High-thermal-conductivity polyimide film prepared from core-shell structure heat-conducting filler and preparation method of film

Abstract

The invention discloses a high-thermal-conductivity polyimide film prepared from a core-shell structure heat-conducting filler and a preparation method of the film. The heat-conducting filler is of acore-shell structure. The film comprises, by mass, 10-50 parts of the heat-conducting filler, 1-5 parts of a modifier and 80-500 parts of a polyamide acid solution. The heat-conducting filler is a boron nitride coated aluminum oxide core-shell heat-conducting filler. The core-shell heat-conducting filler is prepared by treating aluminum oxide by using the modifier and calcining boron nitride at high temperature through an electrostatic self-assembling method. The core-shell heat-conducting filler is added into the polyamide acid solution, stirred and uniformly mixed and subjected to standing to be defoamed in vacuum, the filler is laid to form a film, programmable heating is conducted for imidization, and the high-thermal-conductivity polyimide film is prepared. The film has the main characteristics of high heat conductivity coefficient and electric insulation, the processing cost is low, the preparation process is simple, the forming period is short, and the film has wide applicationprospects in the fields of electronics, aerospace and machinery.

Description

Technical field [0001] The invention belongs to the technical field of polyimide films, and specifically relates to a high thermal conductivity polyimide film prepared by a core-shell structure thermally conductive filler and a preparation method thereof. Background technique [0002] With the rapid development of science and technology, especially in the field of electronics, the rising technology is changing with each passing day. Electronic components are developing towards miniaturization and integration, which increases the density of electronic components and causes heat dissipation problems to become increasingly serious, affecting electronic equipment. Efficiency, safety and longevity. Polyimide film is a polymer material with good thermal and mechanical properties, especially it has low dielectric constant and loss tangent, high thermal stability and storage modulus. It is widely used in electronic packaging materials . However, the inherent thermal conductivity of pur...

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Problems solved by technology

Using boron nitride as a thermally conductive filler can build a good thermally conductive network. Although the addition of pure boron nitride can improve the thermal conductivity of the polyimide film, it is obtained by modifying boron nitride in the patent CN 109627472 A Polyimide heat-conducting film, but the proportion of boron nitride added is too large, which will lead to high cost, and no effective heat conduction channel is formed in the matrix of polyimide; the same patent CN106243715 B adopts boron nitride and polyimide Imide microspheres are used to produce polyimide thermally conductive materials, but the process cost is complicated, and polyimide microspheres need to be produced

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