Dipping method, dipping piece and laminating plate

Abstract

The invention discloses a dipping method. The method includes the steps of S10, conducting presoaking, wherein reinforcing materials and glue are provided, the glue comprises resin composite and solvent, and the reinforcing materials are presoaked in glue; S20, conducting pre-drying, wherein the presoaked composite is pre-dried, the drying temperature is controlled between 110 DEG C and 170 DEG C, solvent is dried away, resin is attached to the reinforcing materials to form the composite, and the proportion of volatile matter in the pre-dried composite is controlled between 0.25% and 3%. By strictly controlling the pre-drying temperature and controlling the content of volatile matter in the pre-dried composite between 0.25% and 3%, the reliability of a prepared dipping piece and a corresponding laminating plate is well kept, and good industrial application prospects are achieved.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a method for impregnating reinforcing materials for copper-clad laminates, a dipping sheet prepared by the method, and a laminate containing the dipping sheet. Background technique [0002] Traditional composite impregnated sheet preparation processes include wet and dry methods. in, figure 1 It is a structural schematic diagram of a dipping tank in the prior art, such as figure 1 As shown, the wet process includes: first, the reinforcing material 100 enters the glue tank 200, and passes through the rollers 300 in the glue tank 200 in turn, and after passing through the clamping shaft 400, it is dried in an oven to form a semi-cured composite material impregnated piece. According to the wet process, the glue content of the composite impregnated sheet can be adjusted by the concentration of the glue, the speed of the reinforcing material, the tension, the distance...

AI Technical Summary

Problems solved by technology

[0003] In the actual production process, the applicant found the following problems through continuous and in-depth research on the one-time dipping process: 1. Due to the high fluidity of the glue before drying, with the increase of the amount of glue dipped in the reinforcing material Larger, will cause the uneven distribution of the impregnating glue to increase, and the surface smoothness will deteriorate, which will affect the manufacturing quality of the impregnated sheet, making its limit resin content lower, which cannot meet the needs of the current production of medium-thick copper in printed circuit boards. Requirements for glue filling process; 2. With the development of light, thin, short and small electronic components, the reinforcement material for copper clad laminates is also facing a thinner trend, that is, thinner reinforcement materials must be used. The thinner the material, the lower its strength

When such impregnated sheet is laminated and pressed into a board, especially a board with a single reinforcement material as an insulating layer, it is easy to cause the board to warp due to the difference in curing shrinkage stress of the resin layers on both sides.

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