1414 results about "N channel" patented technology

A pixel circuit having a function of compensating for characteristic variation of an electro-optical element and threshold voltage variation of a transistor is formed from a reduced number of component elements. The pixel circuit includes an electro-optical element, a holding capacitor, and five N-channel thin film transistors including a sampling transistor, a drive transistor, a switching transistor, and first and second detection transistors. The sampling transistor samples and supplies an input signal from a signal line so as to be held into the holding capacitor. The driving transistor drives the electro-optical element with current in response to the held signal potential. The first and second detection transistors detect a threshold voltage of the drive transistor and supply the detected voltage into the holding capacitor in order to cancel an influence of the threshold voltage in advance.

By providing a highly stressed interlayer dielectric material, the performance of at least one type of transistor may be increased due to an enhanced strain-inducing mechanism. For instance, by providing a highly compressive silicon dioxide of approximately 400 Mega Pascal and more as an interlayer dielectric material, the drive current of the P-channel transistors may be increased by 2% and more while not unduly affecting the performance of the N-channel transistors.

An object is to realize high performance and low power consumption in a semiconductor device having an SOI structure. In addition, another object is to provide a semiconductor device having a high performance semiconductor element which is more highly integrated. A semiconductor device is such that a plurality of n-channel field-effect transistors and p-channel field-effect transistors are stacked with an interlayer insulating layer interposed therebetween over a substrate having an insulating surface. By controlling a distortion caused to a semiconductor layer due to an insulating film having a stress, a plane orientation of the semiconductor layer, and a crystal axis in a channel length direction, difference in mobility between the n-channel field-effect transistor and the p-channel field-effect transistor can be reduced, whereby current driving capabilities and response speeds of the n-channel field-effect transistor and the p-channel field-effect can be comparable.

A wireless wearable high data throughput (big data) brain machine interface apparatus is presented. An implanted recording and transmitting module collects neural data from a plurality of implanted electrodes and wirelessly transmits this over a short distance to a wearable (not implanted) receiving and forwarding module, which communicates the data over a wired communication to a mobile post processing device. The post processing device can send this neural data to an external display or computer enabled device for viewing and/or manipulation. High data throughput is supported by aggregating multiple groups of electrodes by multiple n-channel recording elements, which are multiplexed and then modulated into high frequency wireless communications to the wearable module. Embodiments include use of multiple radiators (multiple polarizations and/or spatially distributed), with beam alignment adjustment.

A pixel circuit, display device, and method of driving a pixel circuit enabling source-follower output with no deterioration of luminance even with a change of the current-voltage characteristic of the light emitting element along with elapse, enabling a source-follower circuit of n-channel transistors, and able to use an n-channel transistor as an EL drive transistor while using current anode-cathode electrodes, wherein a source of a TFT 111 as a drive transistor is connected to an anode of a light emitting element 114, a drain is connected to a power source potential VCC, a capacitor C111 is connected between a gate and source of the TFT 111, and a source potential of the TFT 111 is connected to a fixed potential through a TFT 113 as a switching transistor.

There is provided a crystalline TFT in which reliability comparable to or superior to a MOS transistor can be obtained and excellent characteristics can be obtained in both an on state and an off state. A gate electrode of the crystalline TFT is formed of a laminate structure of a first gate electrode made of a semiconductor material and a second gate electrode made of a metal material. An n-channel TFT includes an LDD region, and a region overlapping with the gate electrode and a region not overlapping with the gate electrode are provided, so that a high electric field in the vicinity of a drain is relieved, and at the same time, an increase of an off current is prevented.

A protection circuit for a boost power converter provides input under-voltage protection and output over-voltage and over-current protection. The protection circuit includes a control power MOSFET connected in series between the ground of the boost power converter and the ground of the load. The arrangement of the circuit makes it easy to drive the gate of an N-channel power MOSFET and is ideal for current-limiting control, which utilizes the Rds-on of the MOSFET as a current sensing element. Neither a specific gate-driver nor a current sensing resistor is required, and thus high efficiency can be achieved. Furthermore, the slow slew-rate at the gate of the MOSFET provides a soft-start to the load. The protection circuit includes a temperature compensation circuitry to offset the variation of the Rds-on. A time delay circuit prevents the switching elements and protection elements from overload damage.

