301 results about "Deuteron radiation" patented technology

A semiconductor package and the method for forming the same are provided. The semiconductor package includes a substrate having an upper surface and a lower surface, first integrated circuit devices mounted on the upper surface, and second integrated circuit devices mounted on the lower surface. A first heat spreader in the form of a vapor-chamber (VC) is located over the first integrated circuit devices. A second heat spreader in the form of a vapor-chamber is located over the second integrated circuit devices. A heat-transfer member thermally couples the first heat spreader and the second heat spreader on both sides of the substrate.

A power module includes a first substrate, a second substrate, a first heat sink, a second heat sink, and a chip that are disposed opposite to each other. The chip is disposed between the first heat sink and the second heat sink that are disposed opposite to each other. The first heat sink and the second heat sink are connected to the chip through sintering or welding. The first substrate and the second substrate are respectively connected to the first heat sink and the second heat sink through welding or sintering.

The utility model discloses a processor heat radiation system, comprising a heat conduction plate, the bottom surface of which is used for abutting against a processor in a heat conduction manner; the first radiator comprises a first heat conduction pipe and a plurality of first radiating fins, the plurality of first radiating fins are connected to the first heat conduction pipe, and the first heat conduction pipe is in heat conduction connection with the heat conduction plate; the semiconductor refrigeration sheet is provided with a refrigeration surface and a heat dissipation surface which are arranged back to back, and the refrigeration surface abuts against the top surface of the heat conduction plate; the second radiator comprises a second heat conduction pipe and a plurality of second radiating fins, the plurality of second radiating fins are connected to the second heat conduction pipe, and the second heat conduction pipe is in butt joint with the radiating surface in a heat conduction manner; and the cooling fan is used for driving airflow to flow through the first cooling fins and the second cooling fins. According to the processor heat dissipation system, the heat dissipation effect on the processor can be improved, and the overall structure of the processor heat dissipation system is simpler and more compact.

Assemblies and methods for disinfecting surfaces using ultraviolet (UV) light are disclosed. In one aspect, a UV light-emitting assembly comprises a plurality of UV light emitters, and first and second UV light emitter supports seating the UV light emitters. A first heat sink is affixed to the first UV light emitter support and a second heat sink is affixed to the second UV light emitter support. A thermally conductive and electrically insulating plate contacts the first heat sink and the second heat sink.

A device may include a thermal barrier assembly arranged between a first battery cell and a second battery cell. A device may include a thermal insulating layer of the thermal barrier assembly configured to reduce thermal energy transfer between the first battery cell and the second battery cell. A device may include a first heat spreader fin and a second heat spreader fin each configured to establish a path for directing thermal energy from the first battery cell or the second battery cell away from the thermal insulating layer.

The invention discloses a chip packaging module structure and an electronic product, and relates to the technical field of chip packaging, the chip packaging module structure comprises a PCB, an insulating substrate, a first radiator and a second radiator; the insulation substrate is arranged on the PCB, the insulation substrate is provided with a first side and a second side, the insulation substrate is provided with a first chip in an integrated mode, the first chip is located on the second side of the insulation substrate, the insulation substrate is provided with a plurality of via holes penetrating through the first side and the second side, metal is arranged in each via hole, at least part of the via holes are conductive holes, and the first chip is arranged on the first side of the insulation substrate. The metal in the conductive hole is used as a part of an electric connection structure between the PCB and the plurality of chips; the first radiator is in thermal conduction connection with the first chip; the second radiator is arranged on the other side of the PCB, and a longitudinal heat conduction structure is formed between the second radiator and the first chip, so that the second radiator is in heat conduction connection with the first chip; the technical scheme provided by the invention aims to improve the heat dissipation efficiency.

A refrigerator including a thermoelectric module that includes a module plate having an opening, a first heat sink, a second heat sink, a thermoelectric element to be disposed in the opening so that one surface of the thermoelectric element contacts the first heat sink and another surface of the thermoelectric element, opposite the one surface, contacts the second heat sink, a fastening member that is configured to couple the first heat sink and the second heat sink to the module plate by being passed through the first heat sink, the module plate, and the second heat sink, having a head portion and a connecting portion having a diameter smaller than the head portion, a washer member supported between the head portion and the first heat sink, and a nut member to which the connecting portion is fastened and that is supported by the second heat sink.

