the LED modules and a supporting bracket mounted on the housing. The heat sink includes a planar base and a plurality of fins extending from a top face of the base. The receiving portion includes a frame defining a window at a center thereof and two sidewalls interconnecting the frame and the base. The frame, the sidewalls and the base cooperatively define a receiving chamber for accommodating the LED modules therein. The LED modules are attached to the base and located corresponding to the window of the frame. The cover is mounted on a bottom of the frame and correspondingly covers the window.

A cushioning and support device includes a unitary member having a predetermined size, a pair of cavities formed in a first surface of such unitary member for ergonomic engagement with at least one portion of a human body and a plurality of longitudinal grooves formed in an opposed second surface of such unitary member in a direction perpendicular to a direction of the pair of cavities for providing air ventilation under a load placed onto the second surface.

A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (10′) mounted on an opposite side of the card, a pair of heat pipes (40) independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers (26) attached on the respective first and second heat sinks to form enclosed channels (15) between the covers and the first and second heat sinks respectively, a pair of fans (22) mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.

A retainer directly attaches to a circuit board component and to a heat sink and secures the circuit board component to the heat sink. The retainer provides a mechanical attachment between the heat sink and the circuit board component. Such mechanical attachment maintains thermal communication between the heat sink and the circuit board component in the absence of a thermally conductive adhesive between the heat sink and the circuit board component for the operational life of the circuit board component. Furthermore, because the retainer attaches directly to the circuit board component and to the heat sink, the retainer minimizes the necessity for use of mounting holes in the circuit board associated with the circuit board component to secure the heat sink to the circuit board component.

Methods and apparatus for reducing a thermal load on an optical head are described. Waste light is captured at one or more locations in the optical head and directed to a location that is thermally isolated from the one or more locations in the optical head using or more optical fibers.

A lamp comprises: a thermally conductive body; a plurality of LEDs configured as an array and mounted in thermal communication with the body and a light reflective hood located in front of the plane of light emitting diodes. The hood has at least two frustoconical light reflective surfaces that surround the array of LEDs and are configured such that in operation light emitted by the lamp is within a selected emission angle (beam spread). The hood is configured such that in operation a variation in illuminance (luminous flux per unit area incident on a surface) is 10% or less over approximately a third to one half of the selected emission angle.

A heat exchanger comprising a core assembly having a plurality of tubes connected by an array of fins, with ends of the tubes extending from the fin array on at least one side of the core assembly and resilient, polymeric grommets disposed around, the tube ends. The heat exchanger includes a tank portion for receiving fluid entering or leaving the core assembly and a header portion having openings to receive the tube ends and grommets to create a sealed, fluid-tight tube-to-header joint. There is provided a reinforcing member across the opening of the tube ends extending from the tube end opening to the portion of the tube end around which the grommet is disposed without substantially extending into the fin array portion of the core assembly. The header portion comprises a substantially planar base having openings therein with side and end walls extending out of the plane of the base and connected by one or more fluid-tight welds to the tank portion. The side and end walls extend a distance sufficient to dissipate heat generated in making the welds and keep the heat generated from adversely affecting sealing ability of the grommets when the welds are made between the tank and header portion with the tube ends and grommets received in the header portion openings.

A computer includes a chassis, a motherboard, an air guiding member, and a fan. The chassis includes a rear wall at a rear side thereof and a sidewall at a lateral side thereof. The rear wall defines a plurality of inlet holes therein, and the sidewall defines a plurality of outlet holes therein. The motherboard is received in the chassis opposite to the sidewall, a heat sink is installed on the motherboard for dissipating heat generated by a processor mounted on the motherboard. The air guiding member is received in the chassis at a front side, for guiding air drawn into the chassis through the inlet holes toward the outlet holes. The fan is used for drawing air from outside of the chassis through the inlet holes, and blowing the air out of the chassis through the outlet holes.

A photovoltaic cell has electrodes, p- and n-junctions, and a heat sink. The heat sink is on a side of the cell opposite to the light-receiving side of the photovoltaic cell. The photovoltaic cell may also have heat-conducting channels within an interior of the photovoltaic cell that conduct heat from the interior of the photovoltaic cell to the heat sink. The heat sink can remove heat caused by light absorbed by the photovoltaic cell but not converted to electricity as well as heat generated by resistance to high current passing through electrodes of the photovoltaic cell. A module formed of such cells can exhibit greater energy conversion efficiency as a result of the ability to dissipate the heat. A method of making a solar cell or module involves e.g. laminating a heat sink to a photovoltaic cell as described above.

A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

An LED lamp includes a heat sink, an LED module, a lamp cover, a driving circuit module and a rear cover. The heat sink defines isolated first and second cavities in two opposite ends thereof. The LED module is received in the first cavity of the heat sink and connecting with the heat sink. The lamp cover is arranged at an opening of the first cavity and covering the LED module. The driving circuit module is received in the second cavity of the heat sink and electrically connecting with the LED module. The rear cover is arranged at an opening of the second cavity of the heat sink and covering the driving circuit module.

A lighting assembly can include a linear light module with one or more LED light elements, where a length of the light module is greater than a width of the light module. An elongate socket removably receives the linear light module therein. The socket includes a locking mechanism actuatable to releasably and resiliently lock the linear light module in the socket via actuation of one or more levers.

A lighting system is described. The lighting system includes a substantially round lens, a base, a circuit board and an adaptor. The lens has an exterior side and an interior side. The base has a first side and a second side. The base is sealingly coupled to the interior side of the lens to create a watertight compartment therebetween. The second side of the base has at least one connector member. The circuit board is coupled to the first side of the base. The circuit board implements a circuit including a plurality of light emitting diodes (“LEDs”) and a power supply receiving connector. The power supply receiving connector is accessible through the second side of the base. The adaptor has a first side configured to interface with the at least one connector member and a second side having a threaded coupling to maintain the lighting system in a fixed position in a fitting.