A high thermal conductivity aluminum-based copper clad laminate

An aluminum-based copper-clad laminate with high thermal conductivity technology, which is applied in lamination devices, lamination, and layered products, etc., can solve the problem of poor bonding performance between the thermally conductive adhesive layer and copper foil and aluminum plate, dip soldering resistance and voltage resistance. and other problems, to reduce the existence of defects, improve the resistance to dip soldering and voltage resistance, and shorten the heat conduction path

Active Publication Date: 2016-09-07
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A high amount of filler will make the bonding performance between the thermally conductive adhesive layer and the copper foil and aluminum plate worse, and the dip soldering resistance and voltage resistance performance will be reduced

Method used

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  • A high thermal conductivity aluminum-based copper clad laminate
  • A high thermal conductivity aluminum-based copper clad laminate
  • A high thermal conductivity aluminum-based copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Coat the first layer of glue and the third layer of glue on the rough surface of the copper foil and the aluminum plate. The coating thickness of the first layer of glue and the third layer of glue are both 7 μm. Imide resin, no filler, the main components of the third layer of glue are polyimide resin and alumina filler, wherein the filler content is 20wt%, the particle size D50 is 1 μm, and D100 is 2 μm. The second layer of glue Coating on the rough surface of copper foil coated with the first layer of glue or aluminum plate coated with the third layer of glue, the thickness of the second layer of glue coating is 45μm, and the main component of the second layer of glue is polyimide Resin and alumina filler, the filler content is 70wt%, the particle size D50 is 5 μm, and the D100 is 10 μm. The solvent was evaporated at 170°C, according to figure 2 As shown, it is stacked and laminated at 350°C to obtain a high thermal conductivity aluminum-based copper clad laminate....

Embodiment 2

[0033]Coat the first layer of glue and the third layer of glue on the rough surface of the copper foil and the aluminum plate. Glue, the main components of the glue are bisphenol A epoxy resin, dicyandiamide and alumina filler, the filler content is 40wt%, the particle size D50 is 2μm, and the D100 is 6μm. The second layer of glue is coated on the The rough surface of the copper foil of the first layer of glue or the aluminum plate coated with the third layer of glue, the coating thickness of the second layer of glue is 90 μm, and the main components of the glue of the second layer of glue are biphenyl epoxy resin, rubber modified permanent epoxy resin, aromatic amine curing agent and spherical alumina filler, the filler content is 90wt%, the particle size D50 is 25 μm, and the D100 is 60 μm. The solvent was evaporated at 120°C, according to figure 2 As shown, it is stacked and laminated at 190°C to obtain a high thermal conductivity aluminum-based copper clad laminate.

Embodiment 3

[0035] Coat the first layer of glue and the third layer of glue on the rough surface of the copper foil and the aluminum plate. Glue, the main components of the glue are biphenyl epoxy resin, phenolic resin, aromatic amine curing agent and alumina filler, the filler content is 70wt%, the particle size D50 is 4μm, D100 is 10μm, the second One layer of glue is coated on the rough surface of copper foil coated with the first layer of glue or the aluminum plate coated with the third layer of glue. The thickness of the second layer of glue is 80 μm, and the main component of the second layer of glue is biphenyl Epoxy resin, bisphenol A benzoxazine resin, phenoxy resin, aromatic amine curing agent and alumina filler, the filler content is 90wt%, the particle size D50 is 10 μm, and the D100 is 35 μm. The solvent was evaporated at 150°C, according to figure 2 As shown, it is stacked and laminated at 230°C to obtain a high thermal conductivity aluminum-based copper clad laminate.

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Abstract

The invention relates to a highly thermal-conductive aluminum-based copper-clad plate. Three layers of glue are arranged between a copper foil and an aluminum plate, namely a copper foil, a first layer of glue, a second layer of glue, a third layer of glue and the aluminum plate are arranged, wherein the content of a filler in the second layer of glue is greater than that of a filler in the first layer of glue or the third layer of glue; the grain size of the filler in the second layer of glue is greater than that of the filler in the first layer of glue or the third layer of glue. The three layers of glue are skillfully combined together; the advantages of the three layers of glue are fully displayed; the aluminum-based copper-clad plate manufactured by using the method not only has ultrahigh thermal conductivity but also has high peeling strength and excellent thermal stress and voltage resistance.

Description

technical field [0001] The invention relates to a copper-clad laminate, in particular to an aluminum-based copper-clad laminate with high thermal conductivity. Background technique [0002] With the development of high-density and "light, thin, short, and small" electronic products, more and more components are mounted on the circuit board, the degree of integration is getting higher and higher, and the heat emitted per unit area is getting higher and higher during operation. In order to ensure the stability and reliability of electronic components, the heat dissipation requirements for electronic circuit substrates are getting higher and higher. The thermal conductivity of traditional FR-4 copper clad laminates is only 0.18-0.25W / m·K, which cannot meet the requirements of high heat dissipation. Aluminum-based copper-clad laminates are widely used because of their excellent heat dissipation performance. High thermal conductivity aluminum substrate is composed of copper foi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/01B32B15/20B32B7/12B32B37/06B32B37/10B32B37/12
Inventor 雷爱华黄增彪
Owner GUANGDONG SHENGYI SCI TECH
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