The invention discloses a double-temperature-zone liquid cooling heat management system, an operation method and an energy storage system applying the double-temperature-zone liquid cooling heat management system. The double-temperature-zone liquid cooling heat management system comprises a first temperature zone heat management subsystem and a second temperature zone heat management subsystem. A first circulating pump, a heater, a first heat exchanger and a liquid cooling medium channel of a first radiator of the first temperature zone heat management subsystem are sequentially and circularly communicated; a second circulating pump, a second radiator and a liquid cooling medium channel of a second heat exchanger of the second temperature zone heat management subsystem are sequentially and circularly communicated; the first temperature zone heat management subsystem and the second temperature zone heat management subsystem can selectively operate independently and can also selectively communicate with each other to operate. The invention mainly solves the problem of how to provide a heat management system with double temperature zones for an energy storage system. According to the invention, the thermal management temperature zone requirements of the battery pack and the power conversion device can be met more effectively, and the system has the characteristics of high integration level, rich functions, good thermal management effect, low energy consumption and good economical efficiency.

There is provided a liquid discharge apparatus, in which a substrate unit includes a first abnormality notification section that notifies an abnormality of the substrate unit, a wiring substrate having a plurality of rigid members and a flexible member, a first heat sink, and a second heat sink, the first heat sink is laminated on the second surface of the first region and positioned close to the second rigid member, the second heat sink is laminated on the second surface of the second region and positioned close to the fourth rigid member, and the first abnormality notification section is provided on a fourth rigid member.

The utility model discloses a heat exchange device which comprises a shell, a first radiator, a second radiator, a pair of water pumps, a circuit board, a plurality of fans and a filtering tank. Wherein the first radiator and the second radiator are arranged in the shell in a V shape; the pair of water pumps are simultaneously communicated with the first radiator and the second radiator through pipelines; the circuit board is arranged in the shell and is arranged at the front end of the joint of the first radiator and the second radiator; the plurality of fans are arranged at the rear end of the shell; the filtering tank is vertically arranged in the shell and is respectively communicated with the heat source and the radiator through pipelines; according to the utility model, the circuit board is arranged at the front end of the joint of the two radiators, so that heat dissipation of the radiators is not influenced, and the circuit board can rapidly dissipate heat; when one radiator breaks down, the other radiator can continue to work, and immediate shutdown for maintenance is not needed; the filter element can be quickly replaced; two radiators or heat sources can be butted at the same time; and the diameter of the filtering tank can be larger, so that the cooling liquid flow is greatly improved.

The embodiment of the invention provides an optical module heat dissipation device, and the device comprises an optical module which comprises an upper housing and a lower housing, and the upper housing comprises a fixed housing part which is fixedly assembled and a floating housing part which is elastically assembled; and the radiator comprises a first radiator area and a second radiator area, the first radiator area is in contact with the fixed shell part, and the second radiator area is in contact with the floating shell part and is used for radiating the optical module. According to the embodiment of the invention, the problem of how to perform heat dissipation on devices in the optical module in a targeted manner in related technologies is solved, and the effect of targeted heat dissipation is achieved.

The invention discloses a whole electric vehicle thermal management system based on R290 and a control method of the whole electric vehicle thermal management system. The system comprises a heat pump system, a first heat transfer loop, a second heat transfer loop, a battery loop and an electric drive cooling system. A refrigerant of the heat pump system is R290, and the whole heat pump circulation loop is arranged in a front cabin of the vehicle; the first heat transfer loop can obtain heat from the heat pump system through the first heat exchanger and transfer the heat to the first radiator or the warm air core body; the second heat transfer loop can obtain cold energy from the heat pump system through the second heat exchanger and transfer the cold energy to the second radiator or the cold air core body; the battery loop is connected with the first heat transfer loop and the second heat transfer loop through pipelines, so that the temperature of the battery pack can be adjusted; the electric drive cooling system is connected with the second heat transfer loop through a pipeline, and heat of the electric drive system can be dissipated through the second radiator or provided for the heat pump system through the second heat exchanger.

