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1results about How to "Improve brazing quality" patented technology

Sintering type preform solder, its preparation method and application

ActiveCN118989720BAchieve the purpose of brazing connectionhigh activityWelding/cutting media/materialsSoldering mediaAluminium powderCopper oxide
The present application relates to the technical field of brazing, in particular to a sintering type preformed filler metal, a preparation method and application thereof. The sintering type preformed filler metal comprises a magnesium film, aluminum powder, copper oxide powder and nickel powder attached to the same side of the magnesium film, and an aluminum flux attached to the other side of the magnesium film. The present application takes advantage of the low ignition point of magnesium, which is as low as 490 DEG C, to ignite the magnesium film at a lower temperature during brazing, and the heat generated causes the aluminum powder and copper oxide powder to produce an aluminothermic reaction. The high temperature released by the aluminothermic reaction further causes part of the aluminum powder and the nickel powder and the copper generated by the aluminothermic reaction to form intermetallic compounds or solid solutions, thereby achieving the purpose of brazing connection. Therefore, the present application only needs to apply a temperature of about 500 DEG C to the weld to achieve the purpose of brazing aluminum alloy connecting pieces. The present application solves the problem that the other heat-resistant parts are easily damaged by overheating when using aluminum-based filler metal to braze aluminum alloy connecting pieces, and further reduces the brazing temperature under the premise of ensuring the brazing strength.
Owner:SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD