58results about How to "Shorten the heat conduction path" patented technology

The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.

The invention relates to a loop heat tube condenser applicable to arrangement in a circular ring-shaped chamber body. The condenser comprises a plurality of condensing tube components, circular arc-shaped steam headers and circular arc-shaped liquid headers; each condensing tube component comprises n condensing tubes, one straight steam header and one straight liquid header; the n condensing tubes are equal in length and are arranged in parallel; the straight steam headers communicate with one end of each of the n condensing tubes; the straight liquid headers communicate with the other end of each of the n condensing tubes; the condensing tube components are arranged around the horizontal axis of the circular ring-shaped chamber body so that all axes of the n condensing tubes in each condensing tube component point to the axis of the circular ring-shaped chamber body; the straight steam headers in the condensing tube components can communicate with one another through the circular arc-shaped steam headers; the straight liquid headers in the condensing tube components can communicate with one another through the circular arc-shaped liquid headers; the condenser has the advantages of reducing heat resistance, remarkably improving the heat exchange capability, being adaptive to arrangement in an upper space of a horizontal annular chamber, fully utilizing the space of a circular ring-shaped columnar chamber body and realizing high performance and compactness.

The invention provides a cooling fluid type magnetic fluid sealing device with heat conducting fins being embedded and belongs to the field of sealing of mechanical engineering. The cooling fluid type magnetic fluid sealing device with the heat conducting fins being embedded successively solves the problems that by the adoption of an existing magnetic fluid sealing device, when the linear speed reaches over 20 m / s, magnetic fluid in sealing gaps emits a large amount of heat, the service life is shortened, and even the existing magnetic fluid sealing device is ineffective. The cooling fluid type magnetic fluid sealing device with the heat conducting fins being embedded is composed of a magnetic fluid sealing assembly, the heat conducting fins (16), a cooling system and connectors (25). The heat conducting fins (16) adhere into all toothed grooves through a sealant, the inner circles of the heat conducting fins (16) are flush with corresponding pole teeth, the outer diameter of each heat conducting fin is smaller than the inner diameter of the corresponding tooth groove, and therefore an annular water trough is formed between each heat conducting fin and a corresponding pole shoe. Each water trough is provided with two channels used for circulation of cooling fluid.

The invention relates to an electric heating floor and a paving method thereof, belonging to the technical field of building decorative materials. The electric heating floor comprises a floor body, wherein the floor body is internally provided with a plurality of through holes penetrating through two ends of the floor body, the through holes are parallel mutually, each through hole is internally provided with a strip electric heating element extending along the length direction of the through holes, the outer surface of the electric heating element is in contact with the inner wall of the through hole, and the electric heating elements in the through holes are mutually connected in series or in parallel. The invention has the advantages of short heat conduction path and higher heat conduction efficiency, and solves the problems of longer heat conduction path, lower heat conduction efficiency, difficulty of rapidly transmitting the heat to the floor surface, and the like; and the heat can be rapidly transmitted to the floor surface.

A LED light bar includes several LED light sources and a bar light source mounting base. The light source mounting base is made of an insulating and heat-conducting material. An electrical layer having several metal electricity-conducting plates is embedded in an inner part of the light source mounting base. The LED light sources are welded on the metal electricity-conducting plates to form an electrical electricity-conducting circuit. lighting sides of the LED light sources are exposed on a surface of the light source mounting base. The light source mounting base and the metal electricity-conducting plates are formed into a whole. Each LED light source is covered by lenses.

The invention discloses a backlight module and a liquid crystal display device comprising the same. The backlight module comprises a light guide plate, a lamp strip and an outer frame, and the lamp strip is optically coupled with the light guide plate, and is mounted onto the outer frame from the inner side. As the lamp strip is mounted on the outer frame of the backlight module, the lamp strip and external air can be in heat exchange to dissipate heat via the outer frame directly. As the lamp strip is directly arranged on the outer frame, a heat conduction path is greatly reduced, heat generated by the lamp strip can be timely dissipated via the outer frame, the temperature in the backlight module is reduced, stability of components in the backlight module is improved, the service lives of the components in the backlight module are prolonged, and the problem that the stability of a liquid crystal panel is affected due to over high temperature is avoided.

