Copper plating method on brass base material

A substrate and copper plating technology, which is applied in the field of electroplating technology, can solve the problems of poor bonding between the coating and the substrate surface, compactness, poor wear resistance and impact resistance, and high energy consumption.

Inactive Publication Date: 2012-06-13
尼尔金属(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, in order to meet the needs of applications and reduce costs, people usually use copper plating on brass substrates to make brass devices have better mechanical properties, electrical conductivity, etc. However, existing brass substrates The process of copper...

Method used

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Embodiment Construction

[0023] The technical solution of the present invention will be further described below in conjunction with a preferred embodiment.

[0024] The method for copper plating on a brass base material involved in the present embodiment comprises the following steps carried out in sequence:

[0025] (1) degreasing process, including the degreasing and degreasing process carried out in sequence, the first electrolytic degreasing process and the second electrolytic degreasing process, wherein,

[0026] The degreasing and degreasing process is as follows: at a temperature of 30-80°C, after immersing the workpiece composed of a brass base material in a commercially available low-foaming degreasing agent solution with a concentration of 2-140g / L, Wash with tap water three times;

[0027] The first electrolytic degreasing process is as follows: at a temperature of 35-45°C, place the workpiece at a current density of 5-10A / dm 2 1. After immersing in a commercially available electrolytic d...

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Abstract

The invention discloses a copper plating method on a brass base material, comprising the following processes in order: (1) oil removing process which successively contains degreasing and oil-removing process, a first electrolytic degreasing process and a second electrolytic degreasing process; (2) pickling process which successively contains activation and pickling processes; (3) nickel preplating process; (4) nickel plating process; (5) copper plating process; (6) passivation process; and (7) coating processing. The technology provided by the invention is simple. By the adoption of the technology, mass production cost is reduced. The processed product copper coating is compact and tight, is wear resistant and impact resistant, and has good conductivity and ductility. In addition, as the brass base material is used to replace a titanium copper material, the cost and weight of the material are greatly reduced, and shelf-life of the product is long.

Description

technical field [0001] The invention relates to an electroplating process, in particular to a copper plating process on a brass substrate. Background technique [0002] At present, in order to meet the needs of applications and reduce costs, people usually use copper plating on brass substrates to make brass devices have better mechanical properties, electrical conductivity, etc. However, existing brass substrates The process of copper plating on the material is complicated, the energy consumption is large, and the efficiency is low. Especially, the bonding degree of the coating formed by this process and the surface of the substrate is not good, resulting in poor compactness, wear resistance and impact resistance. Contents of the invention [0003] The object of the present invention is to provide a method for plating copper on a brass base material with simple process, low cost and good product performance, so as to overcome the deficiencies in the prior art. [0004] I...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/14C25D5/34
Inventor 陈志强黄振成
Owner 尼尔金属(苏州)有限公司
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