227 results about "Deuteron radiation" patented technology

A semiconductor package and the method for forming the same are provided. The semiconductor package includes a substrate having an upper surface and a lower surface, first integrated circuit devices mounted on the upper surface, and second integrated circuit devices mounted on the lower surface. A first heat spreader in the form of a vapor-chamber (VC) is located over the first integrated circuit devices. A second heat spreader in the form of a vapor-chamber is located over the second integrated circuit devices. A heat-transfer member thermally couples the first heat spreader and the second heat spreader on both sides of the substrate.

The utility model discloses a processor heat radiation system, comprising a heat conduction plate, the bottom surface of which is used for abutting against a processor in a heat conduction manner; the first radiator comprises a first heat conduction pipe and a plurality of first radiating fins, the plurality of first radiating fins are connected to the first heat conduction pipe, and the first heat conduction pipe is in heat conduction connection with the heat conduction plate; the semiconductor refrigeration sheet is provided with a refrigeration surface and a heat dissipation surface which are arranged back to back, and the refrigeration surface abuts against the top surface of the heat conduction plate; the second radiator comprises a second heat conduction pipe and a plurality of second radiating fins, the plurality of second radiating fins are connected to the second heat conduction pipe, and the second heat conduction pipe is in butt joint with the radiating surface in a heat conduction manner; and the cooling fan is used for driving airflow to flow through the first cooling fins and the second cooling fins. According to the processor heat dissipation system, the heat dissipation effect on the processor can be improved, and the overall structure of the processor heat dissipation system is simpler and more compact.

Assemblies and methods for disinfecting surfaces using ultraviolet (UV) light are disclosed. In one aspect, a UV light-emitting assembly comprises a plurality of UV light emitters, and first and second UV light emitter supports seating the UV light emitters. A first heat sink is affixed to the first UV light emitter support and a second heat sink is affixed to the second UV light emitter support. A thermally conductive and electrically insulating plate contacts the first heat sink and the second heat sink.

A device may include a thermal barrier assembly arranged between a first battery cell and a second battery cell. A device may include a thermal insulating layer of the thermal barrier assembly configured to reduce thermal energy transfer between the first battery cell and the second battery cell. A device may include a first heat spreader fin and a second heat spreader fin each configured to establish a path for directing thermal energy from the first battery cell or the second battery cell away from the thermal insulating layer.

The invention discloses a chip packaging module structure and an electronic product, and relates to the technical field of chip packaging, the chip packaging module structure comprises a PCB, an insulating substrate, a first radiator and a second radiator; the insulation substrate is arranged on the PCB, the insulation substrate is provided with a first side and a second side, the insulation substrate is provided with a first chip in an integrated mode, the first chip is located on the second side of the insulation substrate, the insulation substrate is provided with a plurality of via holes penetrating through the first side and the second side, metal is arranged in each via hole, at least part of the via holes are conductive holes, and the first chip is arranged on the first side of the insulation substrate. The metal in the conductive hole is used as a part of an electric connection structure between the PCB and the plurality of chips; the first radiator is in thermal conduction connection with the first chip; the second radiator is arranged on the other side of the PCB, and a longitudinal heat conduction structure is formed between the second radiator and the first chip, so that the second radiator is in heat conduction connection with the first chip; the technical scheme provided by the invention aims to improve the heat dissipation efficiency.

A refrigerator including a thermoelectric module that includes a module plate having an opening, a first heat sink, a second heat sink, a thermoelectric element to be disposed in the opening so that one surface of the thermoelectric element contacts the first heat sink and another surface of the thermoelectric element, opposite the one surface, contacts the second heat sink, a fastening member that is configured to couple the first heat sink and the second heat sink to the module plate by being passed through the first heat sink, the module plate, and the second heat sink, having a head portion and a connecting portion having a diameter smaller than the head portion, a washer member supported between the head portion and the first heat sink, and a nut member to which the connecting portion is fastened and that is supported by the second heat sink.

There is provided a liquid discharge apparatus, in which a substrate unit includes a first abnormality notification section that notifies an abnormality of the substrate unit, a wiring substrate having a plurality of rigid members and a flexible member, a first heat sink, and a second heat sink, the first heat sink is laminated on the second surface of the first region and positioned close to the second rigid member, the second heat sink is laminated on the second surface of the second region and positioned close to the fourth rigid member, and the first abnormality notification section is provided on a fourth rigid member.

The utility model discloses a heat exchange device which comprises a shell, a first radiator, a second radiator, a pair of water pumps, a circuit board, a plurality of fans and a filtering tank. Wherein the first radiator and the second radiator are arranged in the shell in a V shape; the pair of water pumps are simultaneously communicated with the first radiator and the second radiator through pipelines; the circuit board is arranged in the shell and is arranged at the front end of the joint of the first radiator and the second radiator; the plurality of fans are arranged at the rear end of the shell; the filtering tank is vertically arranged in the shell and is respectively communicated with the heat source and the radiator through pipelines; according to the utility model, the circuit board is arranged at the front end of the joint of the two radiators, so that heat dissipation of the radiators is not influenced, and the circuit board can rapidly dissipate heat; when one radiator breaks down, the other radiator can continue to work, and immediate shutdown for maintenance is not needed; the filter element can be quickly replaced; two radiators or heat sources can be butted at the same time; and the diameter of the filtering tank can be larger, so that the cooling liquid flow is greatly improved.

A picture generation apparatus and a head-up display for a vehicle are provided. The picture generation apparatus includes: a Liquid Crystal Display (LCD) for projecting an image; a Back Light Unit for irradiating light onto the LCD; a first LCD heatsink including a first frame that contacts a first side of the LCD and surround a periphery of the LCD, and first heat dissipation fins extending from the first frame in a direction that does not cover the LCD; a second LCD heatsink including a second frame that contacts a second side of the LCD and surround a periphery of the first LCD heatsink, and second heat dissipation fins extending from the second frame in a direction that does not cover the LCD; and a Picture Generation Unit housing including a fixing portion to couple the LCD between the first LCD heatsink and the second LCD heatsink.

In some implementations, an optical module includes a housing and a circuitry component disposed within the housing, the circuitry component including an optical subassembly and a digital signal processor. The optical module may include a first heatsink above the optical subassembly, and a second heatsink above the digital signal processor, where the second heatsink is separated from the first heatsink by an air gap.

A cooling apparatus for a power module is provided. The cooling apparatus includes a first surface contact cooler contacting one surface of the power module and including a first heat sink, in which a first air flow path is formed and a second surface contact cooler contacting the other surface of the power module and including a second heat sink, in which a second air flow path is formed, wherein the first air path and the second air path mutually form a continuous air movement path.

Techniques for cooling a portion of a vehicle are discussed herein. A thermal management component may receive an ambient temperature proximate the vehicle. The vehicle may also receive a first coolant outlet temperature from a first radiator and a second coolant outlet temperature from a second radiator. In some examples, the first radiator may be located at a first end of the vehicle while the second radiator can be located at a second (and opposite) end of the vehicle. The thermal management component may determine a first cooling parameter for a first radiator fan proximate the first radiator and a second cooling parameter for a second radiator fan proximate the second radiator. Upon determining the first and / or second cooling parameter(s), the thermal management component may operate the first fan according to the first cooling parameter and the second fan according to the second cooling parameter.

Implementations of a semiconductor package may include one or more power semiconductor die included in a die module; a first heat sink directly coupled to one or more source pads of the die module; a second heat sink directly coupled to one or more drain pads of the die module; a gate contact coupled with one or more gate pads of the die module; and a coating coupled directly to the die module. The gate contact may be configured to extend through an immersion cooling enclosure.

To reduce cost while securing cooling performance.SOLUTION: A cooling module is mounted to an electronic apparatus having a heating element. The cooling module includes: a first fan having a discharge port; a second fan having a discharge port; a first heat sink disposed to face the discharge port of the first fan; a second heat sink disposed to face the discharge port of the second fan; and a heat pipe for transporting heat of the heating element to the first heat sink and the second heat sink. The heat pipe includes: a first pipe part for connection to the heating element; a second pipe part branched from one end part of the first pipe part and connected to the first heat sink; and a third pipe part branched from one end part of the first pipe part and connected to the second heat sink.SELECTED DRAWING: Figure 2

Systems and methods are provided for a rechargeable battery that includes a plurality of first rechargeable battery cells on a first side of the rechargeable battery and a plurality of second rechargeable battery cells on a second side of the rechargeable battery. A plurality of first heat sinks are connected to one or more of the first rechargeable battery cells. The plurality of first heat sinks maintain contact with the one or more first rechargeable battery cells during an expansion of the first rechargeable battery cells. A plurality of second heat sinks are connected to one or more of the second rechargeable battery cells and maintain contact with the one or more second rechargeable battery cells during an expansion of the second rechargeable battery cells. An enclosure surrounds the first rechargeable battery cells, the second rechargeable battery cells, the first heat sink, and the second heat sink.

A cooling apparatus may include an electric water pump to pump coolant, a coolant channel in fluid communication with a cooling target and the electric water pump, and a thermoelectric device including a higher-temperature part and a lower-temperature part. The thermoelectric device may cool the coolant flowing into the coolant channel. The cooling apparatus may include a first heat sink disposed adjacent to the higher-temperature part, a second heat sink disposed adjacent to the coolant channel, and a cooling fan provided adjacent to the first heat sink. The cooling apparatus may include an air duct forming a first fluid line where air passes through only the first heat sink and is then discharged by operation of the cooling fan and forming a second fluid line where air passes through the first heat sink and the second heat sink and is then discharged by the operation of the cooling fan.

The utility model discloses a heat radiation structure of a circuit board and a power device, the heat radiation structure comprises a PCB, a power device, a first heat radiator and a second heat radiator, and the PCB is provided with a first board and a second board which are arranged back to back; the power device is arranged on the first plate surface, and the top surface of the power device protrudes out of the first plate surface; the first radiator is arranged on the side where the first plate surface is located and is provided with a first boss which is in insulated contact with the top surface of the power device for heat exchange; the second radiator is arranged on the side where the second plate surface is located and is provided with a second boss which is in insulated contact with the second plate surface for heat exchange; in addition, the first boss and the second boss are oppositely arranged. According to the heat dissipation structure of the circuit board, the first boss and the second boss which are oppositely arranged are used for clamping the two faces of the position, corresponding to the power device, on the PCB, so that the situation that the single face of the PCB is extruded to generate bending deformation is avoided, and the problem that the difference of the heat dissipation performance between different power devices on the PCB is large is effectively solved.

In one example, the disclosed heat sink assembly includes a first heat sink and a second heat sink, each having a plurality of ribs integrally formed by extrusion molding along its internal longitudinal direction, the spaces between the ribs forming flow paths for a refrigerant, first and second faces open at both longitudinal ends, and a communication port on one side wall adjacent to the second face, the first and second heat sinks being integrated by the side walls forming a joining surface so that the communication ports coincide, the ribs of the first and second heat sinks having a length such that both ends of the ribs are spaced a predetermined distance from the first and second faces, and the open first and second faces at both ends of the first and second heat sinks being closed by end plugs inserted so as to be spaced apart from the ends of the ribs.

An electronic unit (1) for a vehicle, comprising a housing (15) housing therein:-at least one electronic module (100),-at least one electronic board (3A, 3B) carrying said at least one electronic module (100),-a frame (7) releasably connectable to said at least one board (3A, 3B),-a first cooling system (25), the invention relates to an electronic module (100) comprising a frame (7) having a first cooling system configured to cool the at least one electronic module (100), the first cooling system comprising a heat sink (27) and a ventilation device (29) configured to convey a flow of air through the heat sink (27), characterized in that the frame (7) comprises a shaped portion (43) defining a second heat sink (45), and a second heat sink (45) configured to provide heat exchange with said at least one electronic module (100), wherein said shaped portion (43) of the frame (7) defining said second heat sink (45) comprises at least one channel (47; 51, 65, 67) in fluid communication with the environment outside said housing (15) of the electronic unit (1).

The invention provides a water cooling head and a vehicle electronic control unit water cooling head. The vehicle electronic control unit water cooling head comprises a first radiator, a second radiator, a mounting plate and a cooling plate. The first radiator is provided with a first heat conducting plate and is in thermal contact with a first radiating fin group; the second radiator is provided with a second heat conducting plate and is in thermal contact with a second radiating fin group; the mounting plate is provided with an inlet opening hole, an outlet opening hole, a first boss and a second boss, the inlet opening hole and the outlet opening hole penetrate through the mounting plate, and therefore the first radiator and the second radiator are fixed to the first boss and the second boss respectively in the assembling process.

The utility model discloses a novel UV lamp efficient cooling device which comprises a lamp box, the two ends of the lamp box are arranged at the long edge direction of the two ends of a frame of a conveyor and are perpendicular to the conveying direction of the conveyor, an upper cover is arranged at the upper end of the lamp box, a side cover is arranged on the side face of the lamp box, a handle is arranged on the end face of the side cover, and air holes are formed in the two sides of the handle. A fan is arranged on the inner side of the side wall of the side opposite to the side cover, a slot is formed in the inner side of the box body, a lamp body is slidably arranged on the inner side of the slot, a second radiator and a third radiator are attached to the surface of the upper end of the lamp body, the upper end of the second radiator is flush with the upper end of the third radiator, and a water tank is attached to the upper end of the second radiator and the upper end of the third radiator. By means of the cooling device, the cooling effect is improved, the number of fans is reduced, and multiple cooling modes are achieved.

An integrated chip including a semiconductor waveguide layer. A core portion of the semiconductor waveguide layer protrudes upward from a base portion of the semiconductor waveguide layer. A first heat radiator is spaced over the semiconductor waveguide layer and laterally spaced from the core portion in a first direction. A second heat radiator is spaced over the semiconductor waveguide layer and laterally spaced from the core portion in a second direction. A first dielectric layer is between the first heat radiator and the semiconductor waveguide layer and between the second heat radiator and the semiconductor waveguide layer. A distance between the first heat radiator and the semiconductor waveguide layer is less than a distance between the first heat radiator and the core portion. A distance between the second heat radiator and the semiconductor waveguide layer is less than a distance between the second heat radiator and the core portion.

The utility model relates to the technical field of project lamps, and particularly discloses an LED project lamp with a heat dissipation function. Comprising a lamp tube, an LED lamp body and a heat dissipation mechanism, the heat dissipation mechanism is in contact connection with the LED lamp body and is used for dissipating heat of the LED lamp body; the heat dissipation mechanism at least comprises a first heat dissipation device and a second heat dissipation device, and the first heat dissipation device is arranged between the LED lamp body and the second heat dissipation device. A plurality of evenly-distributed fixing grooves are formed in a machine body of the first radiator, the second radiator is provided with a rack, and one end of the rack is hung on the fixing grooves, so that the position of the second radiator is fixed. An air outlet is formed in the bottom of the lamp barrel; the heat of the LED lamp is transmitted to the first radiator through contact installation with the first radiator, and is discharged by the second radiator through the air outlet, so that heat accumulation is avoided, and the heat dissipation efficiency is further improved.

An apparatus is described. The apparatus includes a cooling assembly. The cooling assembly includes a cooling mass; a first heat spreader; a second heat spreader; a spring element; and, hinge components to form a hinge that the first and second heat spreaders rotate about. The spring element to apply a force to the first and second heat spreaders that causes the first and second heat spreaders to rotate about the hinge toward a circuit board located between the first and second heat spreaders.