A semiconductor device and method of manufacture provide an n-channel field effect transistor (nFET) having a shallow trench isolation with overhangs that overhang Si-SiO₂ interfaces in a direction parallel to the direction of current flow and in a direction transverse to current flow. The device and method also provide a p-channel field effect transistor (pFET) having a shallow trench isolation with an overhang that overhangs Si-SiO₂ interfaces in a direction transverse to current flow. However, the shallow trench isolation for the pFET is devoid of overhangs, in the direction parallel to the direction of current flow.

A semiconductor memory device comprises an array of memory cells each comprising a variable resistance element and a cell access transistor, and a voltage supplying means for applying the first voltage between the bit and source lines connected to the selected memory cell, the third voltage to the word line to apply the first write voltage between the two ports of the variable resistance element for shifting the resistance from the first state to the second state, and the second voltage opposite in polarity to the first voltage between the bit and source lines, the third voltage to the word line to apply the second write voltage opposite in polarity to and different in the absolute value from the first write voltage between the two ports for shifting the resistance from the second state to the first state, the voltage supplying means comprising an n-channel MOSFET and a p-channel MOSFET.

The present invention provides a semiconductor device including n-channel field effect transistors and p-channel field effect transistors all of which have excellent drain current characteristics.

In a semiconductor device including an n-channel field effect transistor 10 and a p-channel field effect transistor 30, a stress control film 19 covering a gate electrode 15 of the n-channel field effect transistor 10 undergoes film stress mainly composed of tensile stress. A stress control film 39 covering a gate electrode 15 of the p-channel field effect transistor 30 undergoes film stress mainly caused by compression stress compared to the film 19 of the n-channel field effect transistor 10. Accordingly, drain current is expected to be improved in both the n-channel field effect transistor and the p-channel field effect transistor. Consequently, the characteristics can be generally improved.

A non-volatile “reverse memory cell” suitable for use as a building block for a 3-dimensional memory array includes a charge-trapping layer which is programmed or charged through gate-injection, rather than channel-injection. Such a reverse cell may be implemented as either an n-channel memory cell or a p-channel memory cell, without incurring design or process penalties, or any complexity in programming or erase operations. Furthermore, all reading, programming, erase, program-inhibiting operations may be carried out in the reverse memory cell using only positive or only negative voltages, thereby simplifying both the design and the power management operations.

An apparatus for generating a binaural audio signal includes a de-multiplexer and decoder which receives audio data comprising an audio M-channel audio signal which is a downmix of an N-channel audio signal and spatial parameter data for upmixing the M-channel audio signal to the N-channel audio signal. A conversion processor converts spatial parameters of the spatial parameter data into first binaural parameters in response to at least one binaural perceptual transfer function. A matrix processor converts the M-channel audio signal into a first stereo signal in response to the first binaural parameters. A stereo filter generates the binaural audio signal by filtering the first stereo signal. The filter coefficients for the stereo filter are determined in response to the at least one binaural perceptual transfer function by a coefficient processor. The combination of parameter conversion/processing and filtering allows a high quality binaural signal to be generated with low complexity.

An object of the present invention is to improve the reliability and the operation performance of a semiconductor device comprising a driver circuit and a pixel pixel section by optimizing the TFT structure disposed in each circuit in accordance with the function of the circuit. The optimized circuit operation can be obtained by providing a LDD region that overlaps with at least the gate electrode in the driver circuit n-channel TFT, and a LDD region in the pixel section n-channel TFT in which the impurity concentration of the both LDD regions are differed.

