The invention provides gluing equipment for electronic components. The gluing equipment comprises a fixing frame, a transverse plate, a shifting piece, a height adjusting mechanism, an eccentric wheel, a wind wheel, a rolling shaft, a fixing mechanism, a heat dissipation plate and a glue
nozzle, wherein the transverse plate is arranged inside the fixing frame, the shifting piece is arranged in thetransverse plate, the rolling shaft is arranged inside the shifting piece, the eccentric wheel is arranged outside the rolling shaft, the wind wheel is arranged outside the rolling shaft, the heightadjusting mechanism is arranged on the right side of the fixing frame, the heat dissipation plate is arranged at the top of the shifting piece, the fixing mechanism is arranged on the right side of the heat dissipation plate, a heating
pipe is arranged inside the glue
nozzle, a heating rod is arranged inside a water tank, and a water pump is arranged at the bottom of a water outlet
pipe. Comparedwith the prior art, the gluing equipment has the beneficial effects that the bottom of a circuit board is subjected to heat dissipation by means of the heat dissipation plate,
sealant on the circuit board can be rapidly cooled and fixed, and therefore, the curing efficiency of the
sealant is improved; and by arranging a vibration mechanism, the
sealant on the heat dissipation plate can be rapidlydispersed and rapidly flows into a groove in the circuit board, and therefore, the sealing effect of the circuit board is better.