Module for cooling semiconductor device

a semiconductor device and module technology, applied in the field of modules for cooling semiconductor devices, can solve the problems of large amount of heat generated, insufficient heat absorption of peltier devices (tec), and insufficient heat absorption of heat pipes. achieve the effect of improving cooling efficiency
US20050257532A1Inactive Publication Date: 2005-11-24FURUKAWA ELECTRIC CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
FURUKAWA ELECTRIC CO LTD
Publication Date
2005-11-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

A module for cooling a heat generating element comprising a heat receiving plate thermally connected to at least one heat generating element; a heat transfer device one end portion of which is thermally connected to the heat receiving plate and other end portion of which is thermally connected to a heat dissipating plate; a thermoelectric cooler one face of which is thermally connected to one face of the heat dissipating plate; a first heat sink thermally connected to other face of the heat dissipating plate; and a second heat sink thermally connected to other face of said thermoelectric cooler.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a cooling device for cooling an element to be cooled having a high heat generating density such as semiconductor elements using a thermoelectric cooler (which is also referred to as TEC), for example a Peltier cooler.

[0003] 2. Related Art

[0004] Recently, an electronic appliance includes high power and densely integrated components such as microprocessor therein. Since the microprocessor is densely integrated and processes computing and control at high speed, a large amount of heat is generated. Various cooling systems are proposed to cool chips which are high power and densely integrated components. A heat pipe or Peltier device is represented as one of the typical cooling systems.

[0005] The heat pipe comprises a round pipe shaped heat pipe and a flat shaped heat pipe. The flat heat pipe is favorably applied for cooling a component to be cooled of an electronic device such as a CP...

Claims

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