61results about How to "Reliable connector" patented technology

Total wrist prosthesis comprising a radial component with a stem for fixation into the radius, a carpal component with one or more stems for fixation into the capitate and an intermediate bearing component which articulates with the radial component and allows rotational movement of the carpal component relative to the radial component plus hinged movement in two transverse planes. The radial component body may have a concave or convex surface to articulate with a matching surface on the intermediate bearing component. The carpal body may have a projection which is received in a recess in a base surface of the intermediate bearing component, and which has a pair of lugs that are received in an annular groove in the recess for an axially secure connection that allows small relative rotational movement as permitted by tendons and ligaments of the wrist.

A spherical flange assembly is disclosed. The spherical flange assembly comprises a seat member, a heel member, a seal gland and at least one nut and bold assembly. The seat member includes a concave portion. The heel member includes a convex portion and a seal gland opening. The seal gland is disposed within the seal gland opening.

Mechanically formed standoffs in a disk drive integrated circuit interconnect reduces the cost of manufacturing and improves the reliability of the electrical interconnections thereof. Connection pads defined along the interconnect are bonded with bonding pads of a signal producing source and a signal processing source. The standoffs provide mechanical stops during the bonding process, enabling sufficient bonding material to form between bonding areas. The standoffs are mechanically formed with a punch and die assembly either directly through a bonding pad predefined along traces on the interconnect or adjacent the bonding pad. The standoffs formed through the bonding pads are covered with solder or other electrically conductive bonding material.

In a power semiconductor device, a joint between the power semiconductor element and frame plated with Ni is composed of a laminated structure comprising, from the power semiconductor element side, an intermetallic compound layer having a melting point of 260° C. or higher, a Cu layer, a metal layer having a melting point of 260° C. or higher, a Cu layer and an intermetallic layer having a melting point of 260° C. or higher. The structure of the joint buffers the stress generated by the secondary mounting and temperature cycle at the bond for the semiconductor element and the frame having a large difference in thermal expansion coefficient from each other.

A leaf seal for sealing a shaft rotating about an axis, in particular in a gas turbine, includes a plurality of spaced-apart leaves arranged in a concentric circle around the axis and fixed in position by brazing, the leaves having surfaces oriented essentially parallel to the axis. The leaves are brazed to one another via intermediate spacers made of a brazing foil, so that a brazed joint is produced by brazing alloy from the brazing foils. The brazing temperature may be set to an optimum value just above the solidus temperature of the brazing foil, at which partial melting of the brazing foil occurs and penetration of liquid brazing alloy into the gap between the leaves is avoided.

The invention provides a semi-solid brazing method for aluminum alloy and a composite material thereof under the assistance of non-vacuum mechanical stirring, which comprises the steps of: mounting a weldment taking the aluminum alloy or the composite material thereof as a base material on a welding platform first; placing intermediate-temperature solder on two surfaces to be welded, heating the weldment to between 390 and 420 DEG C, and ensuring that the solid fraction of the solder is between 50 and 80 percent; staring a rotary sliding device, wherein the rotating speed is between 150 and 300 r / m, the temperature is constant, and the longitudinal movement rate, which is parallel to a welding seam, of a stirring head is between 0.5 and 2 cm / min; stopping the rotary sliding when the stirring head moves to the terminal of the welding seam; increasing the temperature to between 430 and 450 DEG C, performing thermal insulation for 1 to 5 minutes, and ensuring that the solid fraction of the solder is between 10 and 40 percent; restarting the rotary device again, wherein the rotating speed is between 20 and 150 r / m; sliding the stirring head in a reverse direction, wherein the movementspeed is between 1 and 2 cm / m; stopping the rotation, when the stirring head moves to the initial end of the welding seam, and lifting the stirring head; and cooling the solder along with a furnace after thermal insulation for 5 to 30 minutes. The method can realize the low-cost, high-efficiency and high-quality welding of the aluminum alloy or the composite material thereof.

An improved method is employed to attach an enclosure to a connector body having relatively small geometry. One or more bonding channels are disposed in the outside surface of the connector body. During assembly of an enclosure over the connector body, a bonding material is distributed within the bonding channels and subsequently cured. The bonding channels and the bonding material are designed to employ capillary wicking to aid in the distribution of the bonding material within the bonding channels.

The invention discloses a technique method for filling spot welding stainless steel high-entropy alloy powder and for filling spot welding stainless steel with high-entropy alloy powder. According to the technique method for filling the spot welding stainless steel high-entropy alloy powder and for filling the spot welding stainless steel with the high-entropy alloy powder, the high-entropy alloy powder is mainly composed of AlFeCuCoNiTiCrx, wherein the x is molar ratio of the Al to the Cr and is between 0 to 0.3, and the size of the powder is 100-300 meshes. When high-entropy alloy powder media are used as a filling layer, the contact resistance of a stainless steel material which are different to weld at the early welding stage is improved, resistance heat is used as a welding heat source, partial melting of the surface of the material to be welded is achieved under the protection of protective air and under the action of the resistance heat, an oxidation film can be broken under the impact effect of proper electrode pressure, refining of the high-entropy alloy powder media can be achieved on the interface of the material to be welded, a molten core and a single face-centered cubic tissue are formed on the interface, and then the strength and the corrosion resistance of a connector are improved. The technique method for filling the spot welding stainless steel high-entropy alloy powder and for filling the spot welding stainless steel with the high-entropy alloy powder has the advantages that welding can be achieved under the thermal compensation condition, the flexibility is strong, and ideal engineering significance is achieved.

The invention relates to a sensor and guide wire assembly (21) for intravascular measurements of physiological variables in a living body, comprising a core wire (22), a first coil (23), a jacket (24), and a second coil (25). The jacket (24) comprises a first end portion (24a), which is crimped onto the core wire (22) and over which a portion of the first coil (23) is threaded, and a second end portion (24b), which is crimped onto the core wire (22) and over which a portion of the second coil (25) is threaded.

A method for utilizing plastic deformation resulting from grain boundary sliding with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The method does not require elaborate surface preparation or application techniques. The method also allows for the formation of transparent joints between two subunits of a construct joined via plastic deformation. The method can be used to tailor residual stresses and maintain native porosity.