Prepreg having nonsymmetrical resin layer thickness and application thereof

A technology of resin layer thickness and prepreg, which is applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., and can solve problems such as base material white spots and single-panel warping

Active Publication Date: 2010-03-10
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a prepreg with an asymmetric resin layer thickness, which can improve or solve some structural problems of copper clad laminates and printed circuit boards, such as substrate white spots, single-sided board warpage, etc.;

Method used

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  • Prepreg having nonsymmetrical resin layer thickness and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Use ordinary 2116 glass fiber cloth, impregnate FR-4 resin composition, and use subtractive method to produce 2116 prepreg with asymmetric resin layer thickness with a total resin content of 48%. The prepreg with asymmetric resin layer thickness has a resin layer on one side The thickness is 15-18um (side A), and the thickness of the resin layer on the other side is 3-5um (side B). Two sheets are combined, and the copper clad laminates with a thickness of 0.10mm are laminated with the side A facing the rough surface of the copper foil. According to slice analysis, the resin content of the traditional 2 sheets of RC48% reinforcing material layer in contact with the copper foil is less than 5um, and white spots on the base material are prone to appear; while the prepreg with asymmetric resin layer thickness using this special structure has the same total resin content, In the case of the same thickness of the substrate, the problem of white spots on the substrate of the co...

Embodiment 2

[0034] Use ordinary 2116 glass fiber cloth, impregnate FR-4 resin composition, and use the subtractive method to produce 2116 prepreg with asymmetric resin layer thickness with a total resin content of 50%, and the thickness of the resin layer on one side of the prepreg with asymmetric resin layer thickness 18-20um (side A), the thickness of the resin layer on the other side is 5-8um (side B), face the A side with high resin content of the resin layer to the side with copper foil in the inner layer of the printed circuit board, and then press. After slice analysis, the use of this special structure of prepreg can solve the problem of white spots on the substrate and browning white spots on the inner layer of the PCB.

Embodiment 3

[0035] Example 3: Use this special structure prepreg to improve the problem of insufficient glue filling

[0036] Using 1080 glass fiber cloth, impregnated with a high Tg resin composition, a 1080 prepreg with an asymmetric resin layer thickness with a total resin content of 68% is produced, and the resin layer thickness difference between the two sides of the prepreg with an asymmetric resin layer thickness is 15um. The side with high resin content of the resin layer is facing the side with copper foil in the inner layer of the printed circuit board, and then pressed.

[0037] 1. Improve the glue filling problem of thick copper in the inner layer

[0038]With the continuous development of printed circuit board technology, in some specific fields, more and more thick copper (≥2OZ) is used as the inner layer structure. The defect often encountered in the production process of this structure is insufficient glue filling, which is manifested as lack of glue in the copper-free ar...

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PUM

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Abstract

The invention relates to a prepreg having nonsymmetrical resin layer thickness and an application thereof. The prepreg having nonsymmetrical resin layer thickness comprises a reinforced material layer, a first resin layer and a second resin layer; the first resin layer and the second resin layer are respectively arranged at two opposite sides of the reinforced material layer; and the resin contentof the first resin layer and the second resin layer are different. The prepreg having nonsymmetrical resin layer thickness has different resin content of the resin layers at both sides of the reinforced material layer, and the thickness of the resin layers at both sides after plate pressing has a difference of 10-25 mu m; the invention adopts a subtractive process making technology, so that the problems that the copper clad laminate substrates have white spots, camber of single-sided plate and the like can be improved or solved under the condition of changing or not changing the thickness ofthe traditional prepreg substrate; the invention is applied to the field of printed circuit boards, can improve the defects of white spots of the substrates, resin filling of thick copper areas, resinfilling of high density interconnected circuit boards, line-to-line CAF and the like under the condition of certain thickness of a medium layer, so that the printed circuit boards reach the expectedrequirements of electric reliability, mechanical reliability, thermostabilization and the like.

Description

technical field [0001] The invention relates to the fields of copper clad laminates and printed circuit boards, in particular to a prepreg with an asymmetric resin layer thickness and its application. Background technique [0002] Prepreg (B-Stage) is an indispensable semi-finished product for copper clad laminate (Copperclad laminate) and multilayer printed circuit board (Multilayer printed circuit board) in the industry. Its main composition is made of reinforcing materials, including glass fiber Cloth (Glassfabric), non-woven (non-woven Glass fabric) or wood pulp paper, etc., are semi-cured at a certain temperature by impregnating liquid resin. In traditional prepregs, the resin content on both sides of the reinforcing material is basically equal (the thickness difference between the resin layers on both sides is generally within 5um, and the maximum difference will not exceed 10um). . [0003] With the continuous development of "thin, light, and miniaturized" electroni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/12B32B27/10B32B15/08B32B15/20H05K1/03
Inventor 马栋杰黄伟壮
Owner GUANGDONG SHENGYI SCI TECH
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