20 results about "Deuteron radiation" patented technology

This utility model discloses an IGBT module performance testing device, including a housing and a support frame disposed within the housing. A partition fixed to the support frame is also provided inside the housing, dividing the inner cavity of the housing into a heat dissipation cavity and a testing cavity. An IGBT module is mounted on the partition, located within the testing cavity. A rectifier module is mounted below the IGBT module on the partition. Multiple capacitors are mounted on the support frame, and these capacitors are connected to the IGBT module via busbars. A control module is installed inside the housing, located below the capacitors. A first heat sink for dissipating heat from the IGBT module and a second heat sink for dissipating heat from the rectifier module are installed within the heat dissipation cavity. A heat dissipation duct connecting to the top of the heat dissipation cavity is provided on the housing. This device enables testing of the IGBT module with good heat dissipation performance, ensuring normal testing.

A double-sided cooling (DSC) semiconductor package is summarized as including a first assembly having a plurality of pillars that extend outward from a first heat sink or dissipation structure and at least one die that is pre-coupled to the first heat sink or dissipation structure. A second assembly includes a plurality of flanges that are pre-welded or pre-coupled to a second heat sink or dissipation structure. The first assembly and second assembly are pre-formed before being coupled together. After the first assembly and the second assembly have been formed, the first assembly is coupled to the second assembly. After the pre-formed stacked semiconductor assembly has been formed, a molding compound is applied to form the first embodiment of the double-sided cooling (DSC) semiconductor package or device.

The utility model provides a kind of electric control panel first, including radiator base plate, first heating area, electrical component area and second heating area are sequentially arranged on base plate, the total heat generation of device in first heating area is less than the total heat generation of device in second heating area, device in electrical component area does not heat generation;The back of the base plate of first heating area is provided with first radiator, the back of the base plate of second heating area is provided with second radiator, and the heat dissipation efficiency of second radiator is greater than the heat dissipation efficiency of first radiator, and second radiator extends to the side of electrical component area.The utility model further provides electric control box and air conditioning unit equipped with the electric control panel.The utility model provides a kind of electric control panel, electric control box and air conditioning unit, partition according to the heat generation of electrical component, and according to heat generation, different heat dissipation efficiency radiator is set, so that each device can be evenly heat dissipated, avoid the problem of condensate and uneven heat dissipation.

The present disclosure relates to a kind of missile-borne phased array antenna near-field phase matching device and its use method.The device includes: phase matching box, including box, phase matching array surface, fixing frame and wave-absorbing embryo, box is the hexahedron of by main panel, back panel, upper panel, lower panel and two side panels;Clamp is set on the outer wall of main panel;Heat dissipation mechanism includes the first radiator and second radiator of movable setting on the outer wall of main panel;Adjustable lock buckle component is connected with the first radiator and second radiator.The present disclosure realizes the constraint of missile-borne antenna circumferential degree of freedom by positioning block, utilizes clamp and the shell back cover of antenna, realizes the constraint of missile-borne antenna axial degree of freedom, to realize the quick positioning of missile-borne antenna clamping and installation.The first radiator and second radiator are tightly adhered to the surface of the shell of missile-borne antenna by adjustable lock buckle, to realize the increase of heat dissipation area, to realize the heat dissipation of missile-borne antenna.

A modular heat sink system (3a, 3b, 3c) for a lighting device (1). The modular heat sink system (3a, 3b, 3c) comprises a plurality of second heat sink modules (3b, 3c) adapted to be mounted on a platform (2) around a central heat sink module (3a). The number of mounted modules can be adapted to match the number of light sources fitted to the platform (2).

The blower device of this disclosure is thin and can cool the entire body. [Solution] The blower according to the present disclosure comprises a first fan, a first intake port, a first heat sink, a first exhaust port, a second fan, a second heat sink, a second exhaust port, and a Peltier element. The first fan is positioned spaced apart from the Peltier element, and as the first fan rotates, it draws in air from the first intake port, brings the drawn-in air into contact with the first heat sink, and discharges the air that has come into contact with the first heat sink into the inside of the garment through the first exhaust port. The second fan is positioned spaced apart from the Peltier element, and as the second fan rotates, it draws in air from the second intake port, brings the drawn-in air into contact with the second heat sink, and discharges the air that has come into contact with the second heat sink to the outside of the garment through the second exhaust port.

The utility model provides a high-power light supplement lamp, and belongs to the technical field of light supplement lamps. The high-power light supplement lamp comprises a shell, a light source component is arranged on one side of the shell, a control device is arranged on the other opposite side of the shell, the control device comprises a circuit board, and the circuit board is fixed in the shell. A first radiator is arranged between the circuit boards, a plurality of parallel first air channels are arranged in the first radiator, and one side of the first radiator is connected with the light source component; a cooling fan is fixed to one side of the first radiator and faces the first air channel. A second radiator is arranged on one side of the circuit board, and one side of the second radiator is connected with the cooling fan. The light supplementing lamp is novel in structure, the controller and the light source component can be cooled through the cooling fan at the same time, and therefore the temperature rise of the light source component and the controller in the working process can be reduced, and the light supplementing lamp can stably work for a long time.