This air conditioning device is provided with: a refrigerant circuit that performs a refrigeration cycle for executing a space heating operation by compressing a refrigerant to a critical pressure or higher to heat a utilization-side space; and a control device. Radiators include a first radiator and a second radiator connected in parallel. Expansion valves include a first expansion valve and a second expansion valve. The first radiator and the first expansion valve constitute a first utilization unit. The second radiator and the second expansion valve constitute a second utilization unit. When the first utilization unit is in a shut-down mode, the control device controls the first expansion valve to switch between a first state in which the first expansion valve is fully closed or is opened with a very small opening degree, and a second state in which the first expansion valve is opened more than when the first expansion valve is in the first state.

A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.

The invention provides an uninterruptible power supply module and an uninterruptible power supply. The uninterruptible power supply module comprises two PCBs (Printed Circuit Board); the first radiator and the second radiator are arranged on the top surface of each PCB; the first power semiconductor is arranged on the first radiator, and the second power semiconductor is arranged on the second radiator; and the driving device is arranged on the bottom surface. The driving device is arranged on the bottom surface of the PCB, so that the arrangement position of the transformer is more flexible, more space can be avoided for an area between the first radiator and the second radiator, and the structural sizes of the first radiator and the second radiator can be increased, so that the heat dissipation capability of the first radiator and the second radiator is improved. The driving device and the power semiconductors are located on different sides of the PCB, when the first power semiconductor and the second power semiconductor fail, burst and arc spraying occur, the driving device is not prone to being polluted by the arc spraying, and therefore the diffusion range of machine faults is reduced.

A vehicle, comprising a thermal management assembly. The thermal management assembly comprises a thermal management system and a heat sink assembly. The thermal management system comprises a high-temperature cooling circuit, a low-temperature cooling circuit and an air-conditioning cooling circuit, and the heat sink assembly comprises a first heat sink, a second heat sink and a third heat sink. The first heat sink is selectively connected to one of the high-temperature cooling circuit, the low-temperature cooling circuit and the air-conditioning cooling circuit. The second heat sink is selectively connected to one of the high-temperature cooling circuit, the low-temperature cooling circuit and the air-conditioning cooling circuit. The third heat sink is selectively connected to one of the high-temperature cooling circuit, the low-temperature cooling circuit and the air-conditioning cooling circuit.

The invention relates to a power semiconductor arrangement (2) having a first heat sink (4) and a second heat sink (6), wherein the heat sinks (4, 6) each have a planar surface (8), a first side face (10) and a second side face (12) arranged opposite the first side face (10), wherein at least one power semiconductor circuit (24) is connected to the surface (8) of each of the heat sinks (4, 6). In order to improve the service life of the power semiconductor arrangement (2), it is proposed that the first heat sink (4) has a plurality of first fins (16) and the second heat sink (6) has a plurality of second fins (18) and third fins (20), wherein: the fins (16, 18, 20) of each heat sink (4, 6) extend in parallel from the first side face (10) to the second side face (12) in an air flow direction (22); the second heat sink (6) is arranged downstream of the first heat sink (4) in the air flow direction (22); the second side face (12) of the first heat sink (4) directly adjoins the first side face (10) of the second heat sink (6); and the number of second fins (18) of the second heat sink (6) is equal to the number of first fins (16) of the first heat sink (4).

A method of dissipating heat generated by imaging devices and processing devices of a wearable electronic eyewear device includes providing a first heat sink thermally connecting the imaging devices to a frame of the eyewear device to sink heat to the frame and providing a second heat sink thermally connecting the processing devices to respective temples of the eyewear device to sink heat to the respective temples. The first and second heat sinks are thermally insulated from each other to direct the heat to different portions of the eyewear device. The processing devices may include a first co-processor disposed in a first temple connected to a first end of the frame and a second co-processor disposed in a second temple connected to a second end of the frame. The resulting eyewear device spreads the heat from heat generating devices over a larger area to minimize overall heating.