Gluing equipment for electronic components

Abstract

The invention provides gluing equipment for electronic components. The gluing equipment comprises a fixing frame, a transverse plate, a shifting piece, a height adjusting mechanism, an eccentric wheel, a wind wheel, a rolling shaft, a fixing mechanism, a heat dissipation plate and a glue nozzle, wherein the transverse plate is arranged inside the fixing frame, the shifting piece is arranged in thetransverse plate, the rolling shaft is arranged inside the shifting piece, the eccentric wheel is arranged outside the rolling shaft, the wind wheel is arranged outside the rolling shaft, the heightadjusting mechanism is arranged on the right side of the fixing frame, the heat dissipation plate is arranged at the top of the shifting piece, the fixing mechanism is arranged on the right side of the heat dissipation plate, a heating pipe is arranged inside the glue nozzle, a heating rod is arranged inside a water tank, and a water pump is arranged at the bottom of a water outlet pipe. Comparedwith the prior art, the gluing equipment has the beneficial effects that the bottom of a circuit board is subjected to heat dissipation by means of the heat dissipation plate, sealant on the circuit board can be rapidly cooled and fixed, and therefore, the curing efficiency of the sealant is improved; and by arranging a vibration mechanism, the sealant on the heat dissipation plate can be rapidlydispersed and rapidly flows into a groove in the circuit board, and therefore, the sealing effect of the circuit board is better.

Description

technical field [0001] The invention belongs to the field of gluing equipment, in particular to a gluing equipment for electronic components. Background technique [0002] At present, electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors. The general term for sub-devices such as transistors, hairsprings, and springs. Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro-motors , electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piez...

AI Technical Summary

Problems solved by technology

[0003] However, after the existing electronic components are glued, they can only wait for the colloid to cool naturally. When using cold wind to accelerate the solidification of the colloid, because the interior of the colloid cannot dissipate heat in time, it will cause wrinkles on the surface of the colloid, which will affect the sealing effect. During the process of injecting glue on the circuit board , the colloid quickly flows into the depression of the circuit board, and after the injection of the glue, it is easy to have the problem of colloid accumulation and unevenness. Therefore, there is an urgent need for a gluing equipment for electronic components to solve the above problems

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