45results about How to "Low filler content" patented technology

A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.

The embodiment of the invention provides modified conductive paste and a preparation method and application thereof, and relates to the field of conductive paste. The modified conductive paste comprises the following raw materials in percentage by mass: 1%-90% of carbon-based conductive paste, 5%-60% of carbon nanotubes and 5%-50% of hyperbranched polyethylene, wherein a three-dimensional conductive network is formed among the carbon-based conductive paste, the carbon nanotubes and the hyperbranched polyethylene. The preparation method of the modified conductive paste mainly comprises the following steps: mixing carbon-based conductive paste with an organic solvent to form a first solution; mixing carbon nanotubes, hyperbranched polyethylene and an organic solvent, and uniformly dispersingthe carbon nanotubes to form a second solution; and uniformly mixing the first solution and the second solution, and removing the organic solvent. The modified conductive paste is high in conductivity and low in cost, and can be made into wires; and the preparation conditions are mild, the process is simple, efficient and environment-friendly.

The invention discloses a preparation method of carbon fiber felt / silver nanowire / polyvinylidene fluoride composite material. Ethylene particles are dissolved in N,N-dimethylformamide and subjected to water bath reaction to obtain polyvinylidene fluoride / N,N-dimethylformamide solution; then the flexible carbon fiber felt is soaked in silver nanowire / ethylpropanol solution , placed in a Petri dish with a Teflon film, dried, repeated nine times, then soaked in a polyvinylidene fluoride / N,N-dimethylformamide solution, placed in a Teflon-covered Petri dish The membrane was placed in a petri dish and dried to obtain a carbon fiber felt / silver nanowire / PVDF composite material. The method of the invention not only has the advantages of simple process and high safety, and can meet the application requirements of various electronic products, but also realizes low filler content, large shielding layer thickness and high electromagnetic shielding performance.

The invention discloses a heat conduction and electricity insulation composite material and a preparation method thereof. The composite material is composed of 100 parts of polyethersulfone resin powder, 25-40 parts of a heat conduction and electricity insulation filler and 1-5 parts of a processing assistant; the structure of the polyethersulfone resin is shown in the specification, x in the structure is 1-3, and y in the structure is 1-3; the degree of crystallization of the polyethersulfone resin is 20-40%; and the molecular weight of the polyethersulfone resin is 5000-100000. The polyethersulfone resin with a certain degree of crystallization is adopted as the matrix of the composite material, a modified inorganic filler is adopted as a composite heat conduction filler, and a filler-filler and filler-polymer crystal-filler heat conduction network is formed between the crystal matrix and the modified inorganic filler, so the heat conduction coefficient of the composite material is obviously improved.