The invention discloses amide phosphonic acid metal complex, a corresponding composite material and preparation methods thereof. The structure of the complex is as shown in the formula (A), wherein R is H, CH3, C6H5 or CH2=CH-; M is Cu, Co, Ni, Ba or Sr. The amide phosphonic acid metal complex (A) is prepared by using a corresponding amide compound and formaldehyde (or metaformaldehyde) as raw materials, carrying out reaction between the raw materials and H3PO3, and conducting complexing on the reaction product and corresponding metal ions M. The amide phosphonic acid metal complex (A), a high-frequency medium ceramic additive, thermoplastic resin and the like are mixed; pelletization, injection moulding and forming are conducted on the mixture; after high-energy particle irradiation, a metalized rough surface is formed, so as to conveniently realize circuit wiring, and precipitate metal through chemical plating to further obtain a firmly combined fine three-dimensional molding interconnection device or a three-dimensional circuit (3D-MID). Therefore, various antennae of different uses can be integrated to greatly reduce the geometric dimensioning the antennae or an electronic device, ensure the electronic product to be smaller, lighter, thinner and more flexible, greatly simplify the production process, and obviously reduce the cost.