861 results about "Deuteron radiation" patented technology

A module for cooling a heat generating element comprising a heat receiving plate thermally connected to at least one heat generating element; a heat transfer device one end portion of which is thermally connected to the heat receiving plate and other end portion of which is thermally connected to a heat dissipating plate; a thermoelectric cooler one face of which is thermally connected to one face of the heat dissipating plate; a first heat sink thermally connected to other face of the heat dissipating plate; and a second heat sink thermally connected to other face of said thermoelectric cooler.

A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

An LED lamp includes a lamp base (10), a first heat sink (20) mounted on the lamp base, a plurality of second heat sinks (40) attached to a periphery of the first heat sink and a plurality of LED modules (30) respectively attached to the second heat sinks. The lamp base defines a plurality of vents (166) therein. The first heat sink includes a cylinder (22) at a center thereof. The cylinder has a through hole (25) defined therein, which communicates with the vents and cooperates with the vents to form an air passage communicating with ambient air. A thickness of each of the second heat sinks is gradually varied along a height direction of the each of the second heat sinks.

An LED lamp includes a hollow first heat sink (10), a plurality of LED modules (40) respectively mounted on outer sidewalls (120) of the first heat sink, a second heat sink (20) being enclosed by the first heat sink, and a plurality of heat pipes (30) connecting the second heat sink to the first heat sink. The second heat sink includes an annular base (22) and a plurality of fins (24, 240) extending outwardly and radially from an outer sidewall of the base. The heat pipes couple the base of the second heat sink with the first heat sink, so that heat generated by the LED modules can be transferred from the first heat sink to the second heat sink via the heat pipes, thereby enhancing a heat dissipating efficiency of the LED lamp.

A modular thermoelectric cooling / heating unit is installed through an opening in a wall separating first and second temperature zones. This modular thermoelectric cooling / heating unit comprises a thermoelectric device including a cold surface, a hot surface, and a cooling / heating member between an electrical power supply and the cold and hot surfaces. A heat conducting block has a proximal end for thermally contacting with a first one of the cold and hot surfaces, and a distal end. A first heatsink thermally contacts with a second one of the cold and hot surfaces, a second heatsink thermally contacts with the distal end of the heat conducting block, and a thermally insulated housing covers at least a portion of the heat conducting block between the proximal and distal ends of this block. In operation, the first heatsink is located in the first temperature zone, at least a portion of the heat conducting block and the thermally insulated housing extend through the wall opening, and the second heatsink is located in the second temperature zone. The above described modular thermoelectric cooling / heating unit can be used in a modular cooling system for retrofit into an existing refrigeration unit.

An LED lamp includes a lamp base (10), a first heat sink (20) mounted on the lamp base, a plurality of second heat sinks (40) attached to a periphery of the first heat sink and a plurality of LED modules (30) respectively attached to the second heat sinks. The lamp base defines a plurality of vents (166) therein. The first heat sink includes a cylinder (22) at a centre thereof. The cylinder has a through hole (25) defined therein, which communicates with the vents and cooperates with the vents to form an air passage communicating with ambient air. A thickness of each of the second heat sinks is gradually varied along a height direction of the each of the second heat sinks.

An LED recessed lighting apparatus has a housing mountable in a recess located behind a recess opening in an architectural structure. A non-vented trim is securable in place over the recess opening. A lens that allows light from the LED to pass through the trim has a fluid-tight internal cavity containing at least the light-emitting portion of the LED. At least a major portion of the heat generated by the LED is carried directly from the LED to the outside surface of said trim by way of a thermal path that includes a first heat sink located substantially immediately adjacent and intimately thermally conductively coupled to the LED, at least one second heatsink supported by and substantially directly thermally conductively coupled to, the inside of the trim, and at least one heat pipe thermally connecting the first heat sink to the second heat sink.

An LED lamp assembly includes a first heat sink, a plurality of second heat sinks secured to a periphery of the first heat sink, a plurality of LED modules respectively attached to the second heat sinks and a plurality of heat pipes interconnecting the first heat sink and the second heat sinks. The first heat sink comprises a heat conducting body defining a through hole therein and a plurality of first fins around the heat conducting body. The second heat sinks each comprise a plurality of second fins facing the first fins of the first heat sink. The heat pipes each comprise an evaporating section attached to a corresponding second heat sink and a condensing section extending into the through hole of the heat conducting body of the first heat sink and attached to the heat conducting body.

A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50′) thermally connected to the first heat sink, a second heat pipe (60, 60′) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80′) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

A method includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The mated first heat spreader and second heat spreader have at least one convection channel disposed therebetween. A process includes placing a first die in a first die recess of the first heat spreader, and placing a second die on a second die site on the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. A package is achieved by the method, with reduced thicknesses. The package can be coupled through a bumpless build-up layer. The package can be assembled into a computing system.