The present invention relates to a heterojunction tunneling effect transistor (TFET), which comprises spaced apart source and drain regions with a channel region located therebetween and a gate stack located over the channel region. The drain region comprises a first semiconductor material and is doped with a first dopant species of a first conductivity type. The source region comprises a second, different semiconductor material and is doped with a second dopant species of a second, different conductivity type. The gate stack comprises at least a gate dielectric and a gate conductor. When the heterojunction TFET is an n-channel TFET, the drain region comprises n-doped silicon, while the source region comprises p-doped silicon germanium. When the heterojunction TFET is a p-channel TFET, the drain region comprises p-doped silicon, while the source region comprises n-doped silicon carbide.

A semiconductor integrated circuit device contains a CMOS circuit that includes a plurality of N-channel transistors and a plurality of P-channel transistors. The plurality of N-channel transistors is provided with device isolation by one of a gate isolation structure and a shallow trench isolation structure. The plurality of P-channel transistors are provided with device isolation by the other of the gate isolation structure and the shallow trench isolation structure.

The active layer of an n-channel TFT is formed with a channel forming region, a first impurity region, a second impurity region and a third impurity region. In this case, the concentration of the impurities in each of the impurity regions is made higher as the region is remote from the channel forming region. Further, the first impurity region is disposed so as to overlap a side wall, and the side wall is caused to function as an electrode to thereby attain a substantial gate overlap structure. By adopting the structure, a semiconductor device of high reliability can be manufactured.

A complementary SCR-based structure enables a tunable holding voltage for robust and versatile ESD protection. The structure are n-channel high-holding-voltage low-voltage-trigger silicon controller rectifier (N-HHLVTSCR) device and p-channel high-holding-voltage low-voltage-trigger silicon controller rectifier (P-HHLVTSCR) device. The regions of the N-HHLVTSCR and P-HHLVTSCR devices are formed during normal processing steps in a CMOS or BICMOS process. The spacing and dimensions of the doped regions of N-HHLVTSCR and P-HHLVTSCR devices are used to produce the desired characteristics. The tunable HHLVTSCRs makes possible the use of this protection circuit in a broad range of ESD applications including protecting integrated circuits where the I/O signal swing can be either within the range of the bias of the internal circuit or below/above the range of the bias of the internal circuit.

An audio spatial environment engine is provided for converting from an N channel audio system to an M channel audio system, such as in a dynamic down-mixer where N and M are integers and N is greater than M. The dynamic down-mix methodology consists of a static down-mix system utilizing an intelligent analysis and correction loop. The original N-channel audio signals are provided to a static down-mix process which produces a down-mixed M-channel audio signal. That M-channel audio signal is provided to an up-mix process which generates a subsequent N-channel audio signal. Any spectral, temporal, or spatial inaccuracies between the original N-channel audio and the subsequent up-mixed N-channel audio are then identified and corrected in the down-mixed M-channel audio signal over a plurality of frequency bands generating the final down-mixed M-channel audio signal. The corrections performed on the down-mixed M-channel audio signal consist of modifications to the relevant inter-channel spatial cues such as inter-channel level difference (ICLD) and inter-channel coherence (ICC) per frequency band.

The invention provides a Ka-band tilt-structure active phased array antenna, so as to provide an active phased array antenna which is high in integration density and can improve maintainability and interchangeability. According to the technical scheme, one path of RF signals transmitted by a transmitting signal processing terminal are transmitted to a power distribution/synthesis network (5) via a signal interface and a radio frequency interface to be divided into M paths of signals; according to information of an azimuth angle and a pitch angle of the phased array antenna provided by the transmitting signal processing terminal in real time, a beam controller (4) calculates and obtains beam pointing of the phased array antenna in real time through an FPGA; the beam pointing of the phased array antenna is converted into phase data needed by each array element under control of the beam controller (4); the data are transmitted to tilt-type TR assembly sub array modules in N channels respectively via a high and low-frequency interconnected multi-core high and low-frequency socket, and under control of the beam controller, M*N paths of signals are transmitted to an antenna array, and thus signal transmission is completed, and synchronous electric control scanning of beams transmitted by the phased array antenna is realized.

