2106 results about "Resistive random-access memory" patented technology

Data may be stored in a non-volatile memory array in adaptive metablocks that are configured according to the locations of data boundaries in the data. Data may be stored in an intermediate format and later copied to adaptive metablocks configured for the data. Data in intermediate format may be stored in non-volatile random access memory or in a portion of the non-volatile memory array.

Provided are memory cells including resistive switching layers having silicon, oxygen, and nitrogen as well as embedded resistor layers having a metal, silicon, and nitrogen. In some embodiments, silicon may be partially or completely replaced with aluminum. The embedded resistor may also have oxygen. A resistive switching layer directly interfaces an embedded resistor layer of the same cell. A portion of each layer forming this interface may be formed substantially of silicon nitride and may be formed in the same deposition chamber without breaking vacuum. For example, these portions may be formed by sequential atomic layer deposition cycles. However, silicon concentrations in these portions may be different. Specifically, the silicon concentration of the embedded resistor portion may be less than the silicon concentration of the resistive switching layer portion. This variation may be achieved by varying one or more process conditions during fabrication of the memory cell.

A memory device including a programmable resistive memory material is described along with methods for manufacturing the memory device. A memory device disclosed herein includes top and bottom electrodes and a multilayer stack disposed between the top and bottom electrodes. The multilayer stack includes a memory element comprising programmable resistive memory material and has a sidewall surface. An air gap is adjacent to the sidewall surface and self-aligned to the memory element.

A resistive random access memory device formed on a semiconductor substrate comprises an interlayer dielectric having a via formed therethrough. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A barrier metal liner lines walls of the via. A conductive plug is formed in the via. A first barrier metal layer is formed over the chemical-mechanical-polishing stop layer and in electrical contact with the conductive plug. A dielectric layer is formed over the first barrier metal layer. An ion source layer is formed over the dielectric layer. A dielectric barrier layer is formed over the ion source layer, and includes a via formed therethrough communicating with the ion source layer. A second barrier metal layer is formed over the dielectric barrier layer and in electrical contact with the ion source layer. A metal interconnect layer is formed over the barrier metal layer.

A re-programmable gate logic includes a plurality of non-volatile re-configurable resistance state-based memory circuits in parallel, wherein the circuits are re-configurable to implement or change a selected gate logic, and the plurality of non-volatile re-configurable resistance state-based memory circuits are each adapted to receive a logical input signal. An evaluation switch in series with the plurality of parallel non-volatile re-configurable resistance state-based memory circuits is configured to provide an output signal based on the programmed states of the memory circuits. A sensor is configured to receive the output signal and provide a logical output signal on the basis of the output signal and a reference signal provided to the sensor. The reconfigurable logic may be implemented based on using spin torque transfer (STT) magnetic tunnel junction (MTJ) magnetoresistance random access memory (MRAM) as the re-programmable memory elements. The logic configuration is retained without power.

This invention provides a method of making nano-scaled toroidal magnetic memory cells, such as may be used, for example, in magnetic random access memory (MRAM). In a particular embodiment a semiconductor wafer substrate is prepared and a conductor layer is provided upon the wafer. A hard layer is deposited upon the first conductor. From the hard layer, ion etching is employed to form an annular wall about a pillar, the wall and pillar defining an annular slot. A ferromagnetic data layer is deposited within the annular slot and a junction stack is then provided upon at least a portion of the data layer. A dielectric is applied to insulate the structure and then planarized to expose the pillar.

Provided are resistive random access memory (ReRAM) cells and methods of fabricating thereof. A stack including a defect source layer, a defect blocking layer, and a defect acceptor layer disposed between the defect source layer and the defect blocking layer may be subjected to annealing. During the annealing, defects are transferred in a controllable manner from the defect source layer to the defect acceptor layer. At the same time, the defects are not transferred into the defect blocking layer thereby creating a lowest concentration zone within the defect acceptor layer. This zone is responsible for resistive switching. The precise control over the size of the zone and the defect concentration within the zone allows substantially improvement of resistive switching characteristics of the ReRAM cell. In some embodiments, the defect source layer includes aluminum oxynitride, the defect blocking layer includes titanium nitride, and the defect acceptor layer includes aluminum oxide.

A resistive random access memory and a method for fabricating the same are provided. The method includes providing a bottom electrode formed on a substrate. A metal oxide layer is formed on the bottom electrode. An oxygen atom gettering layer is formed on the metal oxide layer. A top electrode is formed on the oxygen atom gettering layer. The previous mentioned structure is subjected to a thermal treatment, driving the oxygen atoms of the metal oxide layer to migrate into and react with the oxygen atom gettering layer, thus leaving a plurality of oxygen vacancies of the metal oxide layer.

