Dipping method, dipping piece and laminating plate
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG SHENGYI SCI TECH
- Publication Date
- 2015-12-16
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of copper-clad laminates, in particular to a method for impregnating reinforcing materials for copper-clad laminates, a dipping sheet prepared by the method, and a laminate containing the dipping sheet. Background technique
[0002] Traditional composite impregnated sheet preparation processes include wet and dry methods. in, figure 1 It is a structural schematic diagram of a dipping tank in the prior art, such as figure 1 As shown, the wet process includes: first, the reinforcing material 100 enters the glue tank 200, and passes through the rollers 300 in the glue tank 200 in turn, and after passing through the clamping shaft 400, it is dried in an oven to form a semi-cured composite material impregnated piece. According to the wet process, the glue content of the composite impregnated sheet can be adjusted by the concentration of the glue, the speed of the reinforcing material, the tension, the distance...