A power semiconductor module having an increased reliability against thermal fatigue includes a power semiconductor element, a lower-side electrode connected to the lower side of the element, a first insulating substrate connected to the upper side of the lower-side electrode and having metallic foils bonded on both surfaces thereof, an upper-side electrode connected to the upper side of the power semiconductor element, a second insulating substrate connected to the upper side of the upper-side electrode and having metallic foils bonded on both surfaces thereof, a first heat spreader connected to the lower side of the first insulating substrate, and a second heat spreader connected to the upper side of the second insulating substrate. The power semiconductor element and the first and second insulating substrates are sealed with a resin.

A thermoelectric generator has a high temperature heat source part provided on a first passage through which a first fluid for cooling an engine flows, a low temperature heat source part provided on a second passage through which a second fluid having a temperature lower than that of the first fluid flows, and a thermoelectric element for producing electric power by a temperature difference produced between the high temperature heat source part and the low temperature heat source part. The first passage is included in a first circuit in which the engine and a first radiator for cooling the first fluid are connected in loop through a main passage. Further, the first passage is in parallel to the first radiator in the first circuit. The second passage is included in a second circuit that is separate from the first circuit and includes a second radiator for cooling the second fluid.

A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.

A power semiconductor module includes first and second insulating substrates, a power semiconductor device joined directly or through another element to opposite sides of the first and second insulating substrates and first and second heat spreaders joined with joining material having fluidity upon joining so as to put the first and second insulating substrates between the first and second heat spreaders. When the power semiconductor module is fabricated, the first and second insulating substrates are joined to the first and second heat spreaders, respectively, in the state that weight bearing on joining material is reduced by means of resilient member.

A dual-layer heat dissipating structure includes a first heat sink, a second heat sink, and a heat pipe with a connecting portion and a curved portion, interconnecting the first and second heat sinks for thermal conduction. The first and second heat sinks each has a substrate and exterior fins protruding from two opposing ends thereof. Two substrates each includes at least one slot through out of two corresponding end plates of the same side for locating the connecting portion, and the corresponding end plates each includes an opening with respect to the slot for partially moving in the curved portion. The exterior fins of the first and second heat sinks are aligned with each other, and a snap-type connecting structures are formed on terminuses of the exterior fins. The second and first heat sinks are connected to each other by the snap-type structure, and the connection joint is reinforced by implanting soldering material.

An LED lamp assembly includes a first heat sink, a plurality of second heat sinks secured to a periphery of the first heat sink, a plurality of LED modules respectively attached to the second heat sinks and a plurality of heat pipes interconnecting the first heat sink and the second heat sinks. The first heat sink comprises a heat conducting body defining a through hole therein and a plurality of first fins around the heat conducting body. The second heat sinks each comprise a plurality of second fins facing the first fins of the first heat sink. The heat pipes each comprise an evaporating section attached to a corresponding second heat sink and a condensing section extending into the through hole of the heat conducting body of the first heat sink and attached to the heat conducting body.

A resin sealed semiconductor device includes a first semiconductor switching device having a first emitter terminal and a first collector terminal bonded to its top and bottom surfaces respectively, a second semiconductor switching device having a second emitter terminal and a second collector terminal bonded to its top and bottom surfaces respectively, a first heat sink directly or indirectly bonded to the first collector terminal, a second heat sink directly or indirectly bonded to the second collector terminal, and a molding resin integrally covering the first and second semiconductor switching devices. The first and second heat sinks are exposed from the molding resin. The first emitter terminal faces and is spaced apart from the second emitter terminal.

In one aspect, an electric machine is provided. The electric machine includes a housing including at least one air intake, an air outlet, and an air passage extending between the at least one air intake and the air outlet. The electric machine also includes a first heat sink positioned at least partially within the air passage, and a second heat sink positioned at least partially within the air passage downstream of the first heat sink. A cooling airflow through the at least one air intake flows through the air passage to cool the first heat sink and the second heat sink before the cooling airflow is exhausted through the air outlet

Disclosed is a wearable cooler including a thermoelectric module provided on clothes for absorbing and discharging heat according to an electric current, at least one first heat sink provided at a first side of the thermoelectric module, at least one second heat sink provided at an opposite side of the first heat sink on the basis of the thermoelectric module, at least one first fan provided at an opposite side of the thermoelectric module on the basis of the first heat sink for blowing air to the first heat sink, and an external case surrounding outsides of the first heat sink and the first fan, and having at least one air inlet and at least one air outlet.