The invention discloses a high-thermal-conductivity polyimide film prepared from a core-shell structure heat-conducting filler and a preparation method of the film. The heat-conducting filler is of acore-shell structure. The film comprises, by mass, 10-50 parts of the heat-conducting filler, 1-5 parts of a modifier and 80-500 parts of a polyamide acid solution. The heat-conducting filler is a boron nitride coated aluminum oxide core-shell heat-conducting filler. The core-shell heat-conducting filler is prepared by treating aluminum oxide by using the modifier and calcining boron nitride at high temperature through an electrostatic self-assembling method. The core-shell heat-conducting filler is added into the polyamide acid solution, stirred and uniformly mixed and subjected to standing to be defoamed in vacuum, the filler is laid to form a film, programmable heating is conducted for imidization, and the high-thermal-conductivity polyimide film is prepared. The film has the main characteristics of high heat conductivity coefficient and electric insulation, the processing cost is low, the preparation process is simple, the forming period is short, and the film has wide applicationprospects in the fields of electronics, aerospace and machinery.

Disclosed is a wiring board which comprises: conducting plates (21, 22, 121, 122, 131, 132, 141, 142, 151, 152, 161, 162, 171, 172, 181, 182, 191, 192, 201, 202, 211, 212, 221, 222, 231, 232) including electrode parts (21a, 22a, 139b, 139c, 139d) which are connected to semiconductor elements (11, 311, 312) for power conversion, and wiring parts (21b, 22b, 131b, 132b, 139a); liquid cooling pipes (31, 32) which are disposed in the region of the conducting plates and are supplied with a liquid (33) for internal cooling; and an insulating resin material (51) which is disposed at least between the conducting plates and the liquid cooling pipes.

A set (10) for dispensing liquefied gas from a vessel (100) comprises a supporting structure (1), a pump (2) and a conditioning system (4). The supporting structure is designed for maintaining both the pump and the conditioning system inside the vessel when the set is in an operation condition for dispensing a flow of liquefied gas. The set allows easy handling, simple fitting to the vessel and easy removal from the vessel because a main part of said set can be handled as a one-block element.

The invention provides a lithium ion battery, which comprises a shell, a cover plate, an electrolyte and a pole piece. A first lug and a second lug are led out from the pole piece; the pole piece is connected with a short circuit protection component, and the short circuit protection component has a three-layer structure and comprise a conductive layer in the middle and insulating layers on both sides of the conductive layer; one end of the conductive layer is electrically connected with the first lug of the pole piece, and the other end is a free end; and the outermost ring current collector is the one where the second lug is in. According to the lithium ion battery provided by the invention, the short circuit protection component arranged on the pole piece in the battery can initiatively convert complex short circuit inside the battery into large-area short circuit between positive / negative current collectors when the battery generates abnormal deformation under external force, so as to reduce internal short circuit heat in the battery to the minimum and shorten the heat conduction path; therefore, heat production rate of the battery lowers down, heat dissipation time of the battery is increased, and safety and reliability of the battery in harsh usage conditions are enhanced.

The invention discloses a rapid vulcanization die for a building lamination shock insulation rubber bearing. The rapid vulcanization die comprises an inner heating die with a heat conduction strip, an outer heating die with a heat conduction strip, an excessive glue groove, heat conduction strips, an upper heating template, a lower heating template, a positioning shaft, a positioning hole and a positioning shaft mounting groove, wherein the lower heating template is mounted on a support, the outer heating die with the heat conduction strip is arranged on the upper surface of the lower heating template, the inner heating die with the heat conduction strip is arranged in the center of the outer heating die with the heat conduction strip, the height of the outer heating die with the heat conduction strip is equal to that of the inner heating die with the heat conduction strip, and the upper heating template is arranged at the tops of the outer heating die with the heat conduction strip and the inner heating die with the heat conduction strip. The rapid vulcanization die fully utilizes the structural principle of vulcanization equipment and a vulcanization target to realize rapid and uniform vulcanization and efficient mounting, is applicable to vulcanization processing of various rubber bearings, such as a standard rubber bearing, a pencil lead rubber bearing, a high damping rubber bearing and a stacked rubber bearing, and is high in vulcanization efficiency and rapid and convenient to mount and maintain.

The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.

The invention relates to an aluminum-based copper-clad plate and a manufacturing method thereof. The aluminum-based copper-clad plate in order comprises a copper foil layer, a heat conduction insulating layer, a first aluminum oxide layer, a pure aluminum layer and a second aluminum oxide layer, wherein a protruding structure is arranged at the surface, which is contacted with the heat conduction insulating layer, of the first aluminum oxide layer. An oxidized protruding structure is formed at the surface of the aluminum substrate in the aluminum-based copper-clad plate, of which the thermal conductivity is far larger than that of the heat conductivity insulating layer. By arranging the protruding structure, the distance between the copper foil layer and the aluminum substrate is shortened, the contact area is enlarged, and thus, the heat resistance is lowered efficiently. In the meantime, the protruding structure on the aluminum oxide layer has excellent natural insulation and jointly provides excellent insulation for the electronic circuit board with the heat conduction insulating layer. Under the same requirements for insulation, the heat resistance is lowered largely, and thus, the power electronic devices have longer service life and higher reliability.