The invention relates to heat dissipation equipment for engineering machinery. The heat dissipation equipment comprises a first oil dissipation assembly and a second oil dissipation assembly, the second oil radiator assembly is provided with a second radiator and a second fan, and the first oil radiator assembly and the second oil radiator assembly are arranged in parallel; the information acquisition unit is used for acquiring the environment temperature, the altitude, the load coefficient and the hydraulic oil temperature of the environment where the engineering machinery is located; the controller is respectively connected with the information acquisition unit, the first fan and the second fan, and is configured to receive data information from the information acquisition unit, calculate a cooling power total demand value of the heat dissipation equipment and a cooling power demand value distributed to the first oil radiator assembly and the second oil radiator assembly based on the received data information, and send the cooling power total demand value to the first oil radiator assembly and the second oil radiator assembly; and controlling the first oil radiator assembly and / or the second oil radiator assembly based on the allocated cooling power demand value. The invention further relates to a heat dissipation control method, engineering machinery and a computer readable storage medium.

A picture generation apparatus and a head-up display for a vehicle are provided. The picture generation apparatus includes: a Liquid Crystal Display (LCD) for projecting an image; a Back Light Unit for irradiating light onto the LCD; a first LCD heatsink including a first frame that contacts a first side of the LCD and surround a periphery of the LCD, and first heat dissipation fins extending from the first frame in a direction that does not cover the LCD; a second LCD heatsink including a second frame that contacts a second side of the LCD and surround a periphery of the first LCD heatsink, and second heat dissipation fins extending from the second frame in a direction that does not cover the LCD; and a Picture Generation Unit housing including a fixing portion to couple the LCD between the first LCD heatsink and the second LCD heatsink.

An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slot. The antenna module is located in the metal back cover. The antenna module includes a first radiator, second radiator, third radiator, fourth radiator, and fifth radiator. The first radiator has a feeding end. The second radiator connected to the first radiator has a contact portion which is connected to the metal back cover. The third radiator is connected to the second radiator and is located beside the first radiator. The third radiator has a first grounding terminal. The fourth radiator is connected to the second radiator and has a second grounding terminal. The fifth radiator is connected to the third radiator and the fourth radiator. Distances between the feeding end and the slot, the first grounding terminal and the slot, and the second grounding terminal and the slot all range from 3.5 mm to 10 mm.

The utility model discloses a heat dissipation structure of a double-tube hair removal instrument, which comprises an upper shell, a lower shell is arranged below the upper shell, the inner wall of the lower shell is integrally connected with an integrated injection molding hole column, a heat dissipation cover plate is embedded on the surface of the upper shell, the surface of the heat dissipation cover plate is provided with an air inlet hole, and the air inlet hole is communicated with the lower shell. A through opening used for air flowing is formed between the heat dissipation cover plate and the upper shell, a heat pipe heat dissipation assembly is installed below the through opening, and an air inlet channel is arranged below the heat pipe heat dissipation assembly. The upper shell and the lower shell are both supported by an integrated injection molding technology, the upper shell and the lower shell are combined together through an integrated injection molding hole column in an inserting mode, then a finished shell structure of the hair removing instrument is formed, two sets of radiators are installed in the shell structure and are the second radiator and the heat pipe radiating assembly respectively, and through air suction radiating and air blowing radiating, the heat dissipation efficiency of the hair removing instrument is improved. Therefore, the efficient heat dissipation effect of the hair removal instrument is improved, and the purpose of timely heat dissipation is achieved.

In some implementations, an optical module includes a housing and a circuitry component disposed within the housing, the circuitry component including an optical subassembly and a digital signal processor. The optical module may include a first heatsink above the optical subassembly, and a second heatsink above the digital signal processor, where the second heatsink is separated from the first heatsink by an air gap.