A double-sided cooling (DSC) semiconductor package (213) is summarized as including a first assembly having a plurality of pillars (202) that extend outward from a first heat sink or dissipation structure (102) and at least one die (204) that is pre-coupled to the first heat sink or dissipation structure (102). A second assembly includes a plurality of flanges (210, 240) that are pre-welded or pre-coupled to a second heat sink or dissipation structure (104). The first assembly and second assembly are pre-formed before being coupled together. After the first assembly and the second assembly have been formed, the first assembly is coupled to the second assembly. After the pre-formed stacked semiconductor assembly has been formed, a molding compound (215) is applied to form the first embodiment of the double-sided cooling (DSC) semiconductor package or device.

The utility model provides a kind of heat sink applied to depilating instrument, including the laser module being set on depilating instrument, the side of the laser module is provided with light exit cover, the end of the light exit cover is equipped with sapphire for being contacted with depilation site, the sapphire is connected with first radiator, the other side of the laser module is connected with heat conducting block, the heat conducting block is connected with second radiator.For the utility model, the temperature of one side of laser module can be reduced by first radiator, i.e. the temperature of sapphire can be reduced, so that the temperature of sapphire is reduced, cooling is facilitated, to avoid scalding user, the temperature of the other side of laser module can be reduced by second radiator, two groups of radiators are used, and the heat dissipation effect is better, and the heat is dissipated through second radiator by heat conducting block, to avoid the distribution of radiator in the head of depilating instrument, effectively reduce the volume of the head of depilating instrument, and facilitate user use.

Provided is a battery array. A battery array having a structure in which a plurality of battery cell units are stacked in a vertical direction includes a first heat sink having a plate shape, a first battery cell unit seated on a top surface of the first heat sink, a first column coupled to the top surface of the first heat sink and extending in the vertical direction, and a second heat sink having a plate shape, located on the first column, and including a bottom surface coupled to the first column.

The present invention relates to ultraviolet light emitting assemblies. Assemblies and methods for disinfecting a surface using ultraviolet (UV) light are disclosed. In one aspect, a UV light emitting assembly (300, 400) includes a plurality of UV light emitters (320) and first and second UV light emitter supports (322, 323) that house the UV light emitters. A first heat sink (346) is attached to the first UV light emitter support and a second heat sink (380) is attached to the second UV light emitter support. A thermally conductive, electrically insulating plate (370) contacts the first heat sink and the second heat sink.

This disclosure relates to a cooling apparatus and a method for cooling semiconductor devices, wherein the cooling apparatus is disposed over a top surface and a bottom surface of a printed circuit board. The disclosed cooling apparatus comprises a printed circuit board, a first semiconductor device comprising a first thermal pad and mounted on a top surface of the printed circuit, a second semiconductor device comprising a second thermal pad and mounted on a bottom surface of the printed circuit, a first heat sink, a first thermal interface structure thermally coupled between the first thermal pad and the first heat sink, a second heat sink, and a second thermal interface structure thermally coupled between the second thermal pad and the second heat sink.

A heat transfer system includes: a fluid conduit having an internal portion for guiding coolant and an external portion physically isolated from the coolant; a first radiator thermally connected to the fluid conduit at a first location on the internal portion of the fluid conduit, wherein the first radiator has a first flow resistance; a second radiator thermally connected to the fluid conduit at a second location on the internal portion of the fluid conduit, wherein the second radiator has a second flow resistance greater than the first flow resistance; and an electronic component thermally connected at the second location on the external portion of the fluid conduit adjacent to the second radiator.

The present invention addresses the problem of providing a temperature adjustment apparatus that makes it possible to improve temperature adjustment efficiency by increasing the heat exchange rate of a heat sink. This temperature adjustment apparatus (1) has a structure formed from: a heat transfer portion (3) for transferring heat that is, for example, absorbed by one surface (8A) of a Peltier element (8); a bottom portion (4); a front portion (6); a back portion (7); and a pair of side portions (5). The temperature adjustment apparatus (1) comprises: a blower fan (12) for blowing air, the blower fan having an intake opening (7KA) for taking in air into the temperature adjustment apparatus (1), and a discharge opening (6KA) for discharging air out from the temperature adjustment apparatus (1); and a heat transfer member (13) for transferring heat to a first heat sink (11A) and a second heat sink (11B) for radiating heat that is transferred from a heat discharge portion (9) on the other-surface (8B) side of the Peltier element (8). The heat discharge portion (9) is positioned between the locations where the first heat sink (11A) and the second heat sink (11B) are positioned.