The invention relates to a profile geothermal floor, and belongs to the technical field of building decorative materials. The profile geothermal floor comprises a profile floor body, and is characterized in that: a plurality of through holes passing through the profile floor body are formed inside the profile floor body, and are parallel with one another; and strip-shaped heat-conducting media extending along the length direction of the through holes are arranged inside the plurality of through holes. Preferably, the heat-conducting media are hollow tubular aluminum profiles; and strip electrothermal elements are arranged inside the heat-conducting media of the geothermal floor, and are connected in parallel or in series one another and connected to a main power supply and a temperature control system to realize the aim of heating. The profile geothermal floor organically combines the whole geothermal system and the floor, and is convenient to assemble and maintain.

The invention relates to the technical field of lamps, and discloses a waterproof LED buried lamp structure. The waterproof LED buried lamp structure comprises a lamp shell and an end cover, wherein the upper end of the lamp shell extends outwards to form a flange, the inner side of the upper end of the lamp shell extends inwards to form retainer rings, a light-transmitting glass sheet, supportingcups and ceramic substrates are sequentially arranged in the lamp shell from top to bottom, an annular upper groove is formed in the periphery of the top surface of the light-transmitting glass sheet, convex rings are arranged on the lower sides of the inner rings of the retainer rings, sealing fillers are arranged between the groove and the convex rings, pressure springs are arranged between theceramic substrates and the end cover, and the end cover is in threaded connection with the lower end of the lamp shell; reflecting plates are arranged inside supporting cups at the top surfaces of the ceramic substrates, a plurality of reflecting cups are arranged on the reflecting plates, LED lamp beads are arranged in each reflecting cup, and a circuit board is arranged on the bottom surfaces of the ceramic substrates. The waterproof LED buried lamp structure has the advantages of being good in waterproof performance and long in service life.

The invention provides a color wheel assembly and a projection device. The color wheel assembly comprises a color wheel, a color wheel substrate used for fixing the color wheel, and a drive device which is used for driving the rotation of the color wheel substrate. Heat sinks are arranged on the outer edge of the color wheel substrate. The heat sinks project on the side surface of the color wheel substrate. The color wheel substrate and the color wheel are circular. An annular fluorescent zone is arranged on the surface of the color wheel. The diameter of the color wheel substrate matches the outer edge diameter of the fluorescent zone of the color wheel. According to the invention, a number of heat sinks are arranged on the side surface of the color wheel substrate, which shortens the heat conduction path between the heat generating zone of the color wheel and the heat sinks and increases the heat exchange area between the color wheel and air; the heat sinks and the axial direction of the color wheel form a certain angle; the color wheel assembly can acquire stable axial air convection; and the heat sinks are arranged in an airfoil structure as a whole, which further increases the heat dissipation face and air convection, and plays a good role of noise reduction.

The invention discloses a bracket for a core module. In particular, the bracket comprises a frame main body, wherein a through hole is formed in the frame main body; a heat sink is arranged inside theframe main body; a core heat dissipation region exposed via the through hole is formed on the heat sink; the bottom of the frame main body is also provided with heat dissipation slots with slot widthextending to both sides of the heat sink; the heat sink is communicated into the heat dissipation slots and extends to the inner walls of the heat dissipation slots to form a radiation rib covering the whole heat dissipation slots; and the frame body is also provided with polar earholes around the through hole. The invention also discloses a solid-state battery module structure using the bracketfor the core module. The bracket has the advantages of excellent core heating and cooling effects, uniform thermal field of the battery module, convenience in assembly, and easy assembly of the solid-state battery module.

The invention provides a lithium ion battery, which comprises a shell, a cover plate, an electrolyte and a pole piece. A first lug and a second lug are led out from the pole piece; the pole piece is connected with two short circuit protection components, and each short circuit protection component comprises a conductive layer in the middle and insulating layers on both sides of the conductive layer; and one end of the conductive layer of one short circuit protection component is electrically connected with the first lug of the pole piece, and one end of the conductive layer of the other short circuit protection component is electrically connected with the second lug of the pole piece. According to the lithium ion battery provided by the invention, the short circuit protection components arranged on the pole piece in the battery can initiatively convert complex short circuit inside the battery into large-area short circuit between positive / negative current collectors when the battery generates abnormal deformation under external force, so as to reduce internal short circuit heat in the battery to the minimum and shorten the heat conduction path; therefore, heat production rate of the battery lowers down, and heat dissipation time of the battery is increased, and safety and reliability of the battery in harsh usage conditions is enhanced.

