The invention relates to an aluminum
composite material for use in thermal flux-free joining methods, comprising at least one core layer, which consists of an aluminum core
alloy, and at least one outer solder layer, which is provided on one side or both sides of the core layer and which consists of an aluminum
solder alloy. The aim of proposing an aluminum
composite material for use in a thermalflux-free joining method by means of which the
soldering properties can be further optimized both in a vacuum and under
shielding gas without the use of fluxes while avoiding the disadvantages known from the prior art is achieved in that the aluminum
solder alloy has the following composition in wt%: 6.5%<=Si<=13%, Fe<=1%, 90 ppm<=Mg<=300 ppm, Bi<500 ppm, Mn<=0.15%, Cu<=0.3%, Zn<=3%, Ti<=0.3%, theremainder Al and unavoidable impurities of at most 0.05% individually and at most 0.15% in total, and the aluminum solder layer has a surface that has been pickled in an alkaline or acidic manner. The invention further relates to a method for producing an aluminum
composite material, in particular an aluminum composite material according to the invention, wherein at least one core layer consisting of an aluminum core
alloy is provided and at least one outer solder layer consisting of an aluminum
solder alloy is applied to one side or both sides of the core layer. The invention further relatesto a method for thermally joining components and to a thermally joined construction.