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113results about How to "Improve manufacturing productivity" patented technology

Method of forming thin film for improved productivity

There is provided a method of forming a thin film for providing improved fabrication productivity. The method includes introducing a semiconductor substrate into a process chamber. A process thin film is formed on the semiconductor substrate, in which a chamber coating layer is formed on inner walls of the process chamber while the process thin film is formed. The semiconductor substrate is removed from the process chamber. A stress relief layer is formed on the chamber coating layer. After all of the above operations are repeatedly performed at least one time, an in-situ cleaning is performed on the chamber coating layer and the stress relief layer, which are alternately formed in stack on the inner walls of the process chamber.
Owner:SAMSUNG ELECTRONICS CO LTD

Semiconductor sensor

A semiconductor sensor for improving manufacturing productivity. Opposing electrodes, or a diaphragm electrode and a fixed electrode, form an electrostatic capacity sensing semiconductor microphone on a microphone chip. A through electrode is formed on the microphone chip by a conductor extending between the upper and lower surfaces of the semiconductor substrate. The through electrode directly and electrically connects a MEMS configuration formed by the diaphragm electrode to the wiring of a printed wiring board without using wire bonding.
Owner:SANYO ELECTRIC CO LTD

Continuous processing methods for biological products

The present invention is directed to the development of continuous processing technology for the purification of biopharmaceuticals and biological products, such as monoclonal antibodies, protein therapeutics, and vaccines. Methods for continuous processing of a biological product in a feed stream toward formulation of a purified bulk product are described.
Owner:SARTORIUS STEDIM CHROMATOGRAPHY SYST LTD

Semiconductor device with stacked chips and method for manufacturing thereof

A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second semiconductor device adjacent contact pads to a bottom side of the second device. Tower contact bumps are electrically connected to contact pads of the first semiconductor device. The second semiconductor device is arranged adjacent the first semiconductor device so that the tower contact bumps are disposed within the through-holes and are electrically connected with contact pads of the second semiconductor device.
Owner:POLARIS INNOVATIONS LTD

Semiconductor device and manufacturing method for the same, circuit board, and electronic device

To improve the productivity of manufacturing semiconductor devices having a heat sink, the semiconductor device manufacturing method includes: (a) setting an integral heat radiation body set 30 of multiple heat radiation bodies 32 in a mold 40 cavity 42; (b) setting a substrate 10 on which multiple semiconductor chips 20 are mounted in a planar arrangement in the mold 40 so that the multiple semiconductor chips 20 are located inside the cavity 42; and (c) sealing the multiple semiconductor chips 20 and affixing the heat radiation body set 30 by filling the cavity 42 with a sealant.
Owner:SEIKO EPSON CORP

Liquid drop discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter method of manufacture thereof, and device for manufacturing thereof; and device for incorporating backing, method of manufacturing thereof, and device for manufacture thereof

A liquid drop discharge device provides a head unit 420 which discharges filter element material relative to each of various colors of color filters. The head unit 420 is composed of an ink jet heads which are arranged on one end of a print substrate plate having a shape of rectangular card and head devices 433 which are arranged on the other end of the print substrate plate comprising connectors 441. The head devices 433 are aligned in two rows, as two groups, in a staggered arrangement so that a portion on which the connectors 441 are aligned in one of the two rows does not face to the same portion of the other in the two rows and protrudes outside of the print substrate plate. The head unit 420 discharges the filter element material onto predetermined portions in a superimposing manner while shifting along a direction which intersects to a direction along which the head devices 433 are arranged.
Owner:KATEEVA

Display device, method for manufacturing display device, and SOI substrate

A manufacturing method is provided which achieves an SOI substrate with a large area and can improve productivity of manufacture of a display device using the SOI substrate. A plurality of single-crystalline semiconductor layers are bonded to a substrate having an insulating surface, and a circuit including a transistor is formed using the single-crystalline semiconductor layers, so that a display device is manufactured. Single-crystalline semiconductor layers separated from a single-crystalline semiconductor substrate are applied to the plurality of single-crystalline semiconductor layers. Each of the single-crystalline semiconductor layers has a size corresponding to one display panel (panel size).
Owner:SEMICON ENERGY LAB CO LTD

Soldering driving elements in LCD panels

InactiveUS20070157464A1Improve display panel manufacturing productivityReduce potentially harmful exposurePrinted circuit assemblingSemiconductor/solid-state device detailsProduction rateRadial position
An apparatus and method for soldering an LED driving element to an LCD panel includes a panel holding unit, a rotating unit and a soldering unit. The panel holding unit holds the display panel. The rotating unit supports the panel holding unit at initial radial and angular positions relative to a center of rotation of the rotating unit and rotates the holding unit in a horizontal plane about the center of rotation to selected angular positions relative thereto. The soldering unit is disposed above the rotating unit at the initial radial position and at a first angular position relative to initial angular position of the holding unit, and is operable to solder the driving element of the display panel held by the panel holding unit when the rotating unit rotates the panel holding unit to the first angular position. The apparatus and method provide improved display panel productivity.
Owner:SAMSUNG ELECTRONICS CO LTD

Cooling and exhaust system of dual electric oven

A cooling and exhaust system of a dual oven has upper and lower ovens, in which, in one aspect, an installation structure of a cooling fan and an exhaust structure provided for respectively cooling and exhausting the upper and lower ovens may be integrated into a simplified structure having common components to increase the manufacturing productivity. In another aspect, fans provided at the upper and lower ovens may be independently controlled to operate at different speeds according to a desired operation to maximize the cooling efficiency.
Owner:LG ELECTRONICS INC

Cooling and exhaust system of dual electric oven

A cooling and exhaust system of a dual oven has upper and lower ovens, in which, in one aspect, an installation structure of a cooling fan and an exhaust structure provided for respectively cooling and exhausting the upper and lower ovens may be integrated into a simplified structure having common components to increase the manufacturing productivity. In another aspect, fans provided at the upper and lower ovens may be independently controlled to operate at different speeds according to a desired operation to maximize the cooling efficiency.
Owner:LG ELECTRONICS INC

Swing hinge device for portable terminal and portable terminal having the same

A hinge device for a portable terminal includes a first hinge base, a second hinge base, and an elastic member. The first hinge base has a receiving groove on a surface thereof. The second hinge base is rotatably coupled to the first hinge base and has stopper ribs which extend from a surface of the second hinge base and are arranged along a circumferential direction. The elastic member is received in the receiving groove of the first hinge base and presses against an outer peripheral surface of the stopper ribs as the second hinge base rotates with respect to the first hinge base. The hinge device has a reduced number of parts so as to allow easy assembly of the hinge device, thereby improving manufacturing productivity. Further, the structure with the elastic member that presses the stopper rib minimizes the size of the portable terminal and improves the portability of the portable terminal.
Owner:SAMSUNG ELECTRONICS CO LTD

Apparatus for attaching polarizing plate

The apparatus of attaching a polarizing plate includes a base body, a first cutting out module, a first protection sheet strip module and a first polarizing plate attaching module. The first cutting out module cuts out a first polarizing plate from a first mother polarizing plate. The first cutting out module is disposed on the base body. The first protection sheet strip module strips a first protection sheet from the first polarizing plate. The first polarizing plate is stripped off the first protection sheet to be a first stripped polarizing plate. The first protection sheet strip module is disposed on the base body. The first polarizing plate attaching module attaches the first stripped polarizing plate to a first face of a liquid crystal display unit cell of an assembled substrate. The first polarizing plate attaching module is disposed on the base body.
Owner:SAMSUNG DISPLAY CO LTD

Frame assembly for a motorcycle

A motorcycle body frame includes a main frame including a head pipe for supporting a front suspension at the front end thereof, a single leading frame portion extending rearwardly from the head pipe, and a rear frame portion for supporting a rear wheel suspension. The rear frame portion extends substantially downwardly from a rear part of the leading frame portion. The main frame, cast from an aluminum alloy, includes two component parts arranged front-to-rear. For example, a front frame portion is provided, and a rear frame portion is fixed to the rear side of the front frame portion. The leading frame portion has a small section portion, where the main frame is smallest in sectional area, disposed substantially centrally in the longitudinal direction thereof. The two component parts of the frame are joined at a coupling portion of the main frame situated in back of the small section portion.
Owner:HONDA MOTOR CO LTD

Polarizable Electrode Member, Process for Producing the Same, and Electrochemical Capacitor Utilizing the Member

A polarized electrode for use in an electrochemical capacitor, in which electrode includes a current collector made of a metal plain foil, an anchor coat layer formed at least on one of the surfaces of the current collector, and an electrode layer formed on either the anchor coat layer or the current collector. The anchor coat layer contains a conductive carbon and a binder. The conductive carbon is graphitized carbon black. The binder contains at least one selected from the group consisting of an ammonium salt of carboxymethylcellulose, a rubber polymer, polytetrafluoroethylene, polyvinyl alcohol, polyvinyl pyrrolidone, alternating copolymer of isobutylene-maleic anhydride. With this configuration, a polarized electrode can be made thinner, and an electrode layer can be formed directly on the anchor coat layer. Furthermore, it can ensure sufficient coupling strength between the current collector and the electrode layer, and increase the energy density and the power density realizing a reduced resistance.
Owner:PANASONIC CORP

Method and system for manufacturing and servicing a computing product with the assistance of a wireless communication subsystem attached to a peripheral port

InactiveUS6865436B2Improve manufacturing productivityManufacturing process for the computing product is further automatedTotal factory controlSpecial data processing applicationsServices computingEngineering
A wireless access subsystem is first attached to a peripheral port of a computing product. The computing product is further assembled with other components and goes through various testing processes while being tracked and monitored by a manufacturing control server through wireless communications with the wireless access subsystem. The wireless access subsystem has a separate power supplier incorporated therein and operates independently from the computing product.
Owner:DELL PROD LP

Semiconductor device having a gate insulating film structure including an insulating film containing metal, silicon and oxygen and manufacturing method thereof

Claimed and disclosed is a semiconductor device including a transistor having a gate insulating film structure containing nitrogen or fluorine in a compound, such as metal silicate, containing metal, silicon and oxygen, a gate insulating film structure having a laminated structure of an amorphous metal oxide film and metal silicate film, or a gate insulating film structure having a first gate insulating film including an oxide film of a first metal element and a second gate insulating film including a metal silicate film of a second metal element.
Owner:HEAD TECHNOLOGY GMBH LTD +1

Image display device and method using unidirectional beam

An image display device includes an eye wearable lens; a display panel embedded inside the eye wearable lens or arranged on a surface of the eye wearable lens, the display panel comprising an array of a plurality of optical elements for forming an image to be projected onto a retina, wherein a resolution of the image formed by the plurality of optical elements is higher on a central portion of the retina than on a peripheral portion of the retina; and an image signal processor for generating an image signal according to image information which is to be displayed on the display panel and for generating a control signal for controlling each of the plurality of optical elements to be turned on / off according to the image signal.
Owner:SAMSUNG ELECTRONICS CO LTD

Microphone with Integrated Sound Box

ActiveUS20190069060A1Enhance utilization rateEnhance aesthetical appearanceLoudspeakersMicrophone structural associationLoudspeakerMicrophone
A microphone with integrated speaker which includes a front casing with a front connecting portion and a front handle portion having a battery opening; a rear casing with a rear connecting portion and a rear handle portion connected to the front casing to form a first cavity with a cylindrical connecting portion and a cylindrical handle portion with a second cavity; a metallic net cover coupled with the cylindrical connecting portion; a vocal pickup support arrangement provided inside the metallic net cover between the front connecting portion and the rear connecting portion in which a vocal pickup unit is provided; a speaker positioned inside the first cavity; a pair of electrode plates positioned inside the second cavity; a circuit board affixed on the front casing; a battery cover detachably connected to the front handle portion; and an aluminum alloy handle covers the cylindrical handle portion.
Owner:SHENZHEN HUA SIRUI TECH CO LTD
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