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Amide phosphonic acid metal complex, corresponding composite material and preparation methods thereof

A technology of metal complexes and amidophosphonic acid, which is applied in metal material coating technology, liquid chemical plating, coating, etc., can solve the problems of unfavorable promotion of production, and achieve the goal of reducing geometric size, simplifying production process and reducing costs Effect

Inactive Publication Date: 2014-10-01
SICHUAN NORMAL UNIVERSITY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The contents of the above-mentioned literature reports all require strict process control and have high requirements for the equipment used, which is not conducive to the promotion of production

Method used

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  • Amide phosphonic acid metal complex, corresponding composite material and preparation methods thereof
  • Amide phosphonic acid metal complex, corresponding composite material and preparation methods thereof
  • Amide phosphonic acid metal complex, corresponding composite material and preparation methods thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0037] Add 0.1mol of acetamide and 200ml of water into a 500ml three-neck flask with a magnetic stirrer and a reflux condenser, stir and dissolve, then add 0.1mol of NaOH dropwise to adjust the pH of the solution to 10~11, and then add 0.1mol (1.77 g) of paraformaldehyde was stirred at 25°C under normal pressure for 2.5 hours to carry out the methylolation reaction. Then add 0.15mol of phosphorous acid, and stir at 30~35°C for 2.5 hours, the reaction precipitate is washed to neutral with 0.05mol of dilute hydrochloric acid and water, and dried in vacuum to obtain acetamidomethylene dihydroxyphosphonic acid with a yield of 85 %. Then it was dissolved in 150ml of n-amyl alcohol, and then slowly dripped into 50ml of n-amyl alcohol solution containing 0.1mol copper acetate with a constant pressure funnel, and heated to reflux for 0.5 hours to obtain acetamide methylene dihydroxyl with an average particle size of 15 μm. Phosphonic acid copper complex (A) (abbreviated as acetamide...

Embodiment 2

[0039] Add 0.1mol of formamide and 200ml of ethanol to a 500ml three-neck flask with a magnetic stirrer and a reflux condenser, stir and dissolve, then add 0.1mol of NaOH dropwise to adjust the pH of the solution to 10~11, then add 0.1mol Formaldehyde was stirred under normal pressure at 25°C for 1.5 hours to carry out methylolation reaction. Then add 0.15mol of phosphorous acid, and stir at 35~40°C for 1.5 hours, the reaction precipitate is washed to neutral with 0.05mol of dilute hydrochloric acid and water, and dried in vacuum to obtain formamide methylene dihydroxyphosphonic acid with a yield of 75 %. Then dissolve it in 150ml of DMF, slowly drop into 50ml of DMF solution containing 0.1mol copper acetate, heat and reflux for 1 hour to obtain formamide methylene dihydroxyphosphonic acid copper complex (A) with an average particle size of 25 μm (referred to as formamide phosphonate copper complex (A)).

Embodiment 3

[0041] Add 0.1mol of benzamide and 250ml of methanol into a 500ml three-neck flask equipped with a magnetic stirrer and a reflux condenser, stir and dissolve, then add 0.1mol of NaOH dropwise to adjust the pH of the solution to 9~10, then add 0.1 mol of paraformaldehyde (the degree of polymerization n is 8), stirred at 35°C under normal pressure for 1.5 hours to carry out the methylolation reaction. Then add 0.15 mol of phosphorous acid, and stir at 40~45°C for 2.0 hours, wash the reaction precipitate with 0.05 mol of dilute hydrochloric acid and water to neutrality, and dry it in vacuum to obtain benzamide dimethylene dihydroxyphosphonic acid. The rate is 75%. Then it was dissolved in 150ml of isoamyl alcohol, slowly dripped into 50ml of isoamyl alcohol solution containing 0.1mol cobalt acetate, heated to reflux for 1.5 hours to obtain cobalt benzamidomethylene dihydroxyphosphonate with an average particle size of 20 μm Complex (A) (referred to as cobalt benzamide phosphonat...

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Abstract

The invention discloses amide phosphonic acid metal complex, a corresponding composite material and preparation methods thereof. The structure of the complex is as shown in the formula (A), wherein R is H, CH3, C6H5 or CH2=CH-; M is Cu, Co, Ni, Ba or Sr. The amide phosphonic acid metal complex (A) is prepared by using a corresponding amide compound and formaldehyde (or metaformaldehyde) as raw materials, carrying out reaction between the raw materials and H3PO3, and conducting complexing on the reaction product and corresponding metal ions M. The amide phosphonic acid metal complex (A), a high-frequency medium ceramic additive, thermoplastic resin and the like are mixed; pelletization, injection moulding and forming are conducted on the mixture; after high-energy particle irradiation, a metalized rough surface is formed, so as to conveniently realize circuit wiring, and precipitate metal through chemical plating to further obtain a firmly combined fine three-dimensional molding interconnection device or a three-dimensional circuit (3D-MID). Therefore, various antennae of different uses can be integrated to greatly reduce the geometric dimensioning the antennae or an electronic device, ensure the electronic product to be smaller, lighter, thinner and more flexible, greatly simplify the production process, and obviously reduce the cost.

Description

technical field [0001] The invention relates to an amidophosphonic acid metal complex, a corresponding composite material containing the complex, and a preparation method of the complex and the composite material. The composite material can be used to fabricate three-dimensional model interconnect devices (3D-MID). Background technique [0002] With the rapid development of high integration, ultra-miniaturization and high-speed transmission of electronic equipment, microwave communication, microwave devices and microwave networks are rapidly developing in the direction of ultra-small, ultra-light and ultra-thin. Among them, a major progress in the miniaturization of electronic devices is the application of three-dimensional model interconnection technology (3D-MID), which can make the electrical and mechanical properties of devices highly integrated. The process to realize this new technology is called laser direct structuring (LDS). In the 1990s, Professors M.Schumann an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F19/00C08L55/02C08L81/02C08L23/12C08L69/00C08L79/08C08L25/06C08K13/02C08K5/00C08K3/24C08K3/22C23C18/26
Inventor 林云林林林展如
Owner SICHUAN NORMAL UNIVERSITY
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