A cooling apparatus for a power module is provided. The cooling apparatus includes a first surface contact cooler contacting one surface of the power module and including a first heat sink, in which a first air flow path is formed and a second surface contact cooler contacting the other surface of the power module and including a second heat sink, in which a second air flow path is formed, wherein the first air path and the second air path mutually form a continuous air movement path.

Techniques for cooling a portion of a vehicle are discussed herein. A thermal management component may receive an ambient temperature proximate the vehicle. The vehicle may also receive a first coolant outlet temperature from a first radiator and a second coolant outlet temperature from a second radiator. In some examples, the first radiator may be located at a first end of the vehicle while the second radiator can be located at a second (and opposite) end of the vehicle. The thermal management component may determine a first cooling parameter for a first radiator fan proximate the first radiator and a second cooling parameter for a second radiator fan proximate the second radiator. Upon determining the first and / or second cooling parameter(s), the thermal management component may operate the first fan according to the first cooling parameter and the second fan according to the second cooling parameter.

A cooling apparatus for a vehicle for cooling a high-voltage device group mounted on the vehicle includes a radiator mechanism including a first radiator, a fan disposed adjacent to the first radiator, and a second radiator disposed between the first radiator and the fan. A first refrigerant circulation circuit performs heat exchange with a first group device in the high-voltage device group by circulation of a first refrigerant which radiates heat by the first radiator. A second refrigerant circulation circuit performs heat exchange with a second group device in the high-voltage device group by circulation of a second refrigerant which radiates heat by the second radiator. A chiller circuit includes a chiller where the chiller circuit includes a communication circuit which causes a downstream side of the chiller and an upstream side of the first radiator to communicate with each other through a flow-passage switching valve.

Implementations of a semiconductor package may include one or more power semiconductor die included in a die module; a first heat sink directly coupled to one or more source pads of the die module; a second heat sink directly coupled to one or more drain pads of the die module; a gate contact coupled with one or more gate pads of the die module; and a coating coupled directly to the die module. The gate contact may be configured to extend through an immersion cooling enclosure.

To reduce cost while securing cooling performance.SOLUTION: A cooling module is mounted to an electronic apparatus having a heating element. The cooling module includes: a first fan having a discharge port; a second fan having a discharge port; a first heat sink disposed to face the discharge port of the first fan; a second heat sink disposed to face the discharge port of the second fan; and a heat pipe for transporting heat of the heating element to the first heat sink and the second heat sink. The heat pipe includes: a first pipe part for connection to the heating element; a second pipe part branched from one end part of the first pipe part and connected to the first heat sink; and a third pipe part branched from one end part of the first pipe part and connected to the second heat sink.SELECTED DRAWING: Figure 2

Systems and methods are provided for a rechargeable battery that includes a plurality of first rechargeable battery cells on a first side of the rechargeable battery and a plurality of second rechargeable battery cells on a second side of the rechargeable battery. A plurality of first heat sinks are connected to one or more of the first rechargeable battery cells. The plurality of first heat sinks maintain contact with the one or more first rechargeable battery cells during an expansion of the first rechargeable battery cells. A plurality of second heat sinks are connected to one or more of the second rechargeable battery cells and maintain contact with the one or more second rechargeable battery cells during an expansion of the second rechargeable battery cells. An enclosure surrounds the first rechargeable battery cells, the second rechargeable battery cells, the first heat sink, and the second heat sink.

A cooling apparatus may include an electric water pump to pump coolant, a coolant channel in fluid communication with a cooling target and the electric water pump, and a thermoelectric device including a higher-temperature part and a lower-temperature part. The thermoelectric device may cool the coolant flowing into the coolant channel. The cooling apparatus may include a first heat sink disposed adjacent to the higher-temperature part, a second heat sink disposed adjacent to the coolant channel, and a cooling fan provided adjacent to the first heat sink. The cooling apparatus may include an air duct forming a first fluid line where air passes through only the first heat sink and is then discharged by operation of the cooling fan and forming a second fluid line where air passes through the first heat sink and the second heat sink and is then discharged by the operation of the cooling fan.