A novel three-terminal SOT-MRAM memory cell with a unique magnetic stabilization layer or structure is proposed. A complementary magnetic footprint of the data storage layer for the memory cell is able to be created within the magnetic stabilization layer or structure by the magnetic field from the storage layer to enhance the magnetic and thermal stability of the memory cell. Several designs for both perpendicular and in-plane SOT-MRAM memory cell have been invented. With proper wire connection and sensing arrangement, the proposed memory cell is capable of forming not only the 2D array but also 3D array.

The present invention provides a resistance random access memory structure, including a plurality of word lines in a substrate, a plurality of reset lines coupled to the word lines, a dielectric layer on the substrate, a plurality of memory units in the dielectric layer. Each of the memory units includes a bottom electrode, a top electrode and a resistive thin film between the top electrode and the bottom electrode. The top electrodes of the memory units in a same column e coupled to one of the reset lines and a plurality of the bit lines on the memory units. The bottom electrodes of the memory units in a same row are coupled to one of the bit lines. Because the present invention provides reset lines for Type 1R1D RRAM, it can overcome the non-erasable of the conventional Type 1R1D RRAM.

A non-volatile memory device structure. The device structure includes a first electrode, a second electrode, a resistive switching material comprising an amorphous silicon material overlying the first electrode, and a thickness of dielectric material having a thickness ranging from 5 nm to 10 nm disposed between the second electrode and the resistive switching layer. The thickness of dielectric material is configured to electrically breakdown in a region upon application of an electroforming voltage to the second electrode. The electrical breakdown allows for a metal region having a dimension of less than about 10 nm by 10 nm to form in a portion of the resistive switching material.

Variable write and read methods for resistance random access memory (RRAM) are disclosed. The methods include initializing a write sequence and verifying the resistance state of the RRAM cell. If a write pulse is needed, then two or more write pulses are applied through the RRAM cell to write the desired data state to the RRAM cell. Each subsequent write pulse has substantially the same or greater write pulse duration. Subsequent write pulses are applied to the RRAM cell until the RRAM cell is in the desired data state or until a predetermined number of write pulses have been applied to the RRAM cell. A read method is also disclosed where subsequent read pulses are applied through the RRAM cell until the read is successful or until a predetermined number of read pulses have been applied to the RRAM cell.

A semiconductor device includes a substrate extending in a horizontal direction. An active pillar is present on the substrate extending in a vertical direction relative to the horizontal direction of extension of the substrate. A variable resistive pattern is present on the substrate extending in the vertical direction along the active pillar, an electrical resistance of the variable resistive pattern being variable in response to an oxidation or reduction thereof. A gate is present at a sidewall of the active pillar.

Methods and apparatuses for fully defining static random access memory (SRAM) using phase shifting layouts are described. The approach includes identifying that a layout includes SRAM cells and defining phase shifting regions in a mask description to fully define the SRAM cells. The phase conflicts between adjacent phase shifters are resolved by selecting cutting patterns designed for the SRAM shape and functional structure. Additionally, the transistor gates of the SRAM cells can be reduced in size relative to the original SRAM layout design. Thus, an SRAM cell can be lithographically printed with small, consistent critical dimensions including extremely small gate lengths resulting in higher yields and improved performance.

Device structures and methods for fabricating device structures are provided herein. Magnetic random access memory (MRAM) devices described herein may include a film stack comprising a magnetic tunneling junction layer, a dielectric capping layer, an etch stop layer, a conductive hard mask layer, a dielectric hard mask layer, a spin on carbon layer, and an anti-reflective coating layer. The film stack may be etched by one or more selected chemistries to achieve improved film stack sidewall verticality. Memory cells having increasingly uniform and reduced critical dimensions may be fabricated utilizing the methods and devices described herein.

A magnetoresistive element includes a foundation layer, a first magnetic layer on the foundation layer, a tunnel barrier layer on the first magnetic layer, and a second magnetic layer on the tunnel barrier layer. The first magnetic layer is made of a ferromagnetic metal containing one or more elements selected from a first group consisting of Co, Fe, and Ni, and one or more elements selected from a second group consisting of Cu, Ag, Au, Pd, Pt, Ru, Rh, Ir, and Os. The foundation layer is made of a metal containing one or more elements selected from a third group consisting of Al, Ni, Co, Fe, Mn, Cr, and V.

A non-volatile random access memory (NVRAM) is used in a computer system to perform multiple roles in a platform storage hierarchy. The NVRAM is byte-addressable by the processor and can be configured into one or more partitions, with each partition implementing a different tier of the platform storage hierarchy. The NVRAM can be used as mass storage that can be accessed without a storage driver.