57results about How to "Shorten the heat conduction path" patented technology

The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.

The invention relates to a loop heat tube condenser applicable to arrangement in a circular ring-shaped chamber body. The condenser comprises a plurality of condensing tube components, circular arc-shaped steam headers and circular arc-shaped liquid headers; each condensing tube component comprises n condensing tubes, one straight steam header and one straight liquid header; the n condensing tubes are equal in length and are arranged in parallel; the straight steam headers communicate with one end of each of the n condensing tubes; the straight liquid headers communicate with the other end of each of the n condensing tubes; the condensing tube components are arranged around the horizontal axis of the circular ring-shaped chamber body so that all axes of the n condensing tubes in each condensing tube component point to the axis of the circular ring-shaped chamber body; the straight steam headers in the condensing tube components can communicate with one another through the circular arc-shaped steam headers; the straight liquid headers in the condensing tube components can communicate with one another through the circular arc-shaped liquid headers; the condenser has the advantages of reducing heat resistance, remarkably improving the heat exchange capability, being adaptive to arrangement in an upper space of a horizontal annular chamber, fully utilizing the space of a circular ring-shaped columnar chamber body and realizing high performance and compactness.

The invention provides a cooling fluid type magnetic fluid sealing device with heat conducting fins being embedded and belongs to the field of sealing of mechanical engineering. The cooling fluid type magnetic fluid sealing device with the heat conducting fins being embedded successively solves the problems that by the adoption of an existing magnetic fluid sealing device, when the linear speed reaches over 20 m/s, magnetic fluid in sealing gaps emits a large amount of heat, the service life is shortened, and even the existing magnetic fluid sealing device is ineffective. The cooling fluid type magnetic fluid sealing device with the heat conducting fins being embedded is composed of a magnetic fluid sealing assembly, the heat conducting fins (16), a cooling system and connectors (25). The heat conducting fins (16) adhere into all toothed grooves through a sealant, the inner circles of the heat conducting fins (16) are flush with corresponding pole teeth, the outer diameter of each heat conducting fin is smaller than the inner diameter of the corresponding tooth groove, and therefore an annular water trough is formed between each heat conducting fin and a corresponding pole shoe. Each water trough is provided with two channels used for circulation of cooling fluid.

A LED light bar includes several LED light sources and a bar light source mounting base. The light source mounting base is made of an insulating and heat-conducting material. An electrical layer having several metal electricity-conducting plates is embedded in an inner part of the light source mounting base. The LED light sources are welded on the metal electricity-conducting plates to form an electrical electricity-conducting circuit. lighting sides of the LED light sources are exposed on a surface of the light source mounting base. The light source mounting base and the metal electricity-conducting plates are formed into a whole. Each LED light source is covered by lenses.

The invention discloses a backlight module and a liquid crystal display device comprising the same. The backlight module comprises a light guide plate, a lamp strip and an outer frame, and the lamp strip is optically coupled with the light guide plate, and is mounted onto the outer frame from the inner side. As the lamp strip is mounted on the outer frame of the backlight module, the lamp strip and external air can be in heat exchange to dissipate heat via the outer frame directly. As the lamp strip is directly arranged on the outer frame, a heat conduction path is greatly reduced, heat generated by the lamp strip can be timely dissipated via the outer frame, the temperature in the backlight module is reduced, stability of components in the backlight module is improved, the service lives of the components in the backlight module are prolonged, and the problem that the stability of a liquid crystal panel is affected due to over high temperature is avoided.

The invention discloses a high-thermal-conductivity polyimide film prepared from a core-shell structure heat-conducting filler and a preparation method of the film. The heat-conducting filler is of acore-shell structure. The film comprises, by mass, 10-50 parts of the heat-conducting filler, 1-5 parts of a modifier and 80-500 parts of a polyamide acid solution. The heat-conducting filler is a boron nitride coated aluminum oxide core-shell heat-conducting filler. The core-shell heat-conducting filler is prepared by treating aluminum oxide by using the modifier and calcining boron nitride at high temperature through an electrostatic self-assembling method. The core-shell heat-conducting filler is added into the polyamide acid solution, stirred and uniformly mixed and subjected to standing to be defoamed in vacuum, the filler is laid to form a film, programmable heating is conducted for imidization, and the high-thermal-conductivity polyimide film is prepared. The film has the main characteristics of high heat conductivity coefficient and electric insulation, the processing cost is low, the preparation process is simple, the forming period is short, and the film has wide applicationprospects in the fields of electronics, aerospace and machinery.