A battery array is disclosed. A battery array according to one embodiment of the present invention is a battery array comprising a structure in which a plurality of battery cells are stacked in a vertical direction, the battery array comprising: a first heat sink having a plate shape; the battery cell unit is mounted on the upper surface of the first heat radiator; a first pillar coupled to an upper surface of the first heat sink and extending in a vertical direction; a second heat sink having a plate shape, located above the first pillar, and having a lower surface coupled to the first pillar; and a reinforcing member, which is located between the second heat sink and the battery cell unit, and supports the lower surface of the second heat sink.

The utility model discloses a heat radiation structure of a circuit board and a power device, the heat radiation structure comprises a PCB, a power device, a first heat radiator and a second heat radiator, and the PCB is provided with a first board and a second board which are arranged back to back; the power device is arranged on the first plate surface, and the top surface of the power device protrudes out of the first plate surface; the first radiator is arranged on the side where the first plate surface is located and is provided with a first boss which is in insulated contact with the top surface of the power device for heat exchange; the second radiator is arranged on the side where the second plate surface is located and is provided with a second boss which is in insulated contact with the second plate surface for heat exchange; in addition, the first boss and the second boss are oppositely arranged. According to the heat dissipation structure of the circuit board, the first boss and the second boss which are oppositely arranged are used for clamping the two faces of the position, corresponding to the power device, on the PCB, so that the situation that the single face of the PCB is extruded to generate bending deformation is avoided, and the problem that the difference of the heat dissipation performance between different power devices on the PCB is large is effectively solved.

In one example, the disclosed heat sink assembly includes a first heat sink and a second heat sink, each having a plurality of ribs integrally formed by extrusion molding along its internal longitudinal direction, the spaces between the ribs forming flow paths for a refrigerant, first and second faces open at both longitudinal ends, and a communication port on one side wall adjacent to the second face, the first and second heat sinks being integrated by the side walls forming a joining surface so that the communication ports coincide, the ribs of the first and second heat sinks having a length such that both ends of the ribs are spaced a predetermined distance from the first and second faces, and the open first and second faces at both ends of the first and second heat sinks being closed by end plugs inserted so as to be spaced apart from the ends of the ribs.

An electronic unit (1) for a vehicle, comprising a housing (15) housing therein:-at least one electronic module (100),-at least one electronic board (3A, 3B) carrying said at least one electronic module (100),-a frame (7) releasably connectable to said at least one board (3A, 3B),-a first cooling system (25), the invention relates to an electronic module (100) comprising a frame (7) having a first cooling system configured to cool the at least one electronic module (100), the first cooling system comprising a heat sink (27) and a ventilation device (29) configured to convey a flow of air through the heat sink (27), characterized in that the frame (7) comprises a shaped portion (43) defining a second heat sink (45), and a second heat sink (45) configured to provide heat exchange with said at least one electronic module (100), wherein said shaped portion (43) of the frame (7) defining said second heat sink (45) comprises at least one channel (47; 51, 65, 67) in fluid communication with the environment outside said housing (15) of the electronic unit (1).

A satellite includes a first radiator panel with first heat-generating components attached to its surface and a second radiator panel with second heat-generating components attached to its surface. One or more actuators are configured to deploy the first and second radiator panels from a compact configuration in which the first and second radiator panels are overlapping to a deployed configuration in which the first and second radiator panels are non-overlapping.

The invention provides a water cooling head and a vehicle electronic control unit water cooling head. The vehicle electronic control unit water cooling head comprises a first radiator, a second radiator, a mounting plate and a cooling plate. The first radiator is provided with a first heat conducting plate and is in thermal contact with a first radiating fin group; the second radiator is provided with a second heat conducting plate and is in thermal contact with a second radiating fin group; the mounting plate is provided with an inlet opening hole, an outlet opening hole, a first boss and a second boss, the inlet opening hole and the outlet opening hole penetrate through the mounting plate, and therefore the first radiator and the second radiator are fixed to the first boss and the second boss respectively in the assembling process.