A pseudo-emitter-coupled-logic (PECL) receiver has a wide common-mode range. Two current-mirror CMOS differential amplifiers are used. One amplifier has n-channel differential transistors and a p-channel current mirror, while the second amplifier has p-channel differential transistors and an n-channel current mirror. When the input voltages approach power or ground, one type of differential transistor continues to operate even when the other type shuts off. The outputs of the two amplifiers are connected together and each amplifier receives the same differential input signals. The tail-current transistor is self-biased using the current-mirror's gate-bias. This self biasing of each amplifier eliminates the need for an additional voltage reference and allows each amplifier to adjust its biasing over a wide input-voltage range. Thus the common-mode input range is extended using self biasing and complementary amplifiers. The complementary self-biased comparators can be used for receiving binary or multi-level-transition (MLT) inputs by selecting different voltage references for threshold comparison. Using the same reference on both differential inputs eliminates a second reference for multi-level inputs having three levels. Thus binary and MLT inputs can be detected and decoded by the same decoder.

A complementary metal-oxide-semiconductor static random access memory cell that is formed by a pair of P-channel multiple-gate field-effect transistors (P-MGFETs), a pair of N-channel multiple-gate field-effect transistors (N-MGFETs), a second pair of N-MGFETs that has a drain respectively connected to a connection linking the respective drain of the N-MGFET of the first pair of N-MGFET to the drain of the P-MGFET of the pair of P-MGFETs; a pair of complementary bit lines, each respectively connected to the source of the N-MGFET of the second pair of N-MGFETS; and a word line connected to the gates of the N-MGFETs of the second pair of N-MGFETs.

A method for forming and the structure of a strained vertical channel of a field effect transistor, a field effect transistor and CMOS circuitry is described incorporating a drain, body and source region on a sidewall of a vertical single crystal semiconductor structure wherein a heterojunction is formed between the source and body of the transistor, wherein the source region and channel are independently lattice strained with respect to the body region and wherein the drain region contains a carbon doped region to prevent the diffusion of dopants (boron) into the body. The invention reduces the problem of leakage current from the source region via the heterojunction and lattice strain while independently permitting lattice strain in the channel region for increased mobility via choice of the semiconductor materials.

An object of the present invention is to provide an electrooptical device having high operation performance and reliability, and a method of manufacturing the electrooptical device.

Lov region 207 is disposed in n-channel TFT 302 that comprises a driver circuit, and a TFT structure which is resistant to hot carriers is realized. Loff regions 217 to 220 are disposed in n-channel TFT 304 that comprises a pixel section, and a TFT structure of low off current is realized. An input-output signal wiring 305 and gate wiring 306 are formed by laminating a first wiring and a second wiring having lower resistivity than the first wiring, and wiring resistivity is steeply reduced.

A finFET block architecture includes a first set of semiconductor fins having a first conductivity type, and a second set of semiconductor fins having a second conductivity type. An inter-block insulator is placed between outer fins of the first and second sets. A patterned gate conductor layer includes a first plurality of gate traces extending across the set of fins in the first block without crossing the inter-block insulator, and a second plurality of gate traces extending across the set of fins in the second block without crossing the inter-block insulator. Patterned conductor layers over the gate conductor layer are arranged in orthogonal layout patterns, and include an inter-block connector arranged to connect gate traces in the first and second blocks.

A semiconductor technology combines a normally off n-channel channel-junction insulated-gate field-effect transistor (“IGFET”) (104) and an n-channel surface-channel IGFET (100 or 160) to reduce low-frequency 1/f noise. The channel-junction IGFET is normally of materially greater gate dielectric thickness than the surface-channel IGFET so as to operate across a greater voltage range than the surface-channel IGFET. Alternatively or additionally, the channel-junction IGFET may conduct current through a field-induced surface channel. A p-channel surface-channel IGFET (102 or 162), which is typically of approximately the same gate-dielectric thickness as the n-channel surface-channel IGFET, is preferably combined with the two n-channel IGFETs to produce a complementary-IGFET structure. A further p-channel IGFET (106, 180, 184, or 192), which is typically of approximately the same gate dielectric thickness as the n-channel channel-junction IGFET, is also preferably included. The further p-channel IGFET can be a surface-channel or channel-junction device.

