54results about How to "Manufacturing process is complicated" patented technology

H plane and E plane of a second rectangular waveguide element are inclined at an angle of 45° with respect to H plane and E plane of a first rectangular waveguide element. A connection element disposed between the first and second rectangular waveguide elements has an inner periphery that surrounds a central axis extending in a direction of electromagnetic-wave propagation. The inner periphery includes surfaces parallel to H plane and E plane of the first rectangular propagation path element, and these surfaces form a staircase such that abutting sections between the surfaces parallel to H plane and the surfaces parallel to E plane constitute projections. The staircase is inclined in a direction corresponding to a direction in which H plane of the second rectangular propagation path element is inclined. Accordingly, an electric field is concentrated in the projections of the connection element, and a plane of polarization of an electromagnetic wave propagating through the connection element is rotated from a plane of polarization in the first rectangular waveguide element towards a plane of polarization in the second rectangular waveguide element.

A touch sensing device including a substrate, a plurality of first sensing series separated from each other and a plurality of second sensing series separated from each other is provided. The substrate has a first surface and a second surface. The first sensing series are disposed on the first surface. Each of the first sensing series includes a plurality of first sensing pads connected to each other. The second sensing series are disposed on the first surface. Each of the second sensing series includes a plurality of second sensing pads distributed between the first sensing series and a plurality of connection lines connecting the second sensing pads. Each of the connection lines extends along an edge of one of the first sensing series, and each of the connection lines is electrically connected to the second sensing pads located at two opposite sides of the first sensing series.

A display capable of inhibiting a logic composition circuit from outputting a signal to a gate line or a drain line at unintentional timing is obtained. This display comprises a shift register circuit including a logic composition circuit portion constituted of a plurality of first conductive type transistors turned on with a first voltage supply source for receiving a first shift signal and a second shift signal and outputting a shift output signal by logically compositing the first shift signal and the second shift signal with each other. At least either a first shift register circuit portion or a second shift register circuit portion includes a reset transistor for resetting the voltage supply source of a node outputting the first shift signal or the second shift signal to a second voltage supply source not turning on the transistors of the logic composition circuit portion in response to a prescribed drive signal.

A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.

A semiconductor device and its manufacturing method are offered to increase the number of semiconductor devices obtained from a semiconductor wafer while simplifying a manufacturing process. After forming a plurality of pad electrodes in a predetermined region on a top surface of a semiconductor substrate, a supporter is bonded to the top surface of the semiconductor substrate through an adhesive layer. Next, an opening is formed in the semiconductor substrate in a region overlapping the predetermined region. A wiring layer electrically connected with each of the pad electrodes is formed in the opening. After that, a stacked layer structure including the semiconductor substrate and the supporter is cut by dicing along a dicing line that is outside the opening.

A display capable of inhibiting a logic composition circuit from outputting a signal to a gate line or a drain line at unintentional timing is obtained. In this display, at least either a first shift register circuit portion or a second shift register circuit portion includes a reset transistor for resetting the voltage supply source of a node outputting a first shift signal or a second shift signal to a second voltage supply source not turning on transistors of a logic composition circuit portion in response to an output signal received from a shift register circuit portion precedent thereto by at least two stages with respect to a scanning direction.

A touch display panel includes a first substrate, a second substrate, a third substrate, a liquid crystal layer disposed between the second and the third substrates, a pixel array disposed between the liquid crystal layer and the third substrate, an opposite electrode, color filter patterns, a first sensing electrode, and a second sensing electrode. The first, the second, and the third substrates are disposed in parallel. The color filter patterns and the opposite electrode that are disposed between the liquid crystal layer and the second substrate are respectively disposed on opposite sides of the second substrate. Some color filter patterns are piled to form touch points. The first sensing electrode on the first substrate faces the second substrate. The second sensing electrode covers the touch points and some color filter patterns. A height of the touch points is less than a gap between the first and the second substrates.

A touch sensing device including a substrate, a plurality of first sensing series separated from each other and a plurality of second sensing series separated from each other is provided. The substrate has a first surface and a second surface. The first sensing series are disposed on the first surface. Each of the first sensing series includes a plurality of first sensing pads connected to each other. The second sensing series are disposed on the first surface. Each of the second sensing series includes a plurality of second sensing pads distributed between the first sensing series and a plurality of connection lines connecting the second sensing pads. Each of the connection lines extends along an edge of one of the first sensing series, and each of the connection lines is electrically connected to the second sensing pads located at two opposite sides of the first sensing series.

A bumper reinforcement includes a front wall, a rear wall, and a connection wall. Intermediate portions, in an extending direction, of the front wall and the rear wall are parallel to each other. An end portion, in the extending direction, of the front wall is bent toward the rear wall when viewed from the intermediate portion of the front wall. An end portion, in the extending direction, of the connection wall includes a front part and a rear part, and each of the front and rear parts extends from an inside to an outside in the vehicle width direction. A distance between a front end of the rear part and the rear wall gradually decreases in a direction from a base end of the rear part toward a distal end thereof. The front part is provided so as to extend along the front end of the rear part.

An imaging device has a sensor chip and a signal processing chip. The sensor chip includes a pixel array in which a plurality of pixels are arranged in a 2-dimensional matrix and a data output terminal group made up of a plurality of data output terminals which output analog signals of pixels for each pixel column of the pixel array. The signal processing chip includes a data input terminal group electrically coupled to the data output terminal group, a plurality of A / D converters which convert analog signals of pixels received by the data input terminal group into digital signals for each pixel column of the pixel array, and a control unit which controls operation of the plurality of A / D converters.