The present invention provides a heat sink assembly. The heat sink assembly comprises a first heat sink with a fan disposed therein, a second heat sink and a heat pipe. The heat pipe has two ends respectively being disposed inside the first heat sink and the second heat sink, The heat pipe is disposed in a side of the first heat sink and the second heat sink and connects the first heat sink and the second heat sink with a space therein for positioning the fan. Therefore, the first heat sink and the second heat sink become a main heat-dissipating region and a sub heat-dissipating region. Heat is dissipated first in the first heat sink (the main heat-dissipating region) and then transferred via the heat pipe to the second heat sink (the sub heat-dissipating region) for being dissipated again.

A heat sink comprises a heat sink base and a row of heat sink extensions that are attached to one side of the heat sink base. An interleaved heat sink structure includes a first row and a second row of heat sink extensions. The first row and the second row of heat sink extensions are coupled respectively to a first and a second heat sink bases. The first and the second heat sink bases are thermally coupled to a first plurality of memory packages and a second plurality of memory packages, respectively. The first row of heat sink extensions is parallel to and at least partially interleaved with the second row of heat sink extensions. A memory heat dissipation control system and a method for assembly a memory part that includes a DIME and two heat sinks are also described.

A dual-layer heat dissipating structure includes a first heat sink, a second heat sink, and a heat pipe with a connecting portion and a curved portion, interconnecting the first and second heat sinks for thermal conduction. The first and second heat sinks each has a substrate and exterior fins protruding from two opposing ends thereof. Two substrates each includes at least one slot through out of two corresponding end plates of the same side for locating the connecting portion, and the corresponding end plates each includes an opening with respect to the slot for partially moving in the curved portion. The exterior fins of the first and second heat sinks are aligned with each other, and a snap-type connecting structures are formed on terminuses of the exterior fins. The second and first heat sinks are connected to each other by the snap-type structure, and the connection joint is reinforced by implanting soldering material.

A heat dissipating device with uniform heat points, having a first heat sink, a second heat sink and at least two heat pipes. The second heat sink is aligned over the first heat sink. Each heat pipe has a heat absorbing portion and a heat dissipating portion. The heat absorbing and dissipating portions of each heat pipe are in thermal communication with the first and second heat sinks, respectively. The distance between two neighboring heat absorbing portions is smaller than the distance between the heat pipe and the heat sink. Thereby, the heat absorbing portions are concentrated to absorb heat generated by a heat source, and the heat dissipating portions are distributed over a larger area to effectively dissipate the heat.

A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

A light fixture having a light source, first and second heat sinks with corresponding first and second thermal interfaces having complementary curved surfaces, and a linkage having cams, and springs to create contact pressure between the thermal interfaces when the light fixture is in an operation mode and to permit movement between the thermal interfaces when the light fixture is in an adjustment mode. When the light fixture is in operation mode, the first and second heat sinks work in combination to provide a highly effective heat dissipation system. When the light fixture is in adjustment mode, the separation created permits the light source to move along an adjustment path to change the angular direction of the light emitted and to rotate about a rotational axis, providing a full range of directional lighting orientations.

The present disclosure relates to assembling elastic laminates that may be used to make absorbent article components. Methods and apparatuses herein may include an anvil adapted to rotate about an axis of rotation, wherein first and second spreader mechanisms adjacent the anvil roll are axially and angularly displaced from each other with respect to the axis of rotation. During the assembly process, a substrate may be advanced in a machine direction onto the rotating anvil. The first spreader mechanism stretches a first elastic material in the cross direction, and the second spreader mechanism stretches a second elastic material in the cross direction. The stretched first and second elastic materials advance from the spreader mechanisms and onto the substrate on the anvil roll. The combined and elastic materials may then be ultrasonically bonded together on the anvil to form at least one elastic laminate.

Provided is a broadband internal antenna including a ground plate and an antenna unit. The antenna unit can include a feed point; a first radiator, formed with a bar shape having the feed point as one end part and the other end part from which an uncurved ‘C’ shape is extended; a ground point, connected to the ground plate; a second radiator, having one end part on which the ground point is mounted and the other end part that is connected to an area from which the uncurved ‘C’ shape of the first radiator starts to be formed in an open loop form; a first protrusion part, protruded from the uncurved ‘C’ shape of the first radiator to be formed in a closed loop form; and a second protrusion part, formed inside the open loop shape of the first radiator in an inverse L’ form.

In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

According to certain embodiments, an apparatus for cooling light emitting diodes (LEDs) in projectors includes one or more first LEDs, one or more first heat sinks, one or more second LEDs, and one or more second heat sinks. The first LEDs are configured to generate light, and each first LED has a first desired junction temperature. The first heat sinks are configured to dissipate heat generated by the first LEDs. The second LEDs are configured to generate light, and each second LED has a second desired junction temperature that is higher than the first desired junction temperature. The second heat sinks are configured to dissipate heat generated by the one or more second LEDs. A cooling fan directs air flow over the first heat sinks and the second heat sinks, and an exhaust vent enables the air flow over the first heat sinks and the second heat sinks.