Disclosed is a wiring board which comprises: conducting plates (21, 22, 121, 122, 131, 132, 141, 142, 151, 152, 161, 162, 171, 172, 181, 182, 191, 192, 201, 202, 211, 212, 221, 222, 231, 232) including electrode parts (21a, 22a, 139b, 139c, 139d) which are connected to semiconductor elements (11, 311, 312) for power conversion, and wiring parts (21b, 22b, 131b, 132b, 139a); liquid cooling pipes (31, 32) which are disposed in the region of the conducting plates and are supplied with a liquid (33) for internal cooling; and an insulating resin material (51) which is disposed at least between the conducting plates and the liquid cooling pipes.

The invention discloses a rapid vulcanization die for a building lamination shock insulation rubber bearing. The rapid vulcanization die comprises an inner heating die with a heat conduction strip, an outer heating die with a heat conduction strip, an excessive glue groove, heat conduction strips, an upper heating template, a lower heating template, a positioning shaft, a positioning hole and a positioning shaft mounting groove, wherein the lower heating template is mounted on a support, the outer heating die with the heat conduction strip is arranged on the upper surface of the lower heating template, the inner heating die with the heat conduction strip is arranged in the center of the outer heating die with the heat conduction strip, the height of the outer heating die with the heat conduction strip is equal to that of the inner heating die with the heat conduction strip, and the upper heating template is arranged at the tops of the outer heating die with the heat conduction strip and the inner heating die with the heat conduction strip. The rapid vulcanization die fully utilizes the structural principle of vulcanization equipment and a vulcanization target to realize rapid and uniform vulcanization and efficient mounting, is applicable to vulcanization processing of various rubber bearings, such as a standard rubber bearing, a pencil lead rubber bearing, a high damping rubber bearing and a stacked rubber bearing, and is high in vulcanization efficiency and rapid and convenient to mount and maintain.

The invention relates to a profile geothermal floor, and belongs to the technical field of building decorative materials. The profile geothermal floor comprises a profile floor body, and is characterized in that: a plurality of through holes passing through the profile floor body are formed inside the profile floor body, and are parallel with one another; and strip-shaped heat-conducting media extending along the length direction of the through holes are arranged inside the plurality of through holes. Preferably, the heat-conducting media are hollow tubular aluminum profiles; and strip electrothermal elements are arranged inside the heat-conducting media of the geothermal floor, and are connected in parallel or in series one another and connected to a main power supply and a temperature control system to realize the aim of heating. The profile geothermal floor organically combines the whole geothermal system and the floor, and is convenient to assemble and maintain.

The invention relates to the technical field of lamps, and discloses a waterproof LED buried lamp structure. The waterproof LED buried lamp structure comprises a lamp shell and an end cover, wherein the upper end of the lamp shell extends outwards to form a flange, the inner side of the upper end of the lamp shell extends inwards to form retainer rings, a light-transmitting glass sheet, supportingcups and ceramic substrates are sequentially arranged in the lamp shell from top to bottom, an annular upper groove is formed in the periphery of the top surface of the light-transmitting glass sheet, convex rings are arranged on the lower sides of the inner rings of the retainer rings, sealing fillers are arranged between the groove and the convex rings, pressure springs are arranged between theceramic substrates and the end cover, and the end cover is in threaded connection with the lower end of the lamp shell; reflecting plates are arranged inside supporting cups at the top surfaces of the ceramic substrates, a plurality of reflecting cups are arranged on the reflecting plates, LED lamp beads are arranged in each reflecting cup, and a circuit board is arranged on the bottom surfaces of the ceramic substrates. The waterproof LED buried lamp structure has the advantages of being good in waterproof performance and long in service life.

The invention discloses a bracket for a core module. In particular, the bracket comprises a frame main body, wherein a through hole is formed in the frame main body; a heat sink is arranged inside theframe main body; a core heat dissipation region exposed via the through hole is formed on the heat sink; the bottom of the frame main body is also provided with heat dissipation slots with slot widthextending to both sides of the heat sink; the heat sink is communicated into the heat dissipation slots and extends to the inner walls of the heat dissipation slots to form a radiation rib covering the whole heat dissipation slots; and the frame body is also provided with polar earholes around the through hole. The invention also discloses a solid-state battery module structure using the bracketfor the core module. The bracket has the advantages of excellent core heating and cooling effects, uniform thermal field of the battery module, convenience in assembly, and easy assembly of the solid-state battery module.