The invention provides a flat package crimping type extraction electrode insulated gate bipolar transistor element. The flat package crimping type extraction electrode insulated gate bipolar transistor element comprises an IGBT chip. The flat package crimping type extraction electrode insulated gate bipolar transistor element further comprises a chip mode carrier and a housing made from ceramic. The housing is provided with a chip installation hole in the vertical direction. The chip mode carrier is provided with a chip clamping groove. The IGBT chip is fixed in the chip clamping groove in the chip mode carrier. The chip mode carrier is fixed in the chip installation hole at the middle portion. An upper extraction electrode plate used as the IGBT emitter is arranged above the chip mode carrier. The upper extraction electrode is made from a metal material. The upper extraction electrode plate is installed in the chip installation hole at the upper portion. The lower end surface of the upper extraction electrode plate is attached to the circuit port of the emitter on the IGBT chip. The objective of the invention is to provide a flat package crimping type extraction electrode insulated gate bipolar transistor element having advantages of small size, compact structure, good heat dissipation performance, long service life, low failure occurrence rate, high reliability and convenient utilization.

The invention aims at providing a heat dissipation structure, with simple structure and good heat dissipation effect, of a transmitter. The heat dissipation structure comprises an integrated circuit board, wherein a power amplifier, a radio frequency chip and a power chip are arranged on the front of the integrated circuit board; metal foil is paved on the back of the integrated circuit board; pores through which bottoms of the power amplifier, the radio frequency chip and the power chip communicate with the metal foil are respectively formed in the integrated circuit board; each pore is filled with heat-conductive adhesives; and an aluminum heat sink is fixed on the back of the integrated circuit board by a connecting piece, and tightly attached to the metal foil.

The invention provides a heat dissipation structure for a display panel and a preparation method and application of the heat dissipation structure. The heat dissipation structure comprises a copper foil layer and a heat conduction layer arranged on the copper foil layer, wherein the heat conduction layer is made of a heat conduction material with a three-dimensional structure, and gaps in the three-dimensional structure of the heat conduction material are filled with a buffering agent; a graphite layer with a lamellar structure and transverse heat conduction is replaced with the heat conduction layer with three-dimensional heat conduction; more thermal diffusion channels are established; the heat of the display panel can be quickly conducted along various paths and directly transmitted tothe copper foil layer, so that the heat conduction path is greatly shortened, and when part of longitudinal heat transfer channels are damaged, the heat can quickly find proper channels in the plane and then is longitudinally conducted; the heat conduction path is shortened, and the heat dissipation effect is improved.

The invention discloses a heat dissipation structure of a motor. Heat-conducting glue is injected between the outer surface of the coil and the casing to directly transfer the heat of the coil to the casing, thereby shortening the heat conduction path and improving the heat dissipation effect of the motor. Resin glue prevents the coil from vibrating during motor operation and reduces motor noise.

The invention relates to a device for realizing LED (Light Emitting Diode) encapsulation, which comprises an LED chip, a radiator and an electric connecting piece, wherein one end of the radiator is a big end; the other end of the radiator is a small end; a reentrant light source chamber is axially arranged on the end face of the big end of the radiator; an insulating layer with a groove being arranged in the center is arranged in the light source chamber, and is fit with the bottom wall of the light source chamber; the LED chip is fixed in the groove of the insulating layer; one side, used for fixing the LED chip, of the insulating layer is provided with a lens and forms sealing; an inner stopping opening is arranged on the opening end of the light source chamber, is provided with a light emitting cover assembly and forms sealing; an electric room is axially arranged on the end face of the small end of the radiator; a wire passing hole is arranged between the electric room and the light source chamber; the electric connecting piece is arranged in the electric room; and the wire of the electric connecting piece passes the wire passing hole and is connected with the insulating layer in the light source chamber. According to the device, heat dispersion performance is good, a lighting effect is high, service life is long, production cost is saved, assembly is convenient during the production of lamps, production process is simplified, and batch production is facilitated.

