Resin-sealed-type semiconductor device, and production process for producing such semiconductor device
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[0069]With reference to FIGS. 13 and 14 corresponding to FIGS. 2A and 6, a second embodiment of the resin-sealed type semiconductor device according to the present invention is shown. Note, in FIGS. 13 and 14, the features similar to those of FIGS. 2A and 6 are indicated by the same references.
[0070]As shown in these drawings, the heat spreader 18 has a small thin circular plate element 18D which is disposed at a center thereof, such that the center circular plate element. 14 is placed on the small thin circular plate element 18D. In particular, as best shown in FIG. 14, an apex of each triangular plate section 18A is shaped as an inward-recessed arch such that a circular space is defined by the inward-recessed arches at the center of the heat spreader 18, and the small thin circular plate element 18D is arranged so as to occupy the circular space.
[0071]In this second embodiment, the circular plate element 18D is formed as a separate part made of a suitable metal material, and is ad...
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