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Synergistic filler compositions and low density sheet molding compounds therefrom

A sheet mold, composition technology, applied in the direction of nanotechnology, nanotechnology, nanotechnology, etc. for materials and surface science, capable of solving the low strength of the molded product, the difficulty of A-level SQ, and the use of nanocomposite materials is not taught and other problems, to achieve the effect of reducing the molding pressure and temperature, and reducing the cost.

Inactive Publication Date: 2008-07-02
ASHLAND LICENSING & INTPROP LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this patent does not teach or suggest the use of nanocomposites in SMCs
The problem with the SMC disclosed in the 5,585,439 patent is that when LPA's are used alone, without a large amount of fillers (such as calcium carbonate and kaolin), the resulting moldings have micro and macro voids, which lead to molding strength very low
[0013] However, maintaining a Class A SQ becomes difficult when densities decrease

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

300

[0066] Measured with a Laser Optical Reflectance Image Analyzer (LORIA), Surface Quality (SQ) is determined by three measurements—Ashland Index (AI), Distinctness of Image (DOI), and Orange Peel (OP). SMC with a grade A SQ is generally defined as Al<80, DOI≥70 (value range 0-100), and OP≥7.0 (value range 0-10). A preferred surface quality determination method is disclosed by Hupp (US 4,853,777), the entire contents of which are specifically incorporated by reference.

[0067] In addition to SQ, the mechanical properties of the SMCs of the present invention were also measured. Tensile strength is measured by stretching the sample in an Instron apparatus as is conventional in the art. The slope of the stress-strain curve generated by measuring the tensile strength was taken as the tensile modulus. Flexural strength is routinely measured using an Instron instrument. Flexural modulus is the slope of the stress-strain curve. Toughness is the area under the usual...

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PUM

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Abstract

The present disclosure relates generally to resin formulations for sheet molding compounds. Particularly, but not by way of limitation, the disclosure relates to low-density thermosetting sheet molding compounds (SMC) comprising a treated inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low-density filler, and substantially the absence of calcium carbonate. The thermosetting SMC are used to prepare exterior and structural thermoset articles, e.g. auto parts and panels, etc that have class A surface quality.

Description

technical field [0001] The present invention relates primarily to resin formulations for sheet molding compounds. In particular and without limitation, the present invention relates to low density thermosetting sheet molding compounds (SMC) comprising organically modified clays, inorganic clays, thermosetting resins, low profile agents, reinforcing agents, low density fillers, And basically free of calcium carbonate. The thermoset SMC is used to prepare exterior and structural thermoset articles such as automotive parts, panels, etc., with Class A Surface Quality. Background technique [0002] The information given below is not established prior art to the present invention, but is given only to aid the reader's understanding. [0003] The transportation industry has widely adopted standardized composite parts formed from sheet molding compounds (SMC). Sheet molding compounds comprising unsaturated polyester fiberglass reinforced plastics (FRP) are widely used in exterior...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/34C08K9/04
CPCC08K9/04C08K3/34C08L101/00C08K3/00B82Y30/00
Inventor H·特瓦尔多斯卡-巴克斯特M·J·萨姆纳尔D·H·费希尔
Owner ASHLAND LICENSING & INTPROP LLC
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