We provide a semiconductor module that enables heat dissipation from both sides. [Solution] The device comprises a first semiconductor chip 31 and a second semiconductor chip 32 on which switching elements are formed; a first heat sink 21 provided on the second surface 1b side of the first semiconductor chip 31 and on which the first semiconductor chip 31 is placed; a second heat sink 22 provided on the second surface 1b side of the second semiconductor chip 32 and on which the second semiconductor chip 32 is placed; a sealing member 50 for sealing the first semiconductor chip 31 and the second semiconductor chip 32; a first heat dissipation wiring layer 161b provided on the first surface 1a side of the first semiconductor chip 31 and thermally connected to the first semiconductor chip 31; and a second heat dissipation wiring layer 162b provided on the first surface 1a side of the second semiconductor chip 32 and thermally connected to the second semiconductor chip 32.

A heat pump system for a vehicle, comprising: a compressor; an air conditioning and heating module including a heater core and an evaporator connected to the compressor; and a door regulating air flowing through the evaporator to selectively flow into the heater core; a condenser connected to the compressor; a sub-condenser connected to the condenser and selectively condensing refrigerant discharged from the condenser; a first expansion valve provided between the sub-condenser and the evaporator; a refrigerant connection line having a first end connected between the sub-condenser and the first expansion valve and a second end connected between the evaporator and the compressor; a cooler provided on the refrigerant connection line; a first cooling device connected to the condenser via a first coolant line and including a first radiator provided on the first coolant line, an electrical component, and a first water pump; and a second cooling device connected to the sub-condenser via a second coolant line and including a second radiator provided on the second coolant line and a second water pump.

An electronic device formed as a power supply system, includes a housing, a first electronic subassembly forming a first power supply unit that includes a first heatsink, and a second electronic subassembly forming a second power supply unit that includes a second heatsink, where the first and the second electronic subassemblies are arranged in the housing, and the first heatsink and the second heatsinks are pressed internally against the housing via pressing elements.

The application discloses a tool for mounting multiple groups of IGBT tubes and rectifier diodes, which is used for mounting IGBT tubes and rectifier diodes on a heat sink and comprises a first limiting plate and a second limiting plate. A plurality of first adaptive grooves are formed in the top of the first limiting plate, the groove bottoms of a part of the first adaptive grooves are downwardly provided with first double-pin matching grooves, the groove bottoms of the rest of the first adaptive grooves are downwardly provided with first three-pin matching grooves, and a first heat sink adaptive groove is further formed in one side of the top of the first limiting plate. A plurality of second adaptive grooves are formed in the top of the second limiting plate, the groove bottoms of a part of the second adaptive grooves are downwardly provided with second double-pin matching grooves, the groove bottoms of the rest of the second adaptive grooves are downwardly provided with second three-pin matching grooves, and a second heat sink adaptive groove is further formed in one side of the top of the second limiting plate. The tool can solve the problems of complex structure, high manufacturing cost and inconvenient operation of the existing tool.

A dual-tower type CPU cooler having a support member that suppresses tilting of a heat sink according to the present invention is characterized by comprising: a base plate that absorbs heat by contacting a CPU; a plurality of heat pipes coupled to the base plate to receive heat; a first heat sink and a second heat sink connected to the plurality of heat pipes to release heat; and a support member that connects the lower ends of the first and second heat sinks to each other to suppress tilting of the first and second heat sinks. According to the dual tower type CPU cooler equipped with a support that suppresses tilting of the heat sink according to the present invention, by physically restraining the lower portions of the first and second heat sinks with the support, tilting caused by self-weight, external shock, and vibration is fundamentally suppressed, and a stable thermal contact state between the base plate and the upper surface of the CPU is maintained for a long period of time.

The embodiment of the present application provides a heat dissipation device and a projection device; wherein the heat dissipation device comprises a pipeline, a first heat sink and a second heat sink; the pipeline is filled with liquid metal; the first heat sink comprises a base and a plurality of vibrating ribs arranged on one side of the base, one side of the base away from the plurality of vibrating ribs is in contact with a target heat source, a flow channel is arranged in the base, the flow channel is connected with the pipeline to form a loop for the liquid metal to flow, and a position of the loop in contact with the base forms a hot end; the vibrating rib is a piezoelectric ceramic, under the electrified state, the vibrating rib generates vibration to dissipate heat for the target heat source; the second heat sink is arranged on the pipeline to form a cold end on the pipeline; the liquid metal flows in the loop to transport the heat absorbed from the hot end to the cold end to release. The heat dissipation device provided by the embodiment of the present application has excellent heat dissipation performance and can improve the display quality of the projection image.