A series of gate drive circuits for MESFETs are provided. The gate drive circuits are intended to be used in switching regulators where at least one switching device is an N-channel MESFET. For regulators of this type, the gate drive circuits provide gate drive at the correct voltage to ensure that MESFETs are neither under driven (resulting in incorrect circuit operation) nor over driven (resulting in MESFET damage or excess current or power loss).

An N-channel device (40, 60) is described having a lightly doped substrate (42, 42′) in which adjacent or spaced-apart P (46, 46′) and N (44) wells are provided. A lateral isolation wall (76) surrounds at least a portion of the substrate (42, 42′) and is spaced apart from the wells (46, 46′, 44). A first gate (G1) (56) overlies the P (46) well or the substrate (42′) between the wells (46′, 44) or partly both. A second gate (G2) (66), spaced apart from G1 (56), overlies the N-well (44). A body contact (74) to the substrate (42, 42′) is spaced apart from the isolation wall (76) by a first distance (745) within the space charge region of the substrate (42, 42′) to isolation wall (76) PN junction. When the body contact (74) is connected to G2 (66), a predetermined static bias Vg2 is provided to G2 (66) depending upon the isolation wall bias (Vbias) and the first distance (745). The resulting device (40, 60) operates at higher voltage with lower Rdson and less HCI.

A semiconductor device having a metal insulator semiconductor field effect transistor (MISFET) with increased electron mobility and enhanced hole mobility is disclosed. In this semiconductor device, a p-type well layer and an n-type well layer are formed in a surface portion of a silicon substrate. A nitrogen-nondoped n-channel interface layer and a nitrogen-free n-channel high dielectric constant gate insulation film plus an n-channel gate electrode are formed in an n-channel MISFET as partitioned by an element isolation region. And, n-type source/drain diffusion layers are provided. In a p-channel MISFET, a nitrogen-doped p-channel interface layer, a nitrogen-added p-channel high dielectric gate insulation film and a p-channel gate electrode are formed along with p-channel source/drain diffusion layers as provided therein. A method of fabricating this semiconductor device is also disclosed.

Data center interconnections, which encompass WSCs as well as traditional data centers, have become both a bottleneck and a cost/power issue for cloud computing providers, cloud service providers and the users of the cloud generally. Fiber optic technologies already play critical roles in data center operations and will increasingly in the future. The goal is to move data as fast as possible with the lowest latency with the lowest cost and the smallest space consumption on the server blade and throughout the network. Accordingly, it would be beneficial for new fiber optic interconnection architectures to address the traditional hierarchal time-division multiplexed (TDM) routing and interconnection and provide reduced latency, increased flexibility, lower cost, lower power consumption, and provide interconnections exploiting N×M×D Gbps photonic interconnects wherein N channels are provided each carrying M wavelength division signals at D Gbps.

A semiconductor device comprises n-type and p-type semiconductor devices formed on the substrate, the n-type device including an n-channel region formed on the substrate, n-type source and drain regions formed opposite to each other interposing the n-channel region therebetween, a first gate insulator formed on the n-channel region, and a first gate electrode formed on the first gate insulator and including a compound of a metal M and a first group-IV elements Si_1−a Ge_a (0≦a≦1), the p-type device including a p-channel region formed on the substrate, p-type source and drain regions formed opposite to each other interposing the p-channel region therebetween, a second gate insulator formed on the p-channel region, and a second gate electrode formed on the second gate insulator, and including a compound of the metal M and a second group-IV element Si_1−c Ge_c (0≦c≦1, a≠c).