The invention discloses a method for manufacturing a light-emitting diode lamp. The method comprises the following steps of: providing at least one panel heat pipe, and forming one flat surface on each panel heat pipe; and providing a jig for fixing the panel heat pipes; forming a printed circuit layer. wherein the printed circuit layer can be divided into an insulation layer, an electric conduction layer and a solder mask layer; coating on the panel heat pipes sequentially; coating solder paste on the welding parts and placing a plurality of light-emitting diodes on the welding parts of the panel heat pipes; and allowing the panel heat pipes and the light-emitting diodes to pass through a reflow oven to produce the light-emitting diode lamp. The panel heat pipes can be further provided with a plurality of positioning holes which are used for positioning the jig and are matched with a simple assembly component to fix at least one heat dissipation fin module, so that the heat dissipation efficiency is improved, the manufacturing cost is saved and the occupied space is reduced.

The invention relates to a highly thermal-conductive aluminum-based copper-clad plate. Three layers of glue are arranged between a copper foil and an aluminum plate, namely a copper foil, a first layer of glue, a second layer of glue, a third layer of glue and the aluminum plate are arranged, wherein the content of a filler in the second layer of glue is greater than that of a filler in the first layer of glue or the third layer of glue; the grain size of the filler in the second layer of glue is greater than that of the filler in the first layer of glue or the third layer of glue. The three layers of glue are skillfully combined together; the advantages of the three layers of glue are fully displayed; the aluminum-based copper-clad plate manufactured by using the method not only has ultrahigh thermal conductivity but also has high peeling strength and excellent thermal stress and voltage resistance.

The invention discloses a wireless charging receiving terminal, which is used for solving the problem that the thermal resistance of the interface between the double-sided glue, the magnetic conductive module and the substrate in wireless charging receiving terminal in the prior art is large, thereby affecting the heat dissipation of the whole module. The wireless charging receiving end comprisesa magnetic permeability module, a coil and a substrate, wherein, one end of the coil is arranged on the substrate; the magnetic conductive module has a magnetic conductive substrate, and a protrusionprotruded from the middle of the magnetic conductive substrate, the magnetic conductive substrate has a coil curing region surrounding the protrusion; the coil curing region is bonded and fixed in theother end, opposite to the substrate, of the coil; the protrusion extends into the middle of the coil and is adhered and fixed on the substrate.

The invention provides a fast-acting high-current controlled fuse, which comprises a heating device and a flow device. The flow device comprises two mutually-separated electrode pins, and one or morefirst fuse devices connected between the two electrode pins. The first fuse device has a first acting temperature. The first fuse device is arranged close to the heating device and is insulated from the heating device. Since the fuse device in the flow device is close to the heating device, heat conduction path is shortened and power loss caused by heat diffusion is reduced; when the system detects fault and starts heating, a cut-off instruction can be carried out quickly; due to a self overtemperature protection function, thermal runaway of a heating sheet is prevented; and a remote signalingfunction is added to provide a remote signaling signal to notify the system that the cut-off instruction is carried out.

An LED illuminator module with high heat-dissipating efficiency and manufacturing method therefore is provided. The LED illuminator module includes a flat heat pipe (FHP) formed with a flat surface, an insulated layer formed on the plane of the flat heat pipe, a conducting layer having a pair of conducting electrode portions, a plurality of LEDs, and an encapsulation covers the LEDs. The insulation layer has a pair of insulated electrode portions and a plurality of LED-setting portions. The conducting electrode portions partially covered on the insulated electrode portions. The LEDs are disposed on the LED-setting portions and electrically connect to the pair of conducting electrode portions respectively. The encapsulation contains phosphor powder therein. The present invention solves the heat-dissipating problem of high-efficiency light module with the LEDs, and shorten heat-conductive path to enhance heat-dissipating efficiency.

The invention discloses an IGBT module for an electric automobile, and the IGBT module comprises a radiator; a substrate is fixed at one layer of the top of the radiator, a housing is fixed at the topof the substrate, a groove is disposed at the top of the substrate in the housing, a DBC is disposed in the groove, a chip is disposed at the top of the DBC and welded with the DBC through a weldinglayer, and the top surface of the DBC is electrically connected with the chip through a bonding wire. The surface of the top copper layer of the DBC is further connected with an electrode terminal, the electrode terminal is embedded in the shell, one end of the electrode terminal extends out of the inner wall of the shell and is electrically connected with the DBC in an ultrasonic welding mode, the other end of the electrode terminal extends out of the top of the shell, and a gap in the shell is encapsulated with silica gel. According to the invention, the problem of product reliability causedby overlong internal heat dissipation path of the product and thermal fatigue between internal materials in the prior art is solved.