The invention provides a lithium ion battery, which comprises a shell, a cover plate, an electrolyte and a pole piece. A first lug and a second lug are led out from the pole piece; the pole piece is connected with two short circuit protection components, and each short circuit protection component comprises a conductive layer in the middle and insulating layers on both sides of the conductive layer; and one end of the conductive layer of one short circuit protection component is electrically connected with the first lug of the pole piece, and one end of the conductive layer of the other short circuit protection component is electrically connected with the second lug of the pole piece. According to the lithium ion battery provided by the invention, the short circuit protection components arranged on the pole piece in the battery can initiatively convert complex short circuit inside the battery into large-area short circuit between positive / negative current collectors when the battery generates abnormal deformation under external force, so as to reduce internal short circuit heat in the battery to the minimum and shorten the heat conduction path; therefore, heat production rate of the battery lowers down, and heat dissipation time of the battery is increased, and safety and reliability of the battery in harsh usage conditions is enhanced.

The invention discloses a heat dissipation structure of a motor. Heat-conducting glue is injected between the outer surface of the coil and the casing to directly transfer the heat of the coil to the casing, thereby shortening the heat conduction path and improving the heat dissipation effect of the motor. Resin glue prevents the coil from vibrating during motor operation and reduces motor noise.

The invention relates to a device for realizing LED (Light Emitting Diode) encapsulation, which comprises an LED chip, a radiator and an electric connecting piece, wherein one end of the radiator is a big end; the other end of the radiator is a small end; a reentrant light source chamber is axially arranged on the end face of the big end of the radiator; an insulating layer with a groove being arranged in the center is arranged in the light source chamber, and is fit with the bottom wall of the light source chamber; the LED chip is fixed in the groove of the insulating layer; one side, used for fixing the LED chip, of the insulating layer is provided with a lens and forms sealing; an inner stopping opening is arranged on the opening end of the light source chamber, is provided with a light emitting cover assembly and forms sealing; an electric room is axially arranged on the end face of the small end of the radiator; a wire passing hole is arranged between the electric room and the light source chamber; the electric connecting piece is arranged in the electric room; and the wire of the electric connecting piece passes the wire passing hole and is connected with the insulating layer in the light source chamber. According to the device, heat dispersion performance is good, a lighting effect is high, service life is long, production cost is saved, assembly is convenient during the production of lamps, production process is simplified, and batch production is facilitated.

The invention discloses a wireless charging receiving terminal, which is used for solving the problem that the thermal resistance of the interface between the double-sided glue, the magnetic conductive module and the substrate in wireless charging receiving terminal in the prior art is large, thereby affecting the heat dissipation of the whole module. The wireless charging receiving end comprisesa magnetic permeability module, a coil and a substrate, wherein, one end of the coil is arranged on the substrate; the magnetic conductive module has a magnetic conductive substrate, and a protrusionprotruded from the middle of the magnetic conductive substrate, the magnetic conductive substrate has a coil curing region surrounding the protrusion; the coil curing region is bonded and fixed in theother end, opposite to the substrate, of the coil; the protrusion extends into the middle of the coil and is adhered and fixed on the substrate.

The invention discloses an IGBT module for an electric automobile, and the IGBT module comprises a radiator; a substrate is fixed at one layer of the top of the radiator, a housing is fixed at the topof the substrate, a groove is disposed at the top of the substrate in the housing, a DBC is disposed in the groove, a chip is disposed at the top of the DBC and welded with the DBC through a weldinglayer, and the top surface of the DBC is electrically connected with the chip through a bonding wire. The surface of the top copper layer of the DBC is further connected with an electrode terminal, the electrode terminal is embedded in the shell, one end of the electrode terminal extends out of the inner wall of the shell and is electrically connected with the DBC in an ultrasonic welding mode, the other end of the electrode terminal extends out of the top of the shell, and a gap in the shell is encapsulated with silica gel. According to the invention, the problem of product reliability causedby overlong internal heat dissipation path of the product and thermal fatigue between internal materials in the prior art is solved.

Provided are a heat dissipation structure for a display panel, and a manufacturing method and an application thereof. The heat dissipation structure includes a copper foil layer and a heat conducting layer disposed on the copper foil layer; wherein a material of the heat conducting layer includes a heat conducting material having a three-dimensional structure, and a gap in the three-dimensional structure of the heat conducting material is filled with a buffer.