The invention discloses a method for manufacturing a 
metal protective film used for a film circuit test. The method includes the following steps that a 
ceramic substrate plated with a TaN / TiW / Au 
metal film is coated with a layer of 
photoresist, and the 
photoresist on the non-circuitous-pattern part of the 
ceramic substrate plated with the film is removed through a photo-
etching method; a self-
adhesive gold electroplated protective film and a self-
adhesive nickel electroplated protective film are performed on the 
ceramic substrate plated with the film after photo-
etching treatment, and then the 
photoresist is removed; the photo-
etching method is adopted for performing photoresist 
coating to protect a circuitous pattern, and an Au / TiW layer of the non-pattern part is etched; the pattern part and circuitous resistance part of the 
ceramic substrate plated with the film are coated with 
layers of photoresist by the adoption of the photo-etching method, and a 
resistor layer of a non-photoresist-protection part is etched to form circuitous resistors; then, all the photoresist is removed, correction is performed 
on resistance values of the resistors, finally, the 
nickel electroplated protective film is removed through 
corrosion, and a film circuit is obtained. The 
machining steps of the 
nickel layer 
electroplating and nickel layer corroding are added, a gold strip line can be well protected from damage by a 
test probe through the nickel electroplated 
metal protective film, 
machining quality and the finished product rate of the film circuit are improved, and manufacturing cost of